PCBA Assembly Capabilities From incoming materials to testing, with clear delivery requirements
We cover SMT, through-hole, and mixed-assembly processes, and support both engineering prototypes and volume production projects. We review the BOM, placement coordinates, assembly drawings, and test requirements together to ensure a clear transition between procurement, assembly, and acceptance.
Shenzhen Jingpeng Electronics | PCB Assembly and Project Delivery
Select Assembly and Feeding Methods by Project
SMT and Through-Hole Mixed Assembly
Supports single-sided and double-sided mounting, as well as SMT/through-hole hybrid assembly; rigid, flexible, and rigid-flex boards require review based on board configuration, support, and assembly requirements.
Turnkey vs. Partial Procurement
Component procurement may be conducted on a project-by-project basis, with components supplied by the customer or partially procured. Clearly define brand requirements, complete part numbers, approval procedures for substitute parts, and rules for handling surplus materials.
Prototypes and Mass Production
There is no minimum order quantity for our standard service offerings, which cover engineering prototypes, small-batch production, and mass production; setup fees, purchase quantities, and scheduling are determined on a project-by-project basis.
General Criteria and Scope of Specialized Reviews
The following information is compiled based on this site’s existing assembly specifications. Specifications that fall outside the standard range do not necessarily mean production has been confirmed; they require a specialized review in conjunction with the PCB, components, and manufacturing equipment.
- Panel Dimensions
- Standard: 50 × 30 mm to 460 × 400 mm; smaller or larger sizes require confirmation of panel layout and tooling.
- Sheet Thickness
- Standard: 0.5–4.5 mm; values outside this range require review of the support, transport, and processing conditions.
- BGA Ball Pitch
- The standard minimum is 0.5 mm; pitches between 0.3 mm and 0.5 mm are subject to special review.
- Pin Pitch
- Standard minimum: 0.4 mm; pitches between 0.3 mm and 0.4 mm require special review.
- Small Components
- Standard size: 0.6 × 0.3 mm; the original table also lists 0.3 × 0.2 mm—please verify based on the actual part number and package diagram.
- Component Height
- Standard: ≤6.5 mm; 6.5–15 mm requires review of mounting and assembly conditions.
- Large-size components
- The original table lists dimensions of 200 × 125 mm; for devices of this size and larger, we recommend submitting drawings to confirm the specific assembly method.
- Package Type
- BGA, μBGA, QFN, DFN, SOP, PLCC, PoP, CGA, CSP, and common passive/active components; specific part numbers are subject to confirmation.
Package dimensions are specified in millimeters and as stated in the device datasheet; avoid confusion between imperial and metric units. It cannot be assumed that all limit parameters are met simultaneously.
Material Preparation: A Key Factor in Whether Production Can Begin Smoothly
Acceptable Packaging
Full rolls, partial rolls, cut strips, tubes, and pallets. For tube packaging, we recommend keeping the packaging intact; please confirm the length of cut strips, the number of spares, and any special feeding requirements in advance.
BOM and Material Verification
Provide the part number, quantity, manufacturer, complete part number, and package type; clearly specify non-installed components, substitute parts, and versions; if the customer is supplying parts, a corresponding list must be included.
Specialized Components and Tooling
For fine-pitch BGAs, flexible circuit boards, tall components, and crimped components, confirm storage, assembly, support, and fixture requirements in advance.
Inspection and Testing: Clearly Define What Is Being Verified at Each Step
Pre-Production Review and Visual Inspection
DFM/assembly document verification is used to identify manufacturing and assembly issues; visual inspection and AOI are used to inspect components and visible solder joints according to agreed-upon criteria.
X-ray and Circuit Testing
Hidden solder joints, such as those in BGAs, can be inspected using X-ray; for ICT/electrical testing, it is necessary to verify the test points, coverage, test fixtures, and test procedures.
FCT and Acceptance Requirements
Functional testing requires the provision of test specifications, firmware, power supply and interface conditions, test fixtures, and acceptance criteria. The test items should not be interpreted as covering all product functions by default.
If the project requires acceptance testing in accordance with IPC-A-610 Class 3, please specify the applicable version, product scope, and inspection documentation in the request for quotation for confirmation by both parties; the acceptance grade is not equivalent to corporate certification.
From Document Review to Delivery
01 · Confirmation of Data and Materials
Review production documents, BOMs, and the scope of materials to identify missing parts, substitute parts, and assembly requirements that need clarification.
02 · Assembly and Process Inspection
Organize the assembly process in accordance with the approved process documentation, and determine the tooling, inspection items, and first-article approval requirements based on the components and structure.
03 · Testing and Delivery
Conduct the agreed-upon tests to verify the reports, packaging, quantities, and batch delivery arrangements. The firmware and test versions must match.
Estimated Lead Times: Approximately 1 week for prototypes and 2–4 weeks for production runs. The actual schedule will be determined once all materials are received, documentation is approved, and tooling and testing requirements are finalized; staggered deliveries can be arranged based on project needs.
PCBA Request for Quotation Documentation Checklist
Bare Boards and Assembly Information
Gerber files, drill files, stackup/board requirements, assembly drawings, and front-and-back specifications; clearly specify panelization and process margin requirements.
BOM and Placement Coordinates
BOM, coordinate files (part numbers, X/Y, rotation angles, face designations), specifying the coordinate origin, units, version, and parts not to be installed.
Testing and Delivery Requirements
Quantity, delivery method, target delivery date, programming files, test specifications, acceptance criteria, and coating and packaging requirements.
Additional services subject to review include rework and repairs, mechanical/electromechanical and complete unit assembly, cables and wire harnesses, conformal coating, and IC programming. Please specify the scope for each item; these services are not automatically included in the base assembly quote.
Frequently Asked Questions About PCBA Projects
Can we supply the materials?
The evaluation can be conducted based on customer-supplied materials or a partial procurement approach. Please provide the complete BOM, actual quantities, and packaging details, and confirm the procedures for handling scrap and material shortages.
Are AOI, X-ray, and functional testing all included?
This is subject to the terms of the quote. The scope of testing varies; ICT and FCT may also involve specialized fixtures, programs, and test specifications.
Is Gerber the only company that can assemble directly?
That's usually not enough. You'll also need a BOM, placement coordinates, assembly drawings, and clear material supply information; when programming and testing are involved, the corresponding documents must be provided as well.
Can we directly commit to the maximum capabilities listed in the table?
The actual components, circuit boards, panel layouts, and assembly methods should be evaluated first, and then the feasible parameters and combinations should be confirmed.
Submit project requirements and confirm the PCBA delivery plan
Shenzhen Jingpeng Electronics | When requesting a quote, please specify "PCBA" and provide the BOM, placement coordinates, and testing requirements.
