Blind-Via PCB Keep the connections on the desired layers
Blind and buried vias free up space for high-density routing, but the connection pairs, stack-up, and lamination path must be confirmed in advance. Shenzhen Jingpeng Electronics evaluates manufacturability based on a complete via table and stack-up.
To understand the process, start by clarifying these key points
Blind hole: outer layer to inner layer
Connect an outer surface to a specified inner layer; the hole does not penetrate the entire board. The hole depth, material, and machining method must be compatible with the target layer.
Buried Via: Inner Layer to Inner Layer
Located inside the finished board. Typically, the corresponding drilling and metallization must be completed at the sub-board stage before lamination continues.
Costs Arise from the Combination of Process Steps
Different layers may require additional steps such as lamination, drilling, plugging, and inspection. Prices cannot be estimated based solely on the number of blind and buried vias.
Design Boundaries and Manufacturing Reviews
- Current HDI Range
- The site's process capabilities are listed as Levels 1–3; applicability must be confirmed based on the specific layer pairs and structure.
- Define layer pairs
- List the connection relationships (e.g., L1–L2, L2–L3) separately; do not use the general term “blind and buried vias” as a substitute for the via table.
- Mechanics and Lasers
- The machining method depends on the hole depth, diameter, and material; not all blind holes are machined using lasers.
- Laminating Plan
- It is necessary to confirm the manufacturing stages for each sub-board and the subsequent interconnections; it should not be assumed that any pair of layers can be combined.
- Cost Optimization
- While ensuring routing and performance requirements are met, prioritize evaluating ways to reduce the number of independent layer pairs and complex laminate structures.
The manufacturing values cited are based on this site’s existing process capabilities. The listed limit values do not imply that all can be achieved simultaneously; the manufacturing plan will be finalized after the complete stack-up, hole layout, and materials have been confirmed.
View Full Manufacturing CapabilitiesBefore requesting a quote, prepare these three sets of documents
Production and Layer Files
Gerber or ODB++ files, drill files, stack-up diagrams, and layer-to-hole mapping tables; ensure that file versions are consistent.
Key Process Requirements
Specify the hole diameter, plating material, copper-clad area, surface treatment, and required tolerances.
Quantity and Inspection Requirements
Please provide the quantity for prototypes and production runs, the desired delivery date, inspection reports, and reliability verification requirements.
Frequently Asked Questions
Once the blind holes have been drilled, can they be reworked from the surface?
Blind holes are located inside the finished board and should be drilled during the appropriate sub-board manufacturing stage. Changes to the interconnect layer may require a redesign of the manufacturing process.
Is a higher HDI rank always better?
Increasing the number of stages typically introduces additional structural and manufacturing constraints; the choice should be based on routing requirements, while ensuring reliability and cost-effectiveness.
Submit the via design for engineering review
Shenzhen Jingpeng Electronics | We provide stack-up and via tables to help you assess manufacturability, cost implications, and delivery requirements.
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