Shengyi Technology PCB Laminates Common Models and Selection Guide
First, distinguish between rigid copper-clad laminates, flexible substrates, and cover films; then select the appropriate grade based on heat resistance, electrical performance, structural requirements, and supply specifications. Shenzhen Jingpeng Electronics will review the manufacturability of the materials and laminate structure based on your design documents.
Common Grades: First, confirm the material category
The following values are typical values from official documentation and do not represent guaranteed values for all thicknesses, structures, and batches. Comparisons of Tg must be made using the same test method; specific procurement and acceptance procedures shall be based on the confirmed version of the data sheet.
High Tg Rigid FR-4
S1000-2M
Tg 180°C (DSC); officially classified as a material with high heat resistance and low CTE. Unlike general-purpose materials with this Tg, lamination and thermal processes must still be verified based on the specific board structure.
Standard Rigid FR-4
S1141
Tg 140°C (DSC). The manufacturer states that this material is not suitable for applications requiring CAF resistance, HDI, or certain thick copper/high-layer-count applications, and should not be selected as a substitute based solely on cost.
Halogen-free Tg materials
S1150G
Tg 155°C (DSC); official documentation lists compatibility with lead-free processes and resistance to CAF. Halogen-free requirements should be confirmed in accordance with the material declaration and project specifications.
High-CTI Rigid Materials
S1600L
The official catalog lists this as CTI600. When selecting a product, pay attention to the tracking resistance requirements and also verify the heat resistance and electrical parameters; a high CTI value does not necessarily indicate high thermal conductivity.
Adhesive-Free Double-Sided Flexible Copper-Clad Laminate
SF202
For use in flexible circuit structures. Further verification is required regarding the relationship between PI and copper foil thickness, copper foil type, cover film, and reinforcement; the actual bending life must be verified based on the complete structure and operating conditions.
Halogen-free, adhesive-coated flexible substrate
SF305
The official soft materials catalog classifies it as an adhesive-backed substrate. The adhesive layer, PI, copper foil, and process combination must be evaluated together; the dynamic bending rating cannot be inferred based on the model number alone.
Halogen-free overcoat film
SF305C
Used for protective coverage of flexible circuits; this product falls under the category of cover films and is not an upgraded copper-clad laminate of the SF305. The thickness of the PI/adhesive layer and the window structure must be specified.
For other specified models (e.g., ST115), please submit the official TDS, complete specifications, and intended application for confirmation; do not infer the thermal conductivity or long-term operating temperature based solely on the model name. Inventory, available specifications, and lead times are subject to project-specific confirmation.
Don't Just Look at Tg: Evaluate All Six Parameters Together
- Heat Resistance and Thermal Expansion
- Evaluate Tg, Td, T260/T288, and Z-axis expansion simultaneously; Tg is not the long-term allowable operating temperature.
- Dielectric Properties
- When comparing Dk/Df, specify the frequency, test method, and material composition; impedance design must also use the actual laminate.
- Trace-Resistant
- CTI is related to the tracking resistance of an insulated surface and cannot replace thermal conductivity or the overall insulation design of the device.
- Structure and Copper Foil
- Confirm the substrate thickness, glass fiber or PI, resin content, copper thickness, and copper foil type.
- Combinations of Flexible Materials
- Distinguish between the substrate, the cover film, the adhesive film, and the reinforcing layer; bending conditions must be evaluated in conjunction with the overall structure.
- Material Declaration
- Clearly specify the requirements for halogen-free materials, restricted substances, flame retardants, and related certifications, and avoid confusing these concepts.
Select a Material Path Based on Project Constraints
Standard Rigidity and Thermal Reliability
First, determine the number of layers, copper thickness, via structure, and soldering process; then compare the applicability limits of candidate grades such as S1141 and S1000-2M.
Halogen-free and High CTI Requirements
Verify the halogen-free declaration and CTI rating separately; they correspond to different selection criteria and should not be grouped under a single “environmental/thermal conductivity” category.
FPC: A Combination of Rigidity and Flexibility
Specify whether the substrate is adhesive-coated or non-adhesive, as well as the cover film and reinforcement, and indicate whether static installation or dynamic bending is required. A material grade designation cannot be used as a substitute for bending verification.
From product selection to production, confirm three milestones
01 · Verify the data table version
Verify the complete part number, suffix, material composition, and applicable data sheet; if there are discrepancies in parameters from different sources or versions, clarify them first.
02 · Reviewing Actual Stacking
Based on the materials, prepregs, copper thickness, via structure, and impedance targets, determine the processing parameters and available specifications.
03 · Substitution of Approval Documents
When making substitutions, compare the heat resistance, electrical properties, mechanical properties, and certification documents item by item. Final production documentation will be prepared after confirmation by the design team.
Submit this information to minimize back-and-forth during the selection process.
Production Documents
Gerber or ODB++, number of layers, board thickness, copper thickness, board outline, and special via structures.
Material and Electrical Requirements
Specify part numbers and suffixes, stack-ups, target impedance, operating frequency bands, and related data sheets.
Delivery and Verification Requirements
Quantity, expected delivery date, welding process, bending specifications, material certificates, and non-substitutable items.
Common Selection Issues
Can the S1000-2M be used as a direct replacement for all FR-4 materials?
You cannot simply substitute a material just because it has a higher Tg. You must verify the laminate structure, electrical performance, pressing process, dimensions, and material certification requirements.
Is the SF305C a performance upgrade of the SF305?
No. The official classification lists SF305 as a flexible adhesive-backed substrate and SF305C as a cover film; the two serve different functions in the structure.
Does a high CTI mean better heat dissipation?
These are not the same metrics. Heat dissipation requirements must be assessed by reviewing thermal conductivity parameters, insulation layers, and the overall board structure; they cannot be determined based on the CTI value alone.
Are these models all in stock?
Available specifications and lead times are subject to confirmation based on thickness, copper foil, quantity, and availability; the model descriptions on this page do not constitute a commitment to real-time inventory availability.
Review the materials, then proceed with prototyping and mass production
Shenzhen Jingpeng Electronics | Submit specified part numbers, stack-up, and design documents to confirm material availability and manufacturing solutions.
