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2026-10-05How Are Ceramic Substrates Manufactured? Dry Pressing, Casting, and Sintering Processes在电路板厂,陶瓷产品的制造技术类型非常多,据说有30多种制造工艺方法,如干压、注浆、挤压、注射、流延方法和等静…阅读全文 →
2026-09-30An Overview of Halogen-Free Requirements for PCBs一、前言 根据IEC61249-2-21的要求,对于无卤素制造线路板规定了所用的电子焊接材料、树脂以及增强性能…阅读全文 →