How to Choose PCB Vias? From Connection Layers to Manufacturing Processes
First, identify which copper layers need to be connected, then determine the via structure, via filling method, and pad placement. Shenzhen Jingpeng Electronics provides manufacturing reviews for your via design to help align your design with actual manufacturing processes.
What problems do different types of vias solve?
Through-hole
Runs through the entire board, connecting the outer and inner layers. Suitable for standard interlayer interconnects where space permits; unused sections of the via may require evaluation in conjunction with high-speed design considerations.
Blind Holes and Plugged Holes
Blind holes connect the outer layer to the inner layer; buried holes are located between the inner layers and do not penetrate the outer surface. The sequence of machining and lamination should be determined based on the connection layers.
Microporous
Shallow-hole structures, typically created using laser processing, are commonly found in HDI. One cannot determine whether a hole is a microhole based solely on its “small diameter,” nor can the mechanical hole aspect ratio be applied to microholes.
Design Boundaries and Manufacturing Reviews
- Let's start with the link layer.
- From the outer layer to the inner layer, between inner layers, or through the entire board? First, create a clear layer-to-hole mapping table.
- Now let's look at the wiring density
- Component spacing, fan-out space, and pad size determine whether localized HDI is required.
- Confirm the Pad Locations
- In-pad holes are holes located within a pad and are not mutually exclusive from through-holes or microvias.
- Select Hole Protection
- Solder mask, solder resist via plugging, resin via filling, and post-filling copper plating each serve different purposes.
- Cost Assessment
- The number of layers, the number of press cycles, hole filling, flattening, and verification requirements all contribute to the overall cost.
The manufacturing values cited are based on this site’s existing process capabilities. The listed limit values do not imply that all can be achieved simultaneously; the manufacturing plan will be finalized after the complete stack-up, hole layout, and materials have been confirmed.
View Full Manufacturing CapabilitiesBefore requesting a quote, prepare these three sets of documents
Production and Layer Files
Gerber or ODB++ files, drill files, stack-up diagrams, and layer-to-hole mapping tables; ensure that file versions are consistent.
Key Process Requirements
Specify the hole diameter, plating material, copper-clad area, surface treatment, and required tolerances.
Quantity and Inspection Requirements
Please provide the quantity for prototypes and production runs, the desired delivery date, inspection reports, and reliability verification requirements.
Frequently Asked Questions
Are through-holes, micropores, and holes in discs three mutually exclusive types?
No. "Through-hole" and "microvia" describe the hole structure and manufacturing characteristics; "pad-to-hole" describes the positional relationship between the hole and the pad. A single pad-to-hole can have different hole structures.
Is a smaller via always better?
Not necessarily. The aperture size must be matched to the substrate thickness, pads, copper plating, and reliability requirements; one should not simply aim for the smallest possible value.
Submit the via design for engineering review
Shenzhen Jingpeng Electronics | We provide stack-up and via tables to help you assess manufacturability, cost implications, and delivery requirements.
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