High Tg PCB Materials Ensuring Thermal Performance Metrics Match Actual Operating Conditions
Tg describes the glass transition characteristics of a material and is not equivalent to the long-term operating temperature. When selecting high-Tg substrates, factors such as thermal decomposition, thermal expansion, moisture absorption, pore structure, and thermal processes during assembly and bonding should all be taken into account.
High Tg: Materials and Selection Criteria
This information is based on the manufacturer’s current documentation and the versions confirmed by both parties. The model descriptions do not constitute a commitment regarding real-time inventory or direct substitution; thickness, copper foil, and supply specifications are subject to project confirmation.
Tg: Specify the test method
The same material may yield different results depending on the test method used. When comparing candidate materials, ensure that the methods and data versions are consistent.
Thermal Reliability FR-4 Candidates
Models such as the Isola 370HR can serve as a reference for selecting thermal performance specifications; specific applicability must be determined based on the structure and the manufacturer’s documentation.
Higher heat resistance requirements
If a project exceeds the application conditions of conventional epoxy systems, alternatives such as polyimide should be further evaluated, rather than simply increasing the Tg value.
When selecting a model, be sure to focus on these three points
Review Td and Heat Resistance Testing Simultaneously
Analyze the results of the thermal decomposition and heat resistance tests under specified conditions in relation to the welding process.
Focus on Z-axis expansion and pore structure
Thick-plate, multilayer, and multi-step thermal processes require a joint evaluation of via interconnects and material expansion.
Retain Electrical and Manufacturing Requirements
Improving thermal performance does not mean that impedance, loss, lamination, and supply specifications can be ignored.
From Candidate Materials to Production Materials
01 · Lock Data Version
Record the complete part number, suffix, original factory data sheet, and design objectives, and list any uncertain parameters as items to be confirmed.
02 · Review of Stacking and Processes
Based on the core board, bonding material, copper foil, circuit patterns, and via structures, confirm the available specifications and manufacturing conditions.
03 · Replace after confirmation
Any changes to materials must be compared against electrical, thermal, mechanical, and documentation requirements; once confirmed by the design team, they must be incorporated into the production documentation.
Submit this information to minimize back-and-forth during the selection process.
- Design Documents
- Gerber or ODB++, drill holes, board dimensions, number of layers, board thickness, and copper thickness.
- Material Specifications
- Complete part numbers and suffixes, manufacturer specifications, lamination, copper foil, and permitted substitution ranges.
- Conditions of Use
- Operating frequency bands or signal requirements, thermal processes, environmental and structural constraints.
- Delivery Requirements
- Quantity, target delivery date, inspection requirements, and required material certificates.
Common Selection Issues
Can Tg be considered the maximum operating temperature?
No. Long-term temperature suitability also depends on the material's heat resistance rating, the actual structure, and the duration and validation conditions.
Does a higher Tg always mean it's more suitable?
This should be determined based on project requirements. Thermal performance, electrical performance, manufacturability, and cost must be evaluated comprehensively.
Does switching to a high-Tg material require confirmation?
Yes. Since lamination, electrical, and process conditions may vary, the design team should verify any alternative solutions.
Review the materials, then proceed with prototyping and production
Shenzhen Jingpeng Electronics | Submit your requirements for high-Tg materials, design documents, and quantities; we will review the supply specifications and manufacturing plans.
