{"id":3640,"date":"2026-11-02T11:00:00","date_gmt":"2026-11-02T03:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=3640"},"modified":"2026-10-08T20:15:58","modified_gmt":"2026-10-08T12:15:58","slug":"pcb-routing-machine-interconnection","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/pcb-routing-machine-interconnection\/","title":{"rendered":"What Are the Different Types of PCB Milling Operations? Milling Cutter Selection and Interlayer Connection Methods"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<p>Printed circuit boards (PCBs) play a vital role in modern electronic devices; they house electronic components and provide a platform for connections. PCB manufacturing involves several key aspects, including the use of milling machines, various types of processing, and methods for interconnecting PCB layers. In this article, we will delve deeply into these topics to help PCB manufacturers, PCB designers, and PCBA manufacturers better understand these key concepts.<\/p>\n<h2>Advanced: The Role of Milling Machines in the Entire Production Line<\/h2>\n<p>The PCB manufacturing process generally consists of the following steps: blanking \u2192 drilling \u2192 via plating \u2192 pattern transfer \u2192 etching \u2192 solder mask application \u2192 surface treatment \u2192 forming \u2192 electrical testing. Milling machines are primarily used in the final forming stage and are also employed for machining certain slots and cavities.<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Process Steps<\/th>\n<th>Major Equipment<\/th>\n<th>Relationship with Milling Machines<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Drilling<\/td>\n<td>CNC Drilling Machine<\/td>\n<td>Both are CNC positioning devices and have similar structures.<\/td>\n<\/tr>\n<tr>\n<td>Forming<\/td>\n<td>CNC Milling Machine \/ Milling Machine<\/td>\n<td>The Main Arena for Milling Machines<\/td>\n<\/tr>\n<tr>\n<td>V-CUT<\/td>\n<td>V-Cutter<\/td>\n<td>Used for panel assembly and cutting; complements milling<\/td>\n<\/tr>\n<tr>\n<td>Electrical Testing<\/td>\n<td>Flying Needle \/ Fixture<\/td>\n<td>After molding, proceed with<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<ul>\n<li><strong>Drilling and milling can have the same origin<\/strong>: The CNC structures of some machines are identical to their positioning methods; the only difference lies in the spindle and the cutting tool;<\/li>\n<li><strong>The molding process determines the final dimensional accuracy.<\/strong>: No matter how well the preceding processes are performed, parts that exceed dimensional tolerances during forming will still be scrapped;<\/li>\n<li><strong>Forming is also a source of stress<\/strong>: Milling generates mechanical stress, so special care must be taken with thin sheets and materials prone to delamination.<\/li>\n<\/ul>\n<p>It is worth noting that as the proportion of high-density boards and metal substrates increases, the difficulty of the forming process also rises. Metal-based materials require cooling and specialized parameters, while thin high-density boards are more sensitive to vibration and stress; these two types of boards are often the primary sources of challenges in the forming process and must be evaluated separately during production scheduling.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"800\" height=\"600\" class=\"alignnone size-large wp-image-10090\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/what-is-pcb-milling-processing.jpg\" alt=\"What Is PCB Milling?\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/what-is-pcb-milling-processing.jpg 800w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/what-is-pcb-milling-processing-300x225.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/what-is-pcb-milling-processing-768x576.jpg 768w\" sizes=\"auto, (max-width: 800px) 100vw, 800px\" \/><\/p>\n<p>For milling instructions, see<a href=\"\/en\/blog\/what-is-pcb-milling-processing\/\">What Is PCB Milling?<\/a>; For the cutting and manufacturing processes, see<a href=\"\/en\/blog\/difficulties-and-key-process-control-in-manufacturing-high-rise-pcb\/\">Challenges in the Manufacturing of High-Layer-Count Printed Circuit Boards and Control of Key Processes<\/a>\u3002<\/p>\n<h2>H1: Milling Machine<\/h2>\n<p>Milling machines are indispensable tools in PCB manufacturing, and they have the following characteristics:<\/p>\n<ol>\n<li><strong>High-Precision Positioning Mechanism<\/strong>: It has the same structure as a CNC drilling machine, with the X, Y, and Z axes operating independently.<\/li>\n<li><strong>High-Rigidity, High-Speed Spindle<\/strong>: The spindle's high-speed rotation (7,000\u201340,000 rpm) utilizes ball bearings to ensure precise cutting.<\/li>\n<li><strong>Hole Detection Feature<\/strong>: Accurately measures the thickness of the substrate surface to ensure depth accuracy.<\/li>\n<li><strong>Various Types of Flexible Commands<\/strong>: CNC milling machines support a variety of operations, such as cutting, feed rate, tool engagement, and tool retraction.<\/li>\n<li><strong>Automatic Compensation Feature<\/strong>: CNC milling machines can be programmed based on the actual dimensions of the PCB and automatically compensate for the milling cutter diameter to improve accuracy.<\/li>\n<\/ol>\n<h2>Advanced: Weighing the Pros and Cons of Three Molding Methods<\/h2>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Method<\/th>\n<th>Principle<\/th>\n<th>Accuracy<\/th>\n<th>Cost<\/th>\n<th>Applicable<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>CNC Milling (Plate Milling)<\/td>\n<td>Contour Milling<\/td>\n<td>\u9ad8<\/td>\n<td>\u4e2d<\/td>\n<td>Irregular shapes, small batches, high precision<\/td>\n<\/tr>\n<tr>\n<td>Die Cutting (Die \/ Mold)<\/td>\n<td>Single-Step Die Cutting and Forming<\/td>\n<td>\u4e2d<\/td>\n<td>High tooling costs, low unit prices<\/td>\n<td>Large quantities, simple shapes<\/td>\n<\/tr>\n<tr>\n<td>V-CUT<\/td>\n<td>Double-sided V-notch followed by a break<\/td>\n<td>\u4f4e<\/td>\n<td>\u4f4e<\/td>\n<td>Rectangular Panel Assembly and Cutting<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The key to making a choice lies in<strong>Balance Between Quantity and Shape<\/strong>: Use milling for complex shapes and small quantities; use punching for simple shapes and large quantities; V-CUT is the most cost-effective option for regular rectangular panels. Once production volume exceeds a certain threshold, the unit cost of punching becomes significantly lower than that of milling, but the initial die investment must be factored in.<\/p>\n<ul>\n<li><strong>Milling offers the greatest flexibility<\/strong>: Simply modify the program to change the shape, making it ideal for prototyping and phases involving frequent changes;<\/li>\n<li><strong>Irregular shapes and internal grooves can only be milled<\/strong>: It is difficult to punch shapes such as internal grooves, steps, and arcs;<\/li>\n<li><strong>Support is essential when milling thin plates<\/strong>: Prevent burrs and dimensional deviations caused by vibration.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"400\" height=\"232\" class=\"alignnone size-large wp-image-152\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2022\/11\/pcb-machine-aoi.jpg\" alt=\"AOI\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2022\/11\/pcb-machine-aoi.jpg 400w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2022\/11\/pcb-machine-aoi-300x174.jpg 300w\" sizes=\"auto, (max-width: 400px) 100vw, 400px\" \/><\/p>\n<p>For information on controlling manufacturing challenges, see<a href=\"\/en\/blog\/difficulties-and-key-process-control-in-manufacturing-high-rise-pcb\/\">Challenges in the Manufacturing of High-Layer-Count Printed Circuit Boards and Key Control Points for Production Processes<\/a>; See the effects of aspect ratio<a href=\"\/en\/blog\/pcb-aspect-ratio-multi-layer-pcb-manufacturing\/\">The Importance of the PCB Aspect Ratio in Multilayer PCB Manufacturing<\/a>\u3002<\/p>\n<h2>H2: Processing Types<\/h2>\n<p>Types of PCB manufacturing include:<\/p>\n<ol>\n<li><strong>Profile Machining<\/strong>: Typically used for milling slots ranging from 0.8 to 3.175 mm, for cutting and machining PCBs of various shapes.<\/li>\n<li><strong>Drilling<\/strong>: Used to create small holes, primarily for filling IC chips, with a required depth accuracy of less than 50 \u00b5m.<\/li>\n<\/ol>\n<h2>Advanced: Milling Cutter Parameters and Common Defects<\/h2>\n<p>The choice of milling cutter directly determines edge quality. Key parameters include diameter, tooth profile, number of cutting edges, and coating, with diameter and tooth profile having the greatest impact:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Parameters<\/th>\n<th>Impact of Value Selection<\/th>\n<th>Common Defects and Their Corresponding Causes<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Blade Diameter<\/td>\n<td>Small-diameter cutters are suitable for narrow grooves and fillets<\/td>\n<td>If the blade diameter is too small, the blade is prone to breaking or bending.<\/td>\n<\/tr>\n<tr>\n<td>Tooth Profile<\/td>\n<td>Factors Affecting Chip Removal and Cutting Forces<\/td>\n<td>Poor chip removal can cause burrs and scorching.<\/td>\n<\/tr>\n<tr>\n<td>Rotational Speed and Feed Rate<\/td>\n<td>Jointly determine the feed per tooth<\/td>\n<td>If the feed rate is too fast, the edges will chip; if it's too slow, the material will burn.<\/td>\n<\/tr>\n<tr>\n<td>Number of layers<\/td>\n<td>Impact on Efficiency and Dimensional Consistency<\/td>\n<td>Stacking too many layers will increase dimensional deviations between the top and bottom boards.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<ul>\n<li><strong>Burrs<\/strong>: This is usually caused by tool wear or poor chip removal; replace the tool promptly and adjust the parameters;<\/li>\n<li><strong>Chipping and Delamination<\/strong>: This tends to occur when the feed rate is too high or the material is highly brittle; in such cases, reduce the feed rate or use a suitable tooth profile;<\/li>\n<li><strong>Dimensional Deviations<\/strong>: This is often caused by excessive tool clearance and too many layers; it is necessary to compensate for the tool diameter and control the number of layers;<\/li>\n<li><strong>Charred<\/strong>: Heat builds up during cutting; improve chip removal or use cooling.<\/li>\n<\/ul>\n<p>Tool life management is also crucial.<strong>Change blades based on the number of grains processed, not on feel<\/strong>...ensures consistent edge quality; relying on visual inspection to determine when to change the cutting tool often results in a delayed response until a problem has already occurred.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"400\" height=\"232\" class=\"alignnone size-large wp-image-154\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2022\/11\/pcb-machine-ldi.jpg\" alt=\"LDI\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2022\/11\/pcb-machine-ldi.jpg 400w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2022\/11\/pcb-machine-ldi-300x174.jpg 300w\" sizes=\"auto, (max-width: 400px) 100vw, 400px\" \/><\/p>\n<p>For drilling quality, see<a href=\"\/en\/blog\/pcb-drilling-quality-issues\/\">Quality Issues in the PCB Drilling Process<\/a>; For HDI manufacturing, see<a href=\"\/en\/blog\/hdi-manufacturing-process\/\">A Comprehensive Analysis of the HDI PCB Manufacturing Process<\/a>\u3002<\/p>\n<h2>H3: Types of Milling Cutters<\/h2>\n<p>The types of milling cutters used for PCB contour machining include:<\/p>\n<ol>\n<li><strong>Helical Milling Cutter<\/strong>: It is characterized by a small front angle, a large rear angle, and a reverse rake, ensuring that the cutting edge is strong and sharp.<\/li>\n<li><strong>Diamond-Tooth Milling Cutter<\/strong>: This type of cutting tool features multiple diamond-shaped teeth machined into the cylindrical surface of the milling cutter, making it suitable for a variety of cutting requirements.<\/li>\n<\/ol>\n<h2>Advanced: A Comparison of Two Interlayer Connection Processes<\/h2>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Project<\/th>\n<th>Traditional Pressing Method<\/th>\n<th>Layer-by-Layer Method<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Process<\/td>\n<td>Once the inner layer is complete, press it together in one go.<\/td>\n<td>Add layers sequentially on both sides of the core board<\/td>\n<\/tr>\n<tr>\n<td>Interconnection Methods<\/td>\n<td>Mainly through-holes<\/td>\n<td>Based on Microholes and Blind Holes<\/td>\n<\/tr>\n<tr>\n<td>Number of Floors Supported<\/td>\n<td>Standard Multilayer Board<\/td>\n<td>HDI High-Density Board<\/td>\n<\/tr>\n<tr>\n<td>Number of Pressing Cycles<\/td>\n<td>\u5c11<\/td>\n<td>Many; each additional layer requires one press.<\/td>\n<\/tr>\n<tr>\n<td>Cost<\/td>\n<td>\u4f4e<\/td>\n<td>\u9ad8<\/td>\n<\/tr>\n<tr>\n<td>Line Width Capability<\/td>\n<td>Limited by conventional etching<\/td>\n<td>Can produce even finer lines<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>With the layer-up method, each additional layer requires repeating the lamination, drilling, and plating processes, causing the number of process steps to multiply\u2014this is the fundamental reason for the high cost of HDI boards. In return, this method offers the routing flexibility provided by interconnections between any layers, as well as the ability to support BGA fan-out with finer pitch.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"400\" height=\"232\" class=\"alignnone size-large wp-image-156\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2022\/11\/pcb-machine-vcp.jpg\" alt=\"VCP\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2022\/11\/pcb-machine-vcp.jpg 400w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2022\/11\/pcb-machine-vcp-300x174.jpg 300w\" sizes=\"auto, (max-width: 400px) 100vw, 400px\" \/><\/p>\n<p>For HDI process requirements, see<a href=\"\/en\/blog\/5-hdi-manufacturing-requirements\/\">5 Key Requirements and Optimization Strategies for the HDI Manufacturing Process<\/a>; For connection methods, see<a href=\"\/en\/blog\/two-types-of-pcb-connection-methods\/\">Two Common Methods of PCB Connection<\/a>\u3002<\/p>\n<h2>H4: Interlayer Connection Methods for PCBs<\/h2>\n<p>Depending on how circuit boards are classified, the number of layers varies, and so do the methods used to connect the layers of a PCB. There are two main methods:<\/p>\n<ol>\n<li><strong>Traditional Pressing Method<\/strong>: First, the inner layer circuits are fabricated and checked for circuit integrity, and then the board is sent to the lamination chamber for multilayer lamination. This method is suitable for traditional multilayer board manufacturing, such as eight-layer boards.<\/li>\n<li><strong>Layer-by-Layer Method<\/strong>: This method involves growing layers on both sides of a core rigid board to manufacture high-density interconnect boards (<a href=\"\/en\/hdi-pcb\/\">HDI Board<\/a>\uff09\u3002<\/li>\n<\/ol>\n<p>In addition to these traditional methods, there are other interlayer conductive techniques, such as conductive adhesive via technology and the Manhattan technique. These technologies allow PCB manufacturers to establish electrical conductivity between layers without the need for via wall metallization.<\/p>\n<h2>Advanced: Key Points for Quality Control in the Molding Process<\/h2>\n<ol>\n<li><strong>Programming to Compensate for Tool Diameter<\/strong>: Compensate based on the actual tool diameter and update as the tool wears down;<\/li>\n<li><strong>Control the Number of Layers<\/strong>: Balancing efficiency with consistency in the dimensions of the top and bottom plates;<\/li>\n<li><strong>Set Appropriate Parameters<\/strong>: The rotational speed, feed rate, and cutting speed are determined based on the material and the tool diameter;<\/li>\n<li><strong>Replace the Blade Based on Service Life<\/strong>: Base your decisions on the amount of rice processed, rather than waiting for a problem to arise;<\/li>\n<li><strong>First Full-Scale Measurement<\/strong>: After molding, measure the critical dimensions and hole positions; proceed with mass production only after confirming they are correct;<\/li>\n<li><strong>Check Edge Quality<\/strong>: Visually inspect or examine under magnification for burrs, chipped edges, and delamination.<\/li>\n<\/ol>\n<p>Molding is the final step before delivery; if a mistake is made at this stage, all the value generated by the preceding steps is lost. Therefore,<strong>The first-piece inspection is a step that cannot be skipped.<\/strong>, especially panels with complex shapes or made of special materials.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"400\" height=\"232\" class=\"alignnone size-large wp-image-153\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2022\/11\/pcb-machine-feizhen-test.jpg\" alt=\"Flying Needle Machine\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2022\/11\/pcb-machine-feizhen-test.jpg 400w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2022\/11\/pcb-machine-feizhen-test-300x174.jpg 300w\" sizes=\"auto, (max-width: 400px) 100vw, 400px\" \/><\/p>\n<p>For an overview of equipment and processes, see<a href=\"\/en\/capabilities\/\">PCB Manufacturing Capabilities<\/a>; For information on selecting HDI and standard boards, see<a href=\"\/en\/blog\/hdi-vs-pcb\/\">How to Choose Between HDI Boards and Standard PCBs<\/a>\u3002<\/p>\n<h2>Conclusion<\/h2>\n<p>In the PCB manufacturing process, milling machines, various machining methods, and interlayer connection techniques all play important roles. Understanding these key concepts will help manufacturers, designers, and PCBA manufacturers better select the appropriate methods and tools to meet their specific needs.<\/p>\n<h2>Frequently Asked Questions (FAQs)<\/h2>\n<h3>Q1: What is the primary use of a PCB milling machine?<\/h3>\n<p>PCB milling machines are primarily used to cut and machine PCBs to meet design requirements.<\/p>\n<h3>Q2: What is an HDI board?<\/h3>\n<p>HDI boards, short for High-Density Interconnect boards, are a type of multilayer board structure typically used in high-performance electronic devices.<\/p>\n<h3>Q3: How do I choose the right type of milling cutter?<\/h3>\n<p>The type of milling cutter should be selected based on the required cutting specifications and the PCB material.<\/p>\n<h3>Q4: What is the purpose of interlayer conductivity?<\/h3>\n<p>Interlayer conductivity enables signal transmission and electrical conductivity between different layers of a circuit board, thereby expanding the board's functionality.<\/p>\n<h3>Q5: What is the difference between the traditional pressing method and the layering method?<\/h3>\n<p>The traditional lamination method involves first fabricating the inner layer circuits, while the layering method involves applying multiple layers to a core rigid board; it is suitable for the manufacture of various types of multilayer boards.<\/p>\n<h3>Q6: Can a milling machine and a drilling machine be used interchangeably?<\/h3>\n<p>They cannot completely replace each other. Although both are CNC positioning machines, they differ in spindle speed, cutting tools, and machining methods: drilling machines prioritize hole positioning accuracy and hole wall quality, while milling machines prioritize contour accuracy and edge quality. Grooves and external shapes can be machined using milling to produce shapes similar to holes, but the roundness and hole wall quality cannot match the standards achieved by drilling.<\/p>\n<h3>Q7: Why is a process margin left during molding?<\/h3>\n<p>Process margins are used for board alignment, component placement, and optical recognition. Boards without process margins cannot be transported on the SMT line, and there is no designated position for placement of mark points. The width is typically left according to equipment requirements and removed during forming or panel cutting.<\/p>\n<h3>Q8: Why do thin plates warp during milling?<\/h3>\n<p>Thin plates lack rigidity, and the cutting forces and vibrations generated during milling can easily cause them to deform; at the same time, the release of internal stresses in the material can also lead to warping. Possible solutions include reducing cutting forces, optimizing the layering and support of the plates, and incorporating a stress-relief process before shaping.<\/p>\n<h3>Q9: What makes the forming of metal substrates different?<\/h3>\n<p>Aluminum-based and copper-based materials have high thermal conductivity and good ductility, which can lead to tool sticking and burr formation during machining. They typically require the use of coolant, as well as specialized tool geometries and cutting parameters; otherwise, both edge quality and tool life will be significantly reduced.<\/p>\n<h3>Q10: Why does the layered method produce finer lines?<\/h3>\n<p>Because the dielectric layers used for stacking are thinner and the copper foil is thinner, side etching during the etching process is minimized, allowing for the fabrication of finer line widths. In addition, laser drilling can create smaller microvias; the combination of these two techniques enables the realization of high-density interconnects.<\/p>\n<h3>Q11: What are the typical dimensional tolerances for molded parts?<\/h3>\n<p>Depending on the machine\u2019s precision, sheet thickness, and material, the contour tolerance for conventional CNC milling is typically in the range of \u00b10.1 mm; while tolerances can be tightened to meet higher precision requirements, this increases costs. When designing, tolerances should be specified based on actual assembly requirements; there is no need to blindly pursue the tightest tolerances.<\/p>\n<p><strong>Related Reading<\/strong>\uff1a<a href=\"\/en\/blog\/two-types-of-pcb-connection-methods\/\">Two Common Methods of PCB Connection<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>\u7535\u8def\u677f\uff08PCB\uff09\u5728\u73b0\u4ee3\u7535\u5b50\u8bbe\u5907\u4e2d\u626e\u6f14\u7740\u91cd\u8981\u7684\u89d2\u8272\uff0c\u5b83\u4eec\u6258\u7ba1\u4e86\u7535\u5b50\u5143\u4ef6\u5e76\u63d0\u4f9b\u4e86\u8fde\u63a5\u7684\u5e73\u53f0\u3002PCB\u5236\u9020\u4e2d\u6d89\u53ca\u591a\u4e2a\u91cd [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"What Are the Different Types of PCB Milling Operations? Milling Cutter Selection and Interlayer Connection Methods","description":"What do you need to know about PCB milling machines and interlayer connections? This article explains the different types of milling processes, milling cutter types, and how to select interlayer connection methods for PCBs. It also highlights common misconceptions to help you avoid easily overlooked details."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[406,26],"tags":[],"class_list":["post-3640","post","type-post","status-publish","format-standard","hentry","category-pcb-manufacturing","category-blog"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/3640","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=3640"}],"version-history":[{"count":5,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/3640\/revisions"}],"predecessor-version":[{"id":19976,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/3640\/revisions\/19976"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=3640"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=3640"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=3640"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}