{"id":3431,"date":"2024-09-04T18:06:09","date_gmt":"2024-09-04T10:06:09","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=3431"},"modified":"2026-10-02T19:43:38","modified_gmt":"2026-10-02T11:43:38","slug":"how-to-prevent-smt-oem-defects","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/how-to-prevent-smt-oem-defects\/","title":{"rendered":"How to Prevent SMT OEM Defects"},"content":{"rendered":"<p>In SMT production, particularly in the OEM (Original Equipment Manufacturer) sector, certain common defects may occur, which can affect product quality and performance.<\/p>\n<p>This article will discuss how to prevent SMT OEM defects and how to use X-ray inspection technology to improve quality control.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-large wp-image-8914\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/01\/what-is-a-smt-machine-1024x576.jpg\" alt=\"Samsung SMT Placement Machine\" width=\"1024\" height=\"576\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/01\/what-is-a-smt-machine-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/01\/what-is-a-smt-machine-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/01\/what-is-a-smt-machine-768x432.jpg 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/01\/what-is-a-smt-machine.jpg 1440w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<h2>Preventing OEM Defects in SMT Component Production<\/h2>\n<p>OEM parts manufactured using SMT may exhibit the following four common defects, which can lead to poor performance and reliability in electronic products. Below are some common issues and their corresponding solutions.<\/p>\n<h3>1. Poor wettability<\/h3>\n<p>Poor wetting refers to a situation during the soldering process where the solder fails to fully wet the joint area, resulting in an unstable bond that may lead to soldering defects or electrical connection issues.<\/p>\n<p><strong>Solution:<\/strong><\/p>\n<ul>\n<li>Select the appropriate welding process parameters.<\/li>\n<li>Take measures to prevent contamination on the surfaces of the substrate and components to ensure they remain clean.<\/li>\n<li>Select the appropriate solder to ensure proper wetting.<\/li>\n<li>Set appropriate welding temperatures and times to ensure adequate wetting during welding.<\/li>\n<\/ul>\n<h3>2. Bridging<\/h3>\n<p>In SMT casting production, bridging refers to an excess of solder that causes a connection between adjacent solder joints, which may result in a short circuit.<\/p>\n<p><strong>Solution:<\/strong><\/p>\n<ul>\n<li>During the solder paste printing process, it is important to prevent edge defects and sagging to ensure even solder paste distribution.<\/li>\n<li>When designing the dimensions of the soldering area on a PCBA backplane, the design requirements for contract manufacturing must be taken into account.<\/li>\n<li>Control the installation location of the components to ensure they are within the specified range.<\/li>\n<li>Strict requirements are imposed on the trace spacing on the PCBA substrate and the precision of the solder mask application.<\/li>\n<li>Establish appropriate welding process parameters to ensure proper solder distribution.<\/li>\n<\/ul>\n<h3>3. Cracking<\/h3>\n<p>After soldering, microcracks may appear in SMD (surface-mount devices) due to uneven solidification or shrinkage stresses generated in the solder joints during the cooling process.<\/p>\n<p><strong>Solution:<\/strong><\/p>\n<ul>\n<li>In the design of surface-mount products, consider reducing the thermal expansion gap to minimize the effects of thermal stress.<\/li>\n<li>Set the heating and cooling conditions correctly to ensure that the solder cools evenly.<\/li>\n<li>Use solder with good ductility to reduce the risk of solder joint cracking.<\/li>\n<\/ul>\n<h3>4. Solder balls<\/h3>\n<p>Solder balls refer to small, granular balls of solder that form around solder joints when the solder disperses during the heating process.<\/p>\n<p><strong>Solution:<\/strong><\/p>\n<ul>\n<li>Control the heating rate during the welding process to prevent overheating.<\/li>\n<li>Prevent solder from sagging or shifting out of place, and ensure even solder distribution.<\/li>\n<li>Use solder paste that meets SMT processing requirements to prevent solder contamination.<\/li>\n<li>Implement the appropriate preheating process based on the type of weld to ensure proper distribution of the filler metal.<\/li>\n<\/ul>\n<hr \/>\n<h2>Principles and Applications of X-Ray Non-Destructive Testing<\/h2>\n<p>X-ray inspection technology plays a crucial role in SMT assembly production, particularly in inspecting solder joint quality and BGA (ball grid array) soldering.<\/p>\n<h3>1. How X-ray Machines Work<\/h3>\n<p>In X-ray inspection, an X-ray tube is used to irradiate a circuit board; the X-rays pass through the board and are detected by a detector located below it. The X-rays are absorbed at the solder joints and in the soldered areas, producing a clear image that can be used for solder joint analysis.<\/p>\n<h3>2. X-ray Technology<\/h3>\n<p>X-ray technology has advanced to the point where it can perform 3D inspections, making it particularly suitable for inspecting double-sided soldered boards and BGA solder joints.<\/p>\n<p>X-ray inspection can be used to evaluate the dimensions, shape, and characteristics of welds, while automatically detecting unacceptable welds. This is critical for ensuring the quality of the welds and the reliability of the product.<\/p>\n<h3>3. X-rays Replace ICT<\/h3>\n<p>As PCB density increases and space for ICT (In-Circuit Testing) becomes more limited, X-ray inspection technology is increasingly being used as an alternative to ICT testing. X-ray inspection can assess the quality of solder joints, including their distribution, solder volume, and other invisible defects. This helps improve quality control and reduce the costs associated with fault diagnosis and repairs.<\/p>\n<p>In electronics manufacturing, SMT OEM defects and X-ray inspection are critical areas of quality control. By implementing appropriate preventive measures, the occurrence of defects can be reduced, while X-ray inspection technology can be used to detect and correct potential issues. Together, these methods ensure the high quality and reliability of manufactured electronic products.<\/p>\n<p>By adopting these methods, electronics manufacturers can produce more reliable products, improve customer satisfaction, and remain competitive in the market.<\/p>\n<hr \/>\n<h2>Frequently Asked Questions<\/h2>\n<p><strong>1. What is an SMT OEM defect?<\/strong><\/p>\n<p>SMT OEM defects are defects that may occur during the SMT manufacturing process and can lead to quality and performance issues in electronic products. These defects include poor wetting, bridging, cracking, and solder balls.<\/p>\n<p><strong>2. Why is X-ray inspection important in SMT production?<\/strong><\/p>\n<p>X-ray inspection can be used to evaluate solder joint quality, detect invisible solder joint defects, and serve as an alternative to ICT testing. This helps improve quality control and reduce the costs associated with fault diagnosis and repairs.<\/p>\n<p><strong>3. What is ICT testing?<\/strong><\/p>\n<p>ICT testing is a non-destructive in-circuit test used to detect connection and electrical issues on printed circuit boards. As PCB density increases, X-ray inspection is increasingly being used as an alternative to ICT testing.<\/p>\n<p><strong>4. How do you select the appropriate welding process parameters?<\/strong><\/p>\n<p>Selecting the appropriate soldering process parameters requires consideration of soldering temperature, time, solder, and surface treatment. These parameters should be adjusted based on the specific application and components.<\/p>\n<p><strong>5. How can defects be reduced in SMT production?<\/strong><\/p>\n<p>Preventive measures, including proper process control, design, and material selection, are necessary to reduce the occurrence of defects. Regular inspections and X-ray examinations also help improve product quality.<\/p>\n<p>The above answers some common questions about SMT OEM defects and X-ray inspection. If you have any further questions or need more information, please feel free to contact us.<\/p>","protected":false},"excerpt":{"rendered":"<p>\u5728SMT\u751f\u4ea7\u4e2d\uff0c\u7279\u522b\u662fOEM\uff08\u539f\u59cb\u8bbe\u5907\u5236\u9020\u5546\uff09\u9886\u57df\uff0c\u53ef\u80fd\u4f1a\u51fa\u73b0\u4e00\u4e9b\u5e38\u89c1\u7684\u7f3a\u9677\uff0c\u8fd9\u4e9b\u95ee\u9898\u53ef\u80fd\u4f1a\u5f71\u54cd\u4ea7\u54c1\u7684\u8d28\u91cf\u548c\u6027 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":199,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"How to Prevent SMT OEM Defects","description":"How can common defects in SMT contract manufacturing be prevented? This article analyzes the causes of poor wetting, bridging, solder balls, and solder joint cracks one by one, and explains the application of X-ray inspection in detecting hidden defects."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[26],"tags":[34],"class_list":["post-3431","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-smt"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/3431","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=3431"}],"version-history":[{"count":1,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/3431\/revisions"}],"predecessor-version":[{"id":19386,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/3431\/revisions\/19386"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media\/199"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=3431"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=3431"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=3431"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}