<?xml version="1.0" encoding="UTF-8"?><rss version="2.0"
	xmlns:content="http://purl.org/rss/1.0/modules/content/"
	xmlns:wfw="http://wellformedweb.org/CommentAPI/"
	xmlns:dc="http://purl.org/dc/elements/1.1/"
	xmlns:atom="http://www.w3.org/2005/Atom"
	xmlns:sy="http://purl.org/rss/1.0/modules/syndication/"
	xmlns:slash="http://purl.org/rss/1.0/modules/slash/"
	>

<channel>
	<title>PCB设计 &#8211; 敬鹏电子</title>
	<atom:link href="https://www.jingpengpcb.com/en/blog/pcb-design/feed/" rel="self" type="application/rss+xml" />
	<link>https://www.jingpengpcb.com/en</link>
	<description>Providing customers with one-stop services for high-end PCB manufacturing and PCB surface-mount assembly</description>
	<lastBuildDate>Fri, 09 Oct 2026 07:30:40 +0000</lastBuildDate>
	<language>en-US</language>
	<sy:updateperiod>
	hourly	</sy:updateperiod>
	<sy:updatefrequency>
	1	</sy:updatefrequency>
	<generator>https://wordpress.org/?v=7.1.3</generator>

<image>
	<url>https://www.jingpengpcb.com/wp-content/uploads/2025/08/favicon.ico</url>
	<title>PCB设计 &#8211; 敬鹏电子</title>
	<link>https://www.jingpengpcb.com/en</link>
	<width>32</width>
	<height>32</height>
</image> 
	<item>
		<title>What Should You Keep in Mind When Routing Mobile Phone PCBs? Layer Planning and RF Ribbon Trace Requirements</title>
		<link>https://www.jingpengpcb.com/en/blog/mobile-pcb-layout-risks/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Mon, 19 Oct 2026 07:00:00 +0000</pubDate>
				<category><![CDATA[PCB设计]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=2635</guid>

					<description><![CDATA[1. 手机 PCB 布线为什么特殊 手机主板是 PCB 设计里难度最高的一类，四个约束同时收紧： 空间极紧：整 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/mobile-pcb-layout-risks/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>手机射频layout检查规则及注意事项</title>
		<link>https://www.jingpengpcb.com/en/blog/rf-layout-check-rules/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Thu, 15 Oct 2026 03:00:00 +0000</pubDate>
				<category><![CDATA[PCB设计]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1944</guid>

					<description><![CDATA[射频（RF）部分layout的设计在电子产品中至关重要，尤其在手机制造中，确保射频部分的布局合理和准确可以极大 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/rf-layout-check-rules/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>电路板厂PCB与金属机壳的接地用阻容连接作用是什么？</title>
		<link>https://www.jingpengpcb.com/en/blog/pcb-rc-ground-to-chassis/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Tue, 13 Oct 2026 01:00:00 +0000</pubDate>
				<category><![CDATA[PCB设计]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1590</guid>

					<description><![CDATA[电子产品的接地问题一直是一个备受关注的话题。在本文中，我们将重点讨论金属外壳与电路板的接地问题，以及为什么在一 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/pcb-rc-ground-to-chassis/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>What principles should be followed when manually designing a PCB? Placement of components as close as possible, manufacturing considerations, and thermal management</title>
		<link>https://www.jingpengpcb.com/en/blog/hand-drawn-pcb-layout-rules/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Thu, 08 Oct 2026 02:00:00 +0000</pubDate>
				<category><![CDATA[PCB设计]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1918</guid>

					<description><![CDATA[在现代电子领域，PCB（Printed Circuit Board，印刷电路板）的设计扮演着至关重要的角色。设 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/hand-drawn-pcb-layout-rules/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>How to Design a PCB for Electromagnetic Interference (EMI) Protection? Layout of Power Lines, Ground Lines, and Decoupling Capacitors</title>
		<link>https://www.jingpengpcb.com/en/blog/pcb-anti-interference-design-basics/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Mon, 05 Oct 2026 01:00:00 +0000</pubDate>
				<category><![CDATA[PCB设计]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1915</guid>

					<description><![CDATA[印刷电路板（PCB）是现代电子设备的核心组成部分之一，然而，一旦设计完成，往往会遇到干扰问题，就像手机信号一样 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/pcb-anti-interference-design-basics/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>How to Set Up Layout and Routing for HDI PCBs? Via Sizes, Layer Transitions, and Routing Constraints</title>
		<link>https://www.jingpengpcb.com/en/blog/hdi-layout-routing-setup/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Sat, 03 Oct 2026 08:00:00 +0000</pubDate>
				<category><![CDATA[PCB设计]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=2985</guid>

					<description><![CDATA[随着电子设备不断演进，更高级的PCB（Printed Circuit Board，印刷电路板）设计需要在更小的 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/hdi-layout-routing-setup/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>SDRAM布线规则及技巧</title>
		<link>https://www.jingpengpcb.com/en/blog/sdram-routing-rules/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Fri, 02 Oct 2026 07:00:00 +0000</pubDate>
				<category><![CDATA[PCB设计]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1909</guid>

					<description><![CDATA[在高速硬件设计中，内存布线是一项至关重要的任务。无论您是在外部还是内部进行布线，都需要注意一些关键因素，以确保 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/sdram-routing-rules/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>可穿戴PCB怎么选材料？制造、射频与微波设计考量</title>
		<link>https://www.jingpengpcb.com/en/blog/wearable-pcb-material-choices/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Thu, 01 Oct 2026 05:00:00 +0000</pubDate>
				<category><![CDATA[PCB设计]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=2435</guid>

					<description><![CDATA[在可穿戴物联网市场不断壮大的今天，由于体积和尺寸都很小，几乎没有现成的PCB印刷电路板标准可供使用。因此，PC [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/wearable-pcb-material-choices/">Source</a></p>]]></description>
		
		
		
			</item>
		<item>
		<title>Share and explain how to build a multilayer PCB stackup in PCB design</title>
		<link>https://www.jingpengpcb.com/en/blog/multilayer-pcb-stackup-guide/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Wed, 30 Sep 2026 03:00:00 +0000</pubDate>
				<category><![CDATA[PCB设计]]></category>
		<category><![CDATA[博客]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1461</guid>

					<description><![CDATA[在现代电子设备中，PCB（Printed Circuit Board，印刷电路板）扮演着至关重要的角色。它们是 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/multilayer-pcb-stackup-guide/">Source</a></p>]]></description>
		
		
		
			</item>
	</channel>
</rss>