Polyimide PCB Materials First, distinguish between flexible substrates and rigid laminates
PI can be found in flexible copper-clad laminates, protective coverings, and heat-resistant rigid laminates. When selecting a product, consider its form and intended use, and evaluate its performance under bending, electrical, heat resistance, and processing conditions.
Polyimide: Materials and Selection Criteria
This information is based on the manufacturer’s current documentation and the versions confirmed by both parties. The model descriptions do not constitute a commitment regarding real-time inventory or direct substitution; thickness, copper foil, and supply specifications are subject to project confirmation.
Pyralux AP Flexible Copper-Clad Laminate
DuPont's adhesive-free, fully polyimide double-sided copper-clad laminate system. Further specifications regarding the substrate and copper foil thickness, copper foil type, and assembly configuration are required.
Arlon 85N Rigid Laminate
Polyimide resin systems for high-temperature applications represent a different material approach from that of flexible films.
PI Film and Compatible Materials
The base film, cover film, adhesive, and reinforcing layer each serve different functions; specifying the PI alone is not sufficient to define a complete FPC structure.
When selecting a model, be sure to focus on these three points
Clarification of Bending Conditions
Distinguish between static assembly and dynamic bending; specify the radius, number of bends, and direction of motion; and validate using a complete structural analysis.
Moisture Absorption and Thermal Processes
Refer to the material guidelines to determine the conditions for storage, drying, pressing, and assembly, and avoid focusing solely on the heat-resistance rating.
Separate Reviews for Rigid and Flexible Systems
The thermal reliability requirements for rigid PI laminates should not be directly applied to the bendability of flexible circuits.
From Candidate Materials to Production Materials
01 · Lock Data Version
Record the complete part number, suffix, original factory data sheet, and design objectives, and list any uncertain parameters as items to be confirmed.
02 · Review of Stacking and Processes
Based on the core board, bonding material, copper foil, circuit patterns, and via structures, confirm the available specifications and manufacturing conditions.
03 · Replace after confirmation
Any changes to materials must be compared against electrical, thermal, mechanical, and documentation requirements; once confirmed by the design team, they must be incorporated into the production documentation.
Submit this information to minimize back-and-forth during the selection process.
- Design Documents
- Gerber or ODB++, drill holes, board dimensions, number of layers, board thickness, and copper thickness.
- Material Specifications
- Complete part numbers and suffixes, manufacturer specifications, lamination, copper foil, and permitted substitution ranges.
- Conditions of Use
- Operating frequency bands or signal requirements, thermal processes, environmental and structural constraints.
- Delivery Requirements
- Quantity, target delivery date, inspection requirements, and required material certificates.
Common Selection Issues
Are all polyimide boards flexible?
No. There are both flexible copper-clad laminates and polyimide resin systems used for rigid multilayer boards.
Does "adhesive-free PI substrate" mean there is no adhesive on the entire sheet?
No. "Adhesive-free" typically refers to a specific copper-clad laminate structure; adhesives may still be used in the cover film, reinforcement, or interlayer bonding.
Can you guarantee a specific number of bending cycles?
This must be verified by considering the copper foil, the number of layers, the direction of the traces, the bend radius, and the test conditions; it cannot be inferred solely from the material name.
Review the materials, then proceed with prototyping and production
Shenzhen Jingpeng Electronics | Submit your polyimide material requirements, design documents, and quantities; we will review the supply specifications and manufacturing plans.
