2024-11-13
The Three Main Factors Causing PCB Soldering Defects
随着回流焊技术在PCB板焊接中逐渐崭露头角，焊接质量一直是电子制造商们关注的焦点。在本文中，我们将深入探讨造成…
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Browse blog posts and click on a title to read the full article. Please refer to the project documentation and current materials for specific processes and parameters.
2024-11-12
Methods and Measures for Reducing Fingerprints on PCBs
在PCB（Printed Circuit Board，印刷电路板）制造中，由于大工序十多个，小工序上百个。对于…
2024-11-11
A Discussion of the Specifications and Requirements for the Silkscreen Layer on PCBs
PCB板（Printed Circuit Board，印刷电路板）上的丝印层的功能主要是为了方便电路的安装、维…
2024-11-10
Standards and Test Methods for PCB Warpage
PCB线路板翘曲度是指线路板表面的平整程度。如果线路板不平整，它可能无法准确定位，导致元器件插装时出现偏差，甚…
2024-11-09
Solutions for Burrs in Semi-Metallized Holes on Printed Circuit Boards
在线路板制造过程中，半金属化孔在成型后易产生孔边铜皮翘起、披锋残留等异常，本文将为您揭示半金属化孔异常问题的原…
2024-11-08
What material is aluminum substrate sheet made of?
不同系列的铝基板板材具有各自独特的特性和应用，本文将深入探讨1000系、5000系和6000系铝板的基本特性，…
2024-11-07
Common Issues and Solutions for the Laminating Process of Multilayer Printed Circuit Boards
多层板线路板压合工序存在许多需要研究和讨论的问题，如铜箔起皱、压合层偏、树脂空洞、白边白角、分层起泡、板厚不均…
2024-11-07
Complete List of Electrical Component Symbols
作为一名在线路板厂工作的专业人士，我经常接触到PCB上面的各种符号，这些符号是电子元器件的编号，理解这些电器元…
2024-11-06
131 Essential Guidelines for PCB Layout Design: Design Specifications for Improving Performance and Stability
在电路板设计中，PCB Layout的质量直接影响到产品的性能和稳定性。对于工程师而言，掌握PCB Layou…
2024-11-01
Analysis of PCB Via Breakage and Solutions
在PCB线路板加工制造过程中，会碰到一种PCB孔破状态现象。本文将讨论造成这种PCB孔破的成因和解决方法。 什…
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