{"id":3712,"date":"2023-08-14T10:06:09","date_gmt":"2023-08-14T02:06:09","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=3712"},"modified":"2026-10-02T19:32:06","modified_gmt":"2026-10-02T11:32:06","slug":"hdi-failure-mechanism","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/hdi-failure-mechanism\/","title":{"rendered":"Failure Analysis Techniques in HDI Manufacturing"},"content":{"rendered":"

With the advent of high-precision printed circuit boards (HDI<\/a>) and the trend toward high-density HDI, coupled with increasingly stringent environmental requirements for lead-free and halogen-free materials, have led to a growing number of HDI boards exhibiting issues such as poor wetting, cracking, delamination, and CAF. To better understand the failure mechanisms and causes in HDI manufacturing, we need to apply a variety of analytical techniques. These techniques have been widely used in real-world cases and will help with future HDI quality control to prevent similar issues from recurring.<\/p>\n

\"HDI<\/p>\n

Visual Inspection<\/h2>\n

Visual inspection is one of the most common methods for locating faults in HDI boards. By conducting a visual examination or using simple instruments such as stereo microscopes, metallographic microscopes, or even magnifying glasses, the surface of the HDI board is inspected to identify failure locations and gather relevant evidence. Its primary purpose is to locate faults and make a preliminary determination of the HDI\u2019s failure mode. Visual inspection primarily focuses on contamination, corrosion, locations of board delamination, circuit connections, and the patterns of failure\u2014such as whether failures occur in batches or individually, or whether they are consistently concentrated in a specific area. In addition, visual inspection can reveal many failures that only become apparent after HDI assembly, helping to determine whether they are caused by the assembly process or the materials used in the process; this requires a careful examination of the characteristics of the failure areas.<\/p>\n

X-ray Fluoroscopy<\/h2>\n

X-ray fluoroscopy is used to inspect components that cannot be examined with the naked eye, as well as internal defects such as those in HDI through-holes. X-ray fluoroscopy systems utilize the principle that materials of different thicknesses or densities have varying absorption or transmission properties to produce images. This technology is primarily used to inspect internal defects in HDI solder joints and through-holes, as well as to locate defective solder joints in high-density BGA or CSP devices. Currently, the resolution of industrial X-ray fluoroscopy equipment can reach less than one micrometer, and the industry is transitioning from two-dimensional to three-dimensional imaging systems. This technology is highly valuable for non-destructive testing of HDI.<\/p>\n

Slice Analysis<\/h2>\n

Section analysis is the process of obtaining the cross-sectional structure of HDI through a series of methods and steps, including sampling, embedding, sectioning, polishing, etching, and observation. Through section analysis, a wealth of microstructural information reflecting the quality of HDI manufacturing (through-holes, coatings, etc.) can be obtained, providing a solid basis for subsequent quality improvements. However, this method is destructive. Once a sample is sectioned, damage to the sample is inevitable; furthermore, the method is demanding in terms of sample preparation, time-consuming, and requires well-trained technicians to carry it out.<\/p>\n

Scanning Acoustic Microscopy Analysis<\/h2>\n

The scanning acoustic microscope is primarily used for the analysis of electronic packaging or assembly; it is a C-mode ultrasonic scanning acoustic microscope. It generates images by utilizing changes in amplitude, phase, and polarization caused by the reflection of high-frequency ultrasonic waves at material discontinuities. It scans the X-Y plane along the Z-axis. Scanning acoustic microscopes can be used to detect various defects in components, materials, and HDI and HDIA boards, including cracks, delamination, inclusions, and voids. Typical scanning acoustic images display the presence of defects in a red warning color. Scanning acoustic microscopes offer particular advantages in the non-destructive testing of multilayer high-density HDI boards, as they are capable of detecting issues such as board delamination.<\/p>\n

Microscopic Infrared Analysis<\/h2>\n

Microscopic infrared analysis is an analytical method that combines infrared spectroscopy with microscopy. It utilizes the principle that different substances (primarily organic substances) absorb infrared radiation differently to analyze the chemical composition of materials, and incorporates a microscope to ensure that visible light and infrared light follow the same optical path. The primary purpose of microscopic infrared analysis is to analyze organic contaminants on weld surfaces or solder joints and to identify the causes of corrosion or poor weldability.<\/p>\n

These analytical techniques play a crucial role in the HDI manufacturing process, helping us identify defects, analyze the causes of failure, improve quality, and gradually enhance the reliability of HDI. Through continuous technical exploration and practical application, we can effectively address various issues that arise in HDI manufacturing and ensure that the quality and reliability of HDI continue to improve.<\/p>\n

Frequently Asked Questions<\/h2>\n

Q1: Why is visual inspection necessary?<\/strong><\/h3>\n

Visual inspection is an important method for identifying faults; it allows for a preliminary assessment of HDI failure modes and helps pinpoint the affected area and possible causes.<\/p>\n

Q2: In what situations is an X-ray fluoroscopy examination appropriate?<\/strong><\/h3>\n

X-ray fluoroscopy is suitable for inspecting components that cannot be examined with the naked eye, as well as for locating internal defects such as through-holes in HDI boards; it also has some practical value for inspecting solder joints and BGA devices.<\/p>\n

Q3: What are the advantages and disadvantages of slice analysis?<\/strong><\/h3>\n

Section analysis can provide a wealth of microstructural information, but it is a destructive process; once a sample is sectioned, it is damaged, and the method requires high-precision sample preparation and is time-consuming.<\/p>\n

Q4: What types of defects can a scanning acoustic microscope detect?<\/strong><\/h3>\n

Scanning acoustic microscopy can detect various defects, such as cracks, delamination, inclusions, and voids, and is particularly suitable for the non-destructive testing of multilayer, high-density HDI boards.<\/p>\n

Q5: What is the main purpose of microscopic infrared analysis?<\/strong><\/h3>\n

The primary purpose of microscopic infrared analysis is to identify organic contaminants on the surface of welds or solder joints, as well as to determine the causes of corrosion or poor weldability.<\/p>","protected":false},"excerpt":{"rendered":"

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