<?xml version="1.0" encoding="UTF-8"?><rss version="2.0"
	xmlns:content="http://purl.org/rss/1.0/modules/content/"
	xmlns:wfw="http://wellformedweb.org/CommentAPI/"
	xmlns:dc="http://purl.org/dc/elements/1.1/"
	xmlns:atom="http://www.w3.org/2005/Atom"
	xmlns:sy="http://purl.org/rss/1.0/modules/syndication/"
	xmlns:slash="http://purl.org/rss/1.0/modules/slash/"
	>

<channel>
	<title>PCB制造工艺 &#8211; 敬鹏电子</title>
	<atom:link href="https://www.jingpengpcb.com/en/blog/pcb-manufacturing/feed/" rel="self" type="application/rss+xml" />
	<link>https://www.jingpengpcb.com/en</link>
	<description>Providing customers with one-stop services for high-end PCB manufacturing and PCB surface-mount assembly</description>
	<lastBuildDate>Thu, 08 Oct 2026 12:14:57 +0000</lastBuildDate>
	<language>en-US</language>
	<sy:updateperiod>
	hourly	</sy:updateperiod>
	<sy:updatefrequency>
	1	</sy:updatefrequency>
	<generator>https://wordpress.org/?v=7.1.3</generator>

<image>
	<url>https://www.jingpengpcb.com/wp-content/uploads/2025/08/favicon.ico</url>
	<title>PCB制造工艺 &#8211; 敬鹏电子</title>
	<link>https://www.jingpengpcb.com/en</link>
	<width>32</width>
	<height>32</height>
</image> 
	<item>
		<title>A PCB Manufacturer Provides a Brief Overview of Tin-Spray Surface Treatment</title>
		<link>https://www.jingpengpcb.com/en/blog/hasl-surface-finish/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Tue, 20 Oct 2026 03:00:00 +0000</pubDate>
				<category><![CDATA[PCB制造工艺]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=2858</guid>

					<description><![CDATA[随着电子技术的不断发展，印刷电路板（PCB）已成为现代电子设备的核心组成部分。为了确保PCB的性能和可靠性，各 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/hasl-surface-finish/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>高频板钻孔怎么选物料？钻咀与钻孔参数的选择</title>
		<link>https://www.jingpengpcb.com/en/blog/hf-pcb-drilling-materials/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Fri, 16 Oct 2026 01:00:00 +0000</pubDate>
				<category><![CDATA[PCB制造工艺]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=2803</guid>

					<description><![CDATA[随着科学技术，尤其是信息技术的不断发展，印制电路板（PCB）的制造工艺技术也得到了显著提高，以满足日益增长的用 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/hf-pcb-drilling-materials/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>Comparison of Gold Plating and Immersion Gold on Printed Circuit Boards</title>
		<link>https://www.jingpengpcb.com/en/blog/gold-plating-vs-enig/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Tue, 13 Oct 2026 09:00:00 +0000</pubDate>
				<category><![CDATA[PCB制造工艺]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=2741</guid>

					<description><![CDATA[电路板在现代电子制造中扮演着至关重要的角色，而电镀是其中一个关键的工艺。不同类型的电路板电镀能够满足各种不同的 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/gold-plating-vs-enig/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>PCB阻焊层有什么作用？类型、工艺重要性与常见挑战</title>
		<link>https://www.jingpengpcb.com/en/blog/pcb-solder-mask-purpose/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Fri, 09 Oct 2026 07:00:00 +0000</pubDate>
				<category><![CDATA[PCB制造工艺]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1679</guid>

					<description><![CDATA[在PCB（Printed Circuit Board，印刷电路板）制造领域，阻焊是一个关键的工艺步骤，它有助于 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/pcb-solder-mask-purpose/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>高频PCB生产要求：材料、叠层、加工与检验指南</title>
		<link>https://www.jingpengpcb.com/en/blog/high-frequency-pcb-production/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Mon, 05 Oct 2026 04:00:00 +0000</pubDate>
				<category><![CDATA[PCB制造工艺]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1666</guid>

					<description><![CDATA[从材料型号与Dk、成品叠层、钻孔压合到表面处理和射频测试，梳理高频PCB投产要求，纠正常见选型误区，并提供询价资料清单。
<p><a href="https://www.jingpengpcb.com/en/blog/high-frequency-pcb-production/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>PCB表面处理工艺怎么选？喷锡、镀金、OSP的优缺点对比</title>
		<link>https://www.jingpengpcb.com/en/blog/pcb-surface-finish-comparison/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Sun, 04 Oct 2026 03:00:00 +0000</pubDate>
				<category><![CDATA[PCB制造工艺]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1731</guid>

					<description><![CDATA[随着电子科学技术的不断发展，PCB（Printed Circuit Board）技术也经历了巨大的变革。随之而 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/pcb-surface-finish-comparison/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>多层PCB镀铜难在哪？一次与二次电流分布的控制方法</title>
		<link>https://www.jingpengpcb.com/en/blog/multilayer-pcb-plating-process/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Sat, 03 Oct 2026 02:00:00 +0000</pubDate>
				<category><![CDATA[PCB制造工艺]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=2966</guid>

					<description><![CDATA[随着表面黏装技术的蓬勃发展，印刷电路板的未来必然走向细线、小孔、多层之高密度封装型态。然而，制造这种高层次电路 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/multilayer-pcb-plating-process/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>What Should Be Considered in the Chemical Nickel-Gold Plating Process? Causes and Solutions for Color Variations and Rough Plating Surfaces</title>
		<link>https://www.jingpengpcb.com/en/blog/enig-process-guide/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Thu, 01 Oct 2026 08:00:00 +0000</pubDate>
				<category><![CDATA[PCB制造工艺]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1891</guid>

					<description><![CDATA[化学镍金镀层是一种多功能的湿制程，集合了可焊接、可接触导通、可打线以及可散热等功能于一身。它被广泛应用在PCB [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/enig-process-guide/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>PCB制作有哪些工序？内层到成型的完整流程与英文术语</title>
		<link>https://www.jingpengpcb.com/en/blog/pcb-production-process-steps/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Wed, 30 Sep 2026 06:00:00 +0000</pubDate>
				<category><![CDATA[PCB制造工艺]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=2897</guid>

					<description><![CDATA[电路板制作是一个复杂而重要的过程，涉及多个工序和技术。本文将为您详细解释电路板制作的每个工序，以及相应的英文术 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/pcb-production-process-steps/">Source</a></p>]]></description>
		
		
		
			</item>
	</channel>
</rss>