Every industry has its own technical terminology, and the PCB industry is no exception. These English terms for PCB defects cover a wide range of common defects and issues in the industry. From internal to external aspects, and from materials to manufacturing processes, these terms capture the various factors that can affect the quality of printed circuit boards. They provide a common language for identifying, documenting, and resolving various issues in PCB production. These terms cover a wide range of issues, from open circuits, short circuits, and over-etching to pattern misalignment, via problems, plating defects, and various cosmetic and electrical issues.<\/p>\n
Below are these terms listed in English alphabetical order:<\/p>\n
1. Bevelling defect \u2013 Poor beveling
\n2. Blistering (Copper Plating) \u2013 Blistering of the plating layer
\n3. Blistering (HSAL) \u2013 Blistering in Tin Plating
\n4. Block hole \u2013 Plug the hole
\n5. Board contamination \u2013 Board contamination
\n6. Broken annular ring \u2013 Broken pad
\n7. Burr \u2013 The Edge
\n8. Burnt \u2013 Charred Yellow
\n9. Burr \u2013 The Edge
\n10. Chamfering \u2013 Beveling
\n11. Copper in NPTH \u2013 Non-plated through-holes contain copper
\n12. Copper\/Nickel Peel-Off \u2013 Copper and Nickel Peel-Off
\n13. Copper residue \u2013 Copper scraps
\n14. Copper thickness exceeds specifications \u2013 Copper plating thickness exceeds specifications
\n15. Crazing \u2013 White Spots
\n16. Cu plating \u2013 Copper plating
\n17. Damaged board \u2013 Board damage
\n18. Date code \u2013 Date code
\n19. Delamination (Raw Material) \u2013 Delamination (Raw Material)
\n20. Dewetting \u2013 Lack of Solder Adhesion
\n21. D\/F Misregistration \u2013 Dry Film Misalignment
\n22. D\/F Peel-off \u2013 Dry Film Peel-off
\n23. D\/F Residue \u2013 Dry Film Fragments
\n24. Dewetting \u2013 Poor Solder Coverage
\n25. Engineering Evaluation \u2013 Engineering Test Evaluation
\n26. Extra hole \u2013 porous
\n27. Extra opening \u2013 Opening multiple windows
\n28. Expose trace \u2013 Expose traces
\n29. Excessive inner core \u2013 Inner layer mismatch
\n30. Excessive inner core \u2013 Inner layer too thick
\n31. Foreign material \u2013 Foreign matter in the inner layer
\n32. G\/F ENIG Cu \u2013 Jumper Plating (G\/F ENIG Cu)
\n33. Gold discoloration \u2013 Poor color of the gold surface
\n34. Gold Finger Discoloration \u2013 Poor Color on the Gold Finger
\n35. Gold surface \u2013 Gold surface
\n36. Gold surface \u2013 Gold surface
\n37. Gold Finger Peel-Off \u2013 Gold Finger Peel-Off
\n38. Gold Finger Peel-Off \u2013 Gold Finger Peel-Off
\n39. Green oil \u2013 Green oil
\n40. Green oil \u2013 Green oil
\n41. HSAL \u2013 Tin Plating
\n42. HSAL \u2013 Solder-Plated
\n43. Hole breakout \u2013 Hole collapse
\n44. Oversized hole \u2013 Large hole diameter
\n45. Hole roughness (copper plating) \u2013 Hole roughness (copper plating)
\n46. Hole roughness (mechanical drilling) \u2013 Hole roughness (mechanical drilling)
\n47. Hole shift \u2013 Off-center hole
\n48. Hole undersize \u2013 Hole diameter is too small
\n49. Hole void (Cu) \u2013 Hole wall void (copper)
\n50. IC barrier \u2013 IC barrier
\n51. Illegible date code \u2013 Unclear date code
\n52. Illegible legend \u2013 Unclear legend
\n53. Illegible marking (exposure) \u2013 Unclear marking (exposure)
\n54. Impedance out of specification \u2013 Impedance exceeds specifications
\n55. Incomplete drilling \u2013 Hole not fully drilled
\n56. Incomplete S\/M plugging \u2013 Incomplete plugging of the hole
\n57. Impedance out of specification \u2013 Impedance exceeds specifications
\n58. Incomplete S\/M plugging \u2013 Incomplete plugging of the hole
\n59. Inner open \u2013 Inner open circuit
\n60. Inner over-etching \u2013 Excessive etching of inner layers
\n61. Inner pattern misalignment \u2013 Misalignment of the inner pattern
\n62. Inner short \u2013 Internal short circuit
\n63. Layer-to-layer misregistration \u2013 Misalignment between layers
\n64. Legend in Hole \u2013 Characters in a Hole
\n65. Legend on pad \u2013 Character on pad
\n66. Legend peel-off \u2013 Character peeling off
\n67. Measling (HSAL) \u2013 White Spots (Tin Plating)
\n68. Measling (Pressing) \u2013 White Spots (Pressing)
\n69. Measling (Pressing) \u2013 White Spots (Pressing Marks)
\n70. Microsection (engineering) \u2013 Microsection (for engineering testing)
\n71. Microsection (outgoing) \u2013 Microsection (outgoing)
\n72. Micro short \u2013 Micro short circuit
\n73. Milling Defects \u2013 Defects Caused by Milling
\n74. Missing chamfer \u2013 Missing bevel
\n75. Missing legend ink \u2013 Missing characters
\n76. Missing routing \u2013 Missing bell
\n77. Missing routing \u2013 Missing bell
\n78. Ni\/Cu exposure \u2013 Exposure to nickel and copper
\n79. Nick (G\/F) \u2013 The Gap
\n80. Nick \/ void on pad \u2013 notch \/ pinhole
\n81. Nick \/ void on trace \u2013 Broken lines, gaps in the trace
\n82. Non-wetting \u2013 No solder adhesion
\n83. Outer open \u2013 Outer open circuit
\n84. Outer over-etching \u2013 Excessive etching of the outer layer
\n85. Outer short \u2013 Outer circuit break
\n86. Excessive chamfering \u2013 Excessive bevel
\n87. Over-exposure \u2013 Overexposure
\n88. Overthickness \u2013 Plate is too thick
\n89. Oxidation under the solder mask \u2013 Oxidation under the green solder mask
\n90. Pad peel-off \u2013 Pad detachment
\n91. Pattern misregistration \u2013 Pattern misalignment
\n92. Pink ring \u2013 Pink circle
\n93. Pink ring \u2013 Pink circle
\n94. Pink ring \u2013 Pink circle
\n95. Poor ENTEK \u2013 Poor Coating
\n96. Poor IC barrier \u2013 Defective IC barrier
\n97. Poor rework \u2013 Rework<\/p>\n
These English terms for PCB defects form a comprehensive system for fault identification and problem-solving, helping to promptly detect and correct defects during the PCB manufacturing process and ensuring the production of high-quality printed circuit boards. Whether during the selection of raw materials, the manufacturing process, engineering testing, or final inspection, these terms provide a clear reference framework to help professionals in the PCB industry ensure that their products meet the expected quality standards.<\/p>","protected":false},"excerpt":{"rendered":"
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