{"id":2892,"date":"2026-10-19T17:00:00","date_gmt":"2026-10-19T09:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2892"},"modified":"2026-10-08T20:14:55","modified_gmt":"2026-10-08T12:14:55","slug":"pcb-laminate-types","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/pcb-laminate-types\/","title":{"rendered":"A PCB Manufacturer Explains the Types of PCB Materials"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<h2>1. First, determine what the panel is made of<\/h2>\n<p>Regardless of what it\u2019s called, a copper-clad laminate (CCL) consists of three parts:<\/p>\n<ul>\n<li><strong>Reinforcing Materials<\/strong>: Provides mechanical strength, such as fiberglass cloth, paper, or nonwoven fabric, or none (pure resin\/film).<\/li>\n<li><strong>Resin System<\/strong>: Binds reinforcing materials and provides insulation, such as epoxy resin, phenolic resin, polyimide, PTFE, BT, and hydrocarbon resins.<\/li>\n<li><strong>Copper foil<\/strong>: The conductive layer applied to the surface is classified into two types: electrolytic copper (ED) and rolled copper (RA).<\/li>\n<\/ul>\n<p>The reason the classification of sheet materials seems so confusing is because<strong>They can be classified by resin type, reinforcing material, flame retardancy, or performance characteristics.<\/strong>\u2014Since these four dimensions overlap, a single board can belong to several categories at once. Below, we\u2019ll break it down by dimension one by one.<\/p>\n<p>PCBs (Printed Circuit Boards) are an indispensable component of modern electronic devices, playing a key role in connecting and supporting electronic components. In the PCB manufacturing process, selecting the appropriate substrate is crucial. This article will discuss in detail<a href=\"\/en\/capabilities\/pcb-materials\/\">PCB Sheets<\/a>The types and classifications of [item], to help you better understand their characteristics and uses.<\/p>\n<h2>2. Differences in Materials: Organic and Inorganic Materials<\/h2>\n<h3>2.1 Organic Materials<\/h3>\n<p>Organic PCB substrates are widely used in electronics manufacturing and primarily include the following types:<\/p>\n<ol>\n<li><strong>Phenolic Resin Board<\/strong>: It has high heat resistance and mechanical strength, making it suitable for high-temperature environments.<\/li>\n<li><strong>Fiberglass\/Epoxy Resin Panel<\/strong>: This type of laminate combines the properties of fiberglass and epoxy resin, offering excellent electrical performance and mechanical strength.<\/li>\n<li><strong>Polyimide Board<\/strong>: PCBs made of polyimide are heat-resistant and suitable for use in extreme conditions.<\/li>\n<li><strong>BT\/Epoxy Board<\/strong>: Composite panels made of BT and epoxy resin offer excellent electrical properties and mechanical stability.<\/li>\n<\/ol>\n<p>Comparison of Parameters for the Four Major Organic Materials:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Material<\/th>\n<th>Tg (\u00b0C)<\/th>\n<th>Dk (1 MHz)<\/th>\n<th>Temperature Resistance<\/th>\n<th>Cost<\/th>\n<th>Typical Applications<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Phenolic Resin (FR-1\/FR-2)<\/td>\n<td>105\u2013130<\/td>\n<td>4.5\u20135.5<\/td>\n<td>Generally<\/td>\n<td>\u4f4e<\/td>\n<td>Single-sided circuit boards, home appliances, toys<\/td>\n<\/tr>\n<tr>\n<td>Epoxy Glass Cloth (FR-4)<\/td>\n<td>130\u2013180<\/td>\n<td>4.2\u20134.8<\/td>\n<td>\u597d<\/td>\n<td>\u4e2d<\/td>\n<td>General-purpose multilayer boards, the most widely used<\/td>\n<\/tr>\n<tr>\n<td>Polyimide (PI)<\/td>\n<td>250 or more<\/td>\n<td>3.4\u20133.8<\/td>\n<td>\u4f18<\/td>\n<td>\u9ad8<\/td>\n<td>Flexible Circuits, Aerospace<\/td>\n<\/tr>\n<tr>\n<td>BT \/ BT-Epoxy<\/td>\n<td>180\u2013230<\/td>\n<td>3.6\u20134.2<\/td>\n<td>\u4f18<\/td>\n<td>\u9ad8<\/td>\n<td>IC carrier boards, high-frequency modules<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<h3>2.2 Inorganic Materials<\/h3>\n<p>PCB boards made of inorganic materials are typically used in applications that require heat dissipation, primarily including the following:<\/p>\n<ol>\n<li><strong>Aluminum Sheet<\/strong>: Aluminum substrates offer excellent heat dissipation and are suitable for high-power electronic devices.<\/li>\n<li><strong>Copper-Invar (non-expanding steel)-copper sheet<\/strong>: This type of panel construction can withstand temperature fluctuations and is commonly used in applications involving special environmental conditions.<\/li>\n<li><strong>Ceramic Tiles<\/strong>: Ceramic PCBs offer excellent insulation properties and are suitable for high-frequency circuits.<\/li>\n<\/ol>\n<p>Copper-Invar-Copper (CIC) deserves a bit more explanation: its structure is<strong>Copper\u2014Invar alloy (an iron-nickel alloy with an extremely low CTE)\u2014Copper<\/strong>This three-layer composite features an Invar alloy core that reduces the overall coefficient of thermal expansion to a level close to that of ceramics or silicon. It is primarily used as a heat-dissipating substrate and lead frame for chip packaging. Its value lies not in thermal conductivity but in<strong>CTE Matching<\/strong>\u3002<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1920\" height=\"1080\" class=\"alignnone size-large wp-image-12878\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2026\/01\/pcb-material-warehouse.webp\" alt=\"PCB Board Warehouse\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2026\/01\/pcb-material-warehouse.webp 1920w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2026\/01\/pcb-material-warehouse-300x169.webp 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2026\/01\/pcb-material-warehouse-1024x576.webp 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2026\/01\/pcb-material-warehouse-768x432.webp 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2026\/01\/pcb-material-warehouse-1536x864.webp 1536w\" sizes=\"auto, (max-width: 1920px) 100vw, 1920px\" \/><\/p>\n<h2>3. Classification of Fire-Resistant Panels<\/h2>\n<p>Flame-retardant PCBs are PCBs that possess certain flame-retardant properties. The following are some common types of flame-retardant PCBs:<\/p>\n<ol>\n<li><strong>FR-1 Board<\/strong>: A paper-based substrate with certain flame-retardant properties.<\/li>\n<li><strong>FR-2 Board<\/strong>: Similar to the FR-1, it also uses a paper substrate and is suitable for general-purpose applications.<\/li>\n<li><strong>FR-3 Board<\/strong>: Although it is also a paper-based substrate, it offers better flame-retardant properties.<\/li>\n<li><strong>FR-5 Board<\/strong>: This is an epoxy resin board, commonly used in the manufacture of multilayer boards. CEM-1 paper-faced fiberboard and composite epoxy resin copper foil substrates (CEM-2 through CEM-5) also fall into this category.<\/li>\n<li><strong>94V-0 Flame-Retardant Board<\/strong>: It has high flame-retardant properties and will not ignite spontaneously. A 94HB non-flame-retardant board will extinguish within approximately 5 seconds after the heat source is removed.<\/li>\n<\/ol>\n<p>Complete Comparison of the FR Series and the CEM Series:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Grade<\/th>\n<th>Reinforcing Materials<\/th>\n<th>Resin<\/th>\n<th>Features<\/th>\n<th>Applications<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>FR-1<\/td>\n<td>\u7eb8<\/td>\n<td>Phenolic resin<\/td>\n<td>Low cost, die-cut<\/td>\n<td>Single-sided home appliance panels<\/td>\n<\/tr>\n<tr>\n<td>FR-2<\/td>\n<td>\u7eb8<\/td>\n<td>Phenolic resin<\/td>\n<td>Performs slightly better than the FR-1<\/td>\n<td>Standard Single-Sided Board<\/td>\n<\/tr>\n<tr>\n<td>FR-3<\/td>\n<td>\u7eb8<\/td>\n<td>Epoxy<\/td>\n<td>Superior flame resistance compared to phenolic paper-based materials<\/td>\n<td>Single-sided board<\/td>\n<\/tr>\n<tr>\n<td>FR-4<\/td>\n<td>Fiberglass Cloth<\/td>\n<td>Epoxy<\/td>\n<td>Best overall performance; used in the largest quantities<\/td>\n<td>Double-Sided Boards and Multilayer Boards<\/td>\n<\/tr>\n<tr>\n<td>FR-5<\/td>\n<td>Fiberglass Cloth<\/td>\n<td>Epoxy (High Tg)<\/td>\n<td>Better heat resistance than FR-4<\/td>\n<td>Multilayer boards, high-temperature environments<\/td>\n<\/tr>\n<tr>\n<td>CEM-1<\/td>\n<td>Paper + Fiberglass Fabric Surface<\/td>\n<td>Epoxy<\/td>\n<td>Its performance falls between that of paper-based materials and FR-4<\/td>\n<td>Single-sided board, cost-sensitive<\/td>\n<\/tr>\n<tr>\n<td>CEM-3<\/td>\n<td>Glass Fiber Nonwoven Fabric + Glass Fiber Woven Fabric<\/td>\n<td>Epoxy<\/td>\n<td>Can be die-cut; electrical properties similar to FR-4<\/td>\n<td>Cost-Effective Alternatives to FR-4<\/td>\n<\/tr>\n<tr>\n<td>CEM-5<\/td>\n<td>Fiberglass Cloth<\/td>\n<td>Polyester\/Epoxy<\/td>\n<td>Special-Purpose<\/td>\n<td>On Demand<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<h2>4. Classification of Reinforcing Materials for Substrate Materials<\/h2>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-6441\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-circuit-board-materials-1.jpg\" alt=\"PCB Sheets\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-circuit-board-materials-1.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-circuit-board-materials-1-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-circuit-board-materials-1-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-circuit-board-materials-1-768x432.jpg 768w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>Depending on the type of reinforcing material used, PCB laminates can be classified into the following five major categories:<\/p>\n<ol>\n<li><strong>Paper Substrate<\/strong>: Made with paper-based reinforcing materials, it is typically used for general-purpose applications.<\/li>\n<li><strong>Fiberglass Cloth Substrate<\/strong>: This type of panel uses fiberglass cloth as a reinforcing material and has good mechanical strength.<\/li>\n<li><strong>Composite Substrates (CEM Series)<\/strong>: Composite substrates use different types of reinforcing materials and are suitable for a wide range of applications.<\/li>\n<li><strong>Laminated Multilayer Board Substrate<\/strong>: This type of panel is typically used in the manufacture of multilayer panels and has a complex structure.<\/li>\n<li><strong>Special Materials Substrate<\/strong>: Special substrate materials, such as ceramic and metal core substrates, possess unique properties.<\/li>\n<\/ol>\n<p>\"Laminated multilayer substrate\" refers to the substrate used in the HDI lamination process.<strong>Resin-Coated Copper Foil (RCC)<\/strong>\u6216<strong>Prepreg<\/strong>\u2014They do not have a separate reinforcing framework; instead, the resin itself forms a film, allowing them to be made very thin (30\u201380 \u03bcm). They serve as the base material for laser drilling and fine lines. These materials are the key factor that distinguishes HDI and IC substrates from conventional multilayer boards.<\/p>\n<h2>5. Classification of Flame-Retardant Properties<\/h2>\n<p>PCB materials are classified by their flame-retardant properties into two main categories: flame-retardant (UL94 V-0 and UL94 V-1) and non-flame-retardant (UL94 HB). In recent years, with growing environmental awareness, a new type of eco-friendly, brominated-free flame-retardant CCL has emerged.<\/p>\n<p>Actual criteria for each UL 94 rating:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Level<\/th>\n<th>Criteria for Determination<\/th>\n<th>Note<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>94 HB<\/td>\n<td>Horizontal burning; when the thickness is \u22653 mm, the burning rate is \u226440 mm\/min<\/td>\n<td>Lowest rating, non-flame-retardant<\/td>\n<\/tr>\n<tr>\n<td>94 V-2<\/td>\n<td>Vertical combustion; afterglow \u2264 30 s per test; burning droplets are permitted<\/td>\n<td>Poor flame resistance<\/td>\n<\/tr>\n<tr>\n<td>94 V-1<\/td>\n<td>Vertical burning; afterglow \u2264 30 seconds each time; no burning droplets ignited the cotton<\/td>\n<td>Moderate flame resistance<\/td>\n<\/tr>\n<tr>\n<td>94 V-0<\/td>\n<td>Vertical combustion; afterglow \u2264 10 s per test; total afterglow from 5 tests \u2264 50 s<\/td>\n<td>The De Facto Standard in the PCB Industry<\/td>\n<\/tr>\n<tr>\n<td>94 5VA \/ 5VB<\/td>\n<td>More Rigorous Vertical and Horizontal Fire Tests<\/td>\n<td>Applications with Special, Stringent Requirements<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The criteria for determining whether a sheet is halogen-free are<strong>Bromine content \u2264 900 ppm, chlorine content \u2264 900 ppm, total halogen content \u2264 1,500 ppm<\/strong>(According to IEC 61249-2-21). It replaces bromine-based flame retardants with phosphorus- or nitrogen-based alternatives. The advantage is that it produces fewer dioxin-like substances during combustion; the drawback is that material costs increase and certain performance parameters (such as Tg and resistance to damp heat) must be reevaluated.<\/p>\n<h2>6. Performance Classification<\/h2>\n<p>Depending on the varying performance requirements of electronic products, PCB materials can also be classified by performance characteristics, including general-purpose CCL, low-dielectric-constant CCL, high-heat-resistance CCL (where the L value of standard boards is 150\u00b0C or higher), and low-thermal-expansion-coefficient CCL (typically used for packaging substrates), among other types.<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Performance Category<\/th>\n<th>Key Metrics<\/th>\n<th>Typical Values<\/th>\n<th>Applications<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>General Performance CCL<\/td>\n<td>Tg 130\u2013140 \u00b0C, Dk 4.5<\/td>\n<td>Standard FR-4<\/td>\n<td>General Electronics<\/td>\n<\/tr>\n<tr>\n<td>High-Temperature-Resistant CCL<\/td>\n<td>Tg \u2265 150 \u00b0C (high Tg values can reach 170\u2013180 \u00b0C)<\/td>\n<td>Td \u2265 330 \u00b0C<\/td>\n<td>Lead-free soldering, multilayer boards<\/td>\n<\/tr>\n<tr>\n<td>Low-Dielectric-Constant CCL<\/td>\n<td>Dk 2.5\u20133.5<\/td>\n<td>Df \u2264 0.005<\/td>\n<td>High-Frequency, High-Speed, 5G<\/td>\n<\/tr>\n<tr>\n<td>Low-Thermal-Expansion CCL<\/td>\n<td>CTE (Z-axis) \u2264 30 ppm\/\u00b0C<\/td>\n<td>Low CTE, high modulus<\/td>\n<td>IC carrier boards, high-density BGA boards<\/td>\n<\/tr>\n<tr>\n<td>High Thermal Conductivity CCL<\/td>\n<td>Thermal conductivity \u2265 1.0 W\/(m\u00b7K)<\/td>\n<td>Metal Matrix, Ceramic Filler<\/td>\n<td>LEDs, Power Supplies, Automotive<\/td>\n<\/tr>\n<tr>\n<td>High CTI CCL<\/td>\n<td>CTI \u2265 400 V<\/td>\n<td>Resistance to Electrical Leakage and Tracking<\/td>\n<td>High Voltage, Home Appliance Safety Standards<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1920\" height=\"530\" class=\"alignnone size-large wp-image-12420\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/11\/materials.webp\" alt=\"PCB Materials\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/11\/materials.webp 1920w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/11\/materials-300x83.webp 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/11\/materials-1024x283.webp 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/11\/materials-768x212.webp 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/11\/materials-1536x424.webp 1536w\" sizes=\"auto, (max-width: 1920px) 100vw, 1920px\" \/><\/p>\n<h2>7. Selecting Models Based on Application Scenarios<\/h2>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-6433\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-circuit-board-materials.jpg\" alt=\"PCB Materials\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-circuit-board-materials.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-circuit-board-materials-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-circuit-board-materials-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-circuit-board-materials-768x432.jpg 768w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>When selecting a model, it\u2019s faster to start with the specific use case. Here\u2019s a quick reference chart:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Scene<\/th>\n<th>Recommended Panels<\/th>\n<th>Key Metrics<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Consumer Electronics Motherboards<\/td>\n<td>FR-4 (Tg \u2265 150)<\/td>\n<td>Cost, Machinability<\/td>\n<\/tr>\n<tr>\n<td>Lead-Free Soldering Products<\/td>\n<td>High Tg FR-4<\/td>\n<td>Tg \u2265 170 \u00b0C, Td \u2265 340 \u00b0C<\/td>\n<\/tr>\n<tr>\n<td>Mobile HDI<\/td>\n<td>High Tg FR-4 \/ BT-class<\/td>\n<td>Low CTE, thin dielectric, laser-drillable<\/td>\n<\/tr>\n<tr>\n<td>5G Base Station AAU<\/td>\n<td>Hydrocarbon ceramics, PTFE<\/td>\n<td>Df \u2264 0.005, Dk stable<\/td>\n<\/tr>\n<tr>\n<td>Millimeter Wave \/ Radar<\/td>\n<td>PTFE-Ceramic Filled<\/td>\n<td>Df \u2264 0.003, low water absorption<\/td>\n<\/tr>\n<tr>\n<td>LED Lighting<\/td>\n<td>Aluminum Substrate<\/td>\n<td>Thermal Conductivity, Dielectric Strength<\/td>\n<\/tr>\n<tr>\n<td>High-Power Power Supply<\/td>\n<td>Thick Copper FR-4 \/ Metal-Clad<\/td>\n<td>Current-carrying capacity, heat dissipation, voltage withstand<\/td>\n<\/tr>\n<tr>\n<td>Flexibility \/ Bending<\/td>\n<td>PI Substrate (FCCL)<\/td>\n<td>Bend Life, Rolled Copper<\/td>\n<\/tr>\n<tr>\n<td>IC Package Substrate<\/td>\n<td>BT \/ ABF<\/td>\n<td>Low CTE, Fine-Line Capabilities<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>For specific material systems and high-frequency selection methods, see<a href=\"\/en\/blog\/pcb-circuit-board-materials\/\">PCB Materials<\/a>\u4e0e<a href=\"\/en\/blog\/high-frequency-microwave-board\/\">High-Frequency Microwave Board Selection Guide<\/a>, For the Rogers series parameters, see<a href=\"\/en\/capabilities\/pcb-materials\/rogers\/\">Rogers Sheets<\/a>\u3002<\/p>\n<h2>8. Procurement and Acceptance: Four Parameters That Must Be Included in the Specifications<\/h2>\n<p>It is not enough to simply write \u201cFR-4\u201d when placing an order; you must specify at least four items:<\/p>\n<ul>\n<li><strong>Tg and Td<\/strong>: The glass transition temperature and decomposition temperature determine how many lead-free reflow cycles the material can withstand.<\/li>\n<li><strong>Dk and Df<\/strong>: Must be specified when there are impedance and high-frequency requirements, and the test frequency must be indicated.<\/li>\n<li><strong>Copper Foil Types and Thicknesses<\/strong>: Electrolytic copper or rolled copper; what is the thickness; is it low-profile (for high-frequency applications)?<\/li>\n<li><strong>Flame Retardancy Ratings and Environmental Requirements<\/strong>: UL94 V-0, halogen-free, and compliance with RoHS\/REACH.<\/li>\n<\/ul>\n<p>During acceptance inspection, verify that the UL certification numbers for the circuit boards match the batch COC; for high-frequency boards, also conduct random inspections of Dk and dielectric thickness. For a complete list of capabilities, see<a href=\"\/en\/capabilities\/\">PCB Manufacturing Capabilities<\/a>\u3002<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"255\" height=\"155\" class=\"alignnone size-large wp-image-6507\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/Mixed-Laminate-Multilayer-PCBs.webp\" alt=\"Hybrid Pressure Plate\" \/><\/p>\n<h2>Conclusion<\/h2>\n<p>Choosing the right PCB material is critical to the performance and reliability of electronic products. Understanding the different types of PCB materials, as well as their characteristics and applications, can help you make informed decisions in electronics manufacturing. If you need more information about PCB materials, please feel free to consult our experts.<\/p>\n<h2>Frequently Asked Questions (FAQs)<\/h2>\n<h3>1. Why is the selection of PCB material important?<\/h3>\n<p>Choosing the right PCB material directly affects the performance and reliability of electronic products. Different applications require different types of materials.<\/p>\n<h3>2. What is the difference between organic and inorganic PCBs?<\/h3>\n<p>Organic panels are primarily used for general applications, while inorganic panels are typically used in situations where heat dissipation is required.<\/p>\n<h3>3. What are flame-retardant PCB panels?<\/h3>\n<p>Flame-retardant PCB laminates possess a certain degree of flame-retardant properties and can continue to burn on their own after the heat source is removed.<\/p>\n<h3>4. Why have eco-friendly flame-retardant CCLs emerged in recent years?<\/h3>\n<p>Green-type flame-retardant CCL is bromine-free, making it more environmentally friendly and compliant with modern environmental standards.<\/p>\n<h3>5. How do I choose the right PCB material for my application?<\/h3>\n<p>When selecting PCB materials, factors such as the application scenario, performance requirements, and budget should be taken into account; it is best to seek advice from a professional.<\/p>\n<h3>6. What does \u201cFR\u201d stand for in FR-4?<\/h3>\n<p>FR stands for \u201cFlame Retardant,\u201d and the number that follows is a material classification code established by NEMA (the National Electrical Manufacturers Association), representing different combinations of reinforcing materials and resins. Note that FR-4 does not refer to a specific grade; FR-4 products from different manufacturers and series can vary significantly in terms of Tg, Dk, and Df. For high-frequency or high-reliability applications, a specific grade must be specified.<\/p>\n<h3>7. Is a high Tg always better than a normal Tg?<\/h3>\n<p>Not necessarily; it depends on the requirements. High-Tg boards offer better heat resistance (they can withstand lead-free reflow and multiple repairs), but they are typically more brittle, have slightly poorer drillability, and are more expensive. If the product is only subject to leaded soldering, has few layers, and has no high-temperature requirements, standard Tg (130\u2013140 \u00b0C) is perfectly sufficient, and there\u2019s no need to spend extra money.<\/p>\n<h3>8. Can halogen-free boards be used together with standard boards?<\/h3>\n<p>Mixed lamination is possible, but three points should be noted: First, the lamination parameters (temperature, pressure, and time) for halogen-free and standard materials may differ and must be adjusted according to the material manufacturers\u2019 recommendations; second, if there is a significant difference in the CTE between the two materials, the risk of warping increases after mixed lamination; third, mixed lamination increases process complexity and costs. If there are no mandatory environmental requirements for the finished product, it is safer to use standard materials uniformly for the entire board.<\/p>\n<h3>9. Why is the test frequency specified for the Dk of the panel?<\/h3>\n<p>This is because Dk varies with frequency (dispersion). The Dk measured for the same material at 1 MHz may be 10\u201320% higher than that measured at 10 GHz. If a design is intended to operate at 10 GHz but uses a Dk value measured at 1 MHz to calculate impedance, the results will inevitably be inaccurate. Therefore, the specifications must clearly state the test method (e.g., IPC-TM-650 2.5.5.5) and the test frequency.<\/p>\n<h3>10. How much does the type of copper foil affect high-frequency performance?<\/h3>\n<p>It is significant. At high frequencies, current flows only on the surface of the copper (Skin Effect); at 10 GHz, the skin depth of copper is approximately 0.66 \u03bcm, while the surface roughness (Rz) of conventional electrolytic copper foil can reach 3\u20135 \u03bcm, forcing the current to \u201cclimb\u201d along the rough surface, which increases equivalent loss by 20\u201350%. Switching to low-profile (VLP\/RTF) or ultra-low-profile (HVLP) copper foil is one of the most direct ways to improve high-frequency insertion loss.<\/p>\n<p><strong>Related Processes<\/strong>\uff1a<a href=\"\/en\/blog\/pcb-english-part-1\/\">Chinese-English Glossary of Common Technical Terms Used in Printed Circuit Board Manufacturing<\/a> \u00b7 <a href=\"\/en\/capabilities\/pcb-materials\/\">PCB Sheets<\/a> \u00b7 <a href=\"\/en\/metal-substrate\/\">Metal Substrate<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>1. \u5148\u770b\u6e05\u677f\u6750\u7531\u4ec0\u4e48\u6784\u6210 \u65e0\u8bba\u53eb\u4ec0\u4e48\u540d\u5b57\uff0c\u4e00\u5757\u8986\u94dc\u677f\uff08CCL\uff0cCopper Clad Laminate\uff09\u90fd\u7531 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"A PCB Manufacturer Explains the Types of PCB Materials - Jingpeng Electronics","description":"What are the different types of PCB substrates? Explain the classification of substrates based on criteria such as organic versus inorganic materials, flame resistance, reinforcing materials, and flame-retardant properties. The key points provided can be directly applied to design reviews and process validation."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[407,26],"tags":[],"class_list":["post-2892","post","type-post","status-publish","format-standard","hentry","category-pcb-materials","category-blog"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2892","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=2892"}],"version-history":[{"count":3,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2892\/revisions"}],"predecessor-version":[{"id":19897,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2892\/revisions\/19897"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=2892"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=2892"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=2892"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}