{"id":2782,"date":"2026-11-04T11:00:00","date_gmt":"2026-11-04T03:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2782"},"modified":"2026-10-08T20:16:07","modified_gmt":"2026-10-08T12:16:07","slug":"avoid-embedded-pcb-eco-5-tips","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/avoid-embedded-pcb-eco-5-tips\/","title":{"rendered":"A Shenzhen PCB Manufacturer Shares Five Tips for Avoiding Engineering Changes to Embedded Circuit Boards"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<p>Engineering Change Notices (ECNs) for printed circuit boards (PCBs) are one of the common challenges in the electronics manufacturing industry. They not only cause headaches for PCB manufacturers but also create problems for electronics manufacturers, leading to extended production cycles, increased design costs, and delays in time-to-market. In this article, we\u2019ll introduce seven methods to help you avoid most engineering changes and ensure your project proceeds smoothly according to plan.<\/p>\n<h2>Advanced: What Is the True Cost of an ECN?<\/h2>\n<p>The cost of engineering changes goes far beyond a single invoice for the revision. Only by fully accounting for the hidden costs can you understand why it\u2019s important to avoid them in the first place:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Cost Items<\/th>\n<th>Note<\/th>\n<th>Order of magnitude<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Design Hours<\/td>\n<td>Revision and Review of Schematics and PCBs<\/td>\n<td>A few days to a few weeks<\/td>\n<\/tr>\n<tr>\n<td>Re-sampling and Validation<\/td>\n<td>Another round of PCB manufacturing, assembly, and testing<\/td>\n<td>A few days to a few weeks<\/td>\n<\/tr>\n<tr>\n<td>Purchased but Unused Materials<\/td>\n<td>Components purchased for older versions may be obsolete.<\/td>\n<td>Depends on the BOM<\/td>\n<\/tr>\n<tr>\n<td>Certifications and Safety Standards<\/td>\n<td>If the product has already been submitted for testing, recertification may be required.<\/td>\n<td>It might be very high.<\/td>\n<\/tr>\n<tr>\n<td>Project Delay<\/td>\n<td>Opportunity Costs Resulting from a Delayed IPO<\/td>\n<td>Often the largest<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<ul>\n<li><strong>The later it is detected, the higher the cost.<\/strong>: Changing a package during the design phase costs almost nothing, but doing so after mass production begins is a disaster;<\/li>\n<li><strong>Hidden costs are often underestimated<\/strong>: Delays and opportunity costs often far exceed the direct costs of switching boards;<\/li>\n<li><strong>Prevention is better than cure.<\/strong>: The extra time spent early on usually saves you several times that amount later on.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-5980\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/component-shortages.webp\" alt=\"Component Shortage\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/component-shortages.webp 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/component-shortages-300x169.webp 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/component-shortages-1024x576.webp 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/component-shortages-768x432.webp 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/component-shortages-400x225.webp 400w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>The Impact of Component Shortages Is Evident<a href=\"\/en\/blog\/how-component-shortages-affect-electronic-product-design\/\">How Component Shortages Affect Electronic Product Design and How to Avoid Them<\/a>; For component procurement, see<a href=\"\/en\/components-sourcing\/\">Component Procurement<\/a>\u3002<\/p>\n<h2>1. Component Selection<\/h2>\n<p>To circumvent ECNs, gain a comprehensive understanding of<a href=\"\/en\/components-sourcing\/\">Components<\/a>Data sheets are crucial. PCB designers typically review the electrical and engineering data for components, but in some cases, the data may not be detailed enough, or the component may still be in the early stages of promotion. In such situations, it is essential to communicate proactively with the component supplier to obtain more information about the component\u2019s characteristics and design applications.<\/p>\n<p>In addition, you should have a clear understanding of the current and voltage ratings of the components to ensure that the selected components meet the project\u2019s requirements and to avoid problems caused by improper component selection.<\/p>\n<h2>Advanced: Checklist for Component Selection<\/h2>\n<ol>\n<li><strong>Confirm Lifecycle Status<\/strong>: Whether the product is in mass production, about to be discontinued (NRND), or has already been discontinued; this is especially important to check for projects with a long product lifecycle;<\/li>\n<li><strong>Verify the Package and Pads<\/strong>: Refer to the physical datasheet; do not rely solely on library files;<\/li>\n<li><strong>Verify Electrical Margin<\/strong>: Allow for a margin of safety for voltage, current, and temperature; do not design based on limit values;<\/li>\n<li><strong>Confirmation of Availability and Delivery Schedule<\/strong>: Are there stable supply channels? Are there alternative models available?;<\/li>\n<li><strong>Confirm the MSL Level<\/strong>: Affects storage, baking, and assembly processes;<\/li>\n<li><strong>Confirm Temperature Range<\/strong>: The difference between industrial-grade and commercial-grade products is crucial in extreme environments.<\/li>\n<\/ol>\n<p>Of these, the first one is the easiest to overlook.<strong>Choosing a component that\u2019s about to be discontinued is like planting a time bomb in your project.<\/strong>. In the selection and evaluation of products with long life cycles (such as industrial and medical equipment), the life cycle status should be considered a deal-breaker.<\/p>\n<ul>\n<li><strong>View Lifecycle Announcements<\/strong>: Keep an eye on manufacturers' discontinuation notices and product roadmaps;<\/li>\n<li><strong>Prioritize Mainstream Packaging<\/strong>: It is easier to find replacement parts for standard packages;<\/li>\n<li><strong>Maintain dual sources for critical components<\/strong>: There are at least two models available.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-8685\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/counterfeit-electronic-components-and-pcba-hazards.jpg\" alt=\"The Dangers of Counterfeit Electronic Components to PCBA\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/counterfeit-electronic-components-and-pcba-hazards.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/counterfeit-electronic-components-and-pcba-hazards-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/counterfeit-electronic-components-and-pcba-hazards-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/counterfeit-electronic-components-and-pcba-hazards-768x432.jpg 768w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>Risks Associated with Counterfeit Components<a href=\"\/en\/blog\/counterfeit-electronic-components-and-pcba-hazards\/\">The Dangers of Counterfeit Electronic Components to PCBA<\/a>; For embedded passive components, see<a href=\"\/en\/blog\/embedded-passive-components\/\">Why Choose Embedded Passive Components?<\/a>\u3002<\/p>\n<h2>2. Memory Selection<\/h2>\n<p>Memory selection is equally important. As new generations of DRAM and flash memory continue to emerge, circuit board designers must stay up to date on the latest memory specifications. Different generations of memory have varying performance characteristics and specifications, so it is essential to ensure that the selected memory matches the project\u2019s requirements to avoid engineering changes later on.<\/p>\n<h2>3. Moisture Sensitivity Level (MSL)<\/h2>\n<p>Moisture Sensitivity Level (MSL) is a factor that is often overlooked. If MSL specifications are ignored, the circuit board may encounter problems during actual use, leading to engineering changes. Particular care must be taken when the MSL level is high (such as 3, 4, or 5).<\/p>\n<h2>Advanced: How Should MSL Levels Be Handled?<\/h2>\n<p>The moisture sensitivity level (MSL) determines the exposure time and reflow requirements for a device after it has been unpackaged. The higher the level, the more stringent the requirements for the workshop environment:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>MSL Level<\/th>\n<th>Workshop Lifespan (for reference)<\/th>\n<th>Processing Requirements<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>1<\/td>\n<td>Unrestricted<\/td>\n<td>Just store it as usual.<\/td>\n<\/tr>\n<tr>\n<td>2<\/td>\n<td>Longer<\/td>\n<td>Store in a dry, sealed container; once opened, use within the specified timeframe.<\/td>\n<\/tr>\n<tr>\n<td>3<\/td>\n<td>Intermediate<\/td>\n<td>The return must be completed within the specified time frame.<\/td>\n<\/tr>\n<tr>\n<td>4 \/ 5 \/ 6<\/td>\n<td>Short to Extremely Short<\/td>\n<td>Must be stored in a drying cabinet; if the time limit is exceeded, the product must be baked; for Grade 6, baking is required before reflux.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The consequences of ignoring the MSL are<strong>Cracks caused by the expansion of moisture inside the device during reflow<\/strong>\u2014commonly known as the \u201cpopcorn effect.\u201d These types of defects sometimes pass electrical testing but manifest as intermittent failures during subsequent use, making them extremely difficult to diagnose.<\/p>\n<ul>\n<li><strong>High-level devices must be managed separately.<\/strong>: Store in a drying cabinet and record the exposure time;<\/li>\n<li><strong>If the time limit is exceeded, it must be baked.<\/strong>: Follow the temperature and time specifications for each level;<\/li>\n<li><strong>There is a limit on the number of times you can bake<\/strong>: Repeated baking can affect solderability; the number of times this is done must be recorded.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"800\" height=\"600\" class=\"alignnone size-large wp-image-844\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/how-component-shortages-affect-electronic-product-design.jpg\" alt=\"Semiconductor Component Shortages\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/how-component-shortages-affect-electronic-product-design.jpg 800w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/how-component-shortages-affect-electronic-product-design-300x225.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/how-component-shortages-affect-electronic-product-design-768x576.jpg 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/how-component-shortages-affect-electronic-product-design-400x300.jpg 400w\" sizes=\"auto, (max-width: 800px) 100vw, 800px\" \/><\/p>\n<p>For FPCB specifications, see<a href=\"\/en\/blog\/fpcb-characteristics-of-material-process-components\/\">A Discussion of FPCB Characteristics from the Perspectives of Materials, Manufacturing Processes, and Key Components<\/a>; For welding quality, see<a href=\"\/en\/blog\/smt-processing-quality-and-appearance-inspection\/\">SMT Manufacturing Quality and Visual Inspection<\/a>\u3002<\/p>\n<h2>4. Design for Test (DFT)<\/h2>\n<p>Design for Testability (DFT) is critical for testing and debugging printed circuit boards. During the early stages of design, it is necessary to consider the layout of DFT probe points and test angles to ensure that subsequent testing proceeds smoothly. If DFT is not taken into account early on, engineering changes may be required later in the process.<\/p>\n<h2>5. Cooling and Heat Dissipation<\/h2>\n<p>Cooling methods and heat sink selection are areas that are often overlooked. Different applications may require different cooling methods, such as water-cooling systems. Selecting the right heat sink is crucial for avoiding engineering changes, as inadequate cooling can cause components to overheat, thereby necessitating changes.<\/p>\n<h2>6. Consider the coefficient of thermal expansion<\/h2>\n<p>In the design process, the coefficient of thermal expansion (CTE) of components must be taken into account. Matching the CTE of components, packages, and PCB materials is critical to ensuring proper PCB operation. Mismatches can lead to thermal issues and may require engineering changes.<\/p>\n<h2>7. Collaborating with OEM Customers<\/h2>\n<p>Close collaboration with OEM customers is essential. Understanding their needs and continuously updating designs to accommodate new technologies and changing specifications can help avoid large-scale engineering changes later on.<\/p>\n<p>By implementing these seven strategies, you can wisely avoid most engineering changes, ensure your project proceeds smoothly as planned, and reduce the risk of delays and cost overruns.<\/p>\n<h2>Advanced: What to Look for During Pre-Investment Due Diligence<\/h2>\n<p>Formalizing the previous steps into a formal review is the most effective organizational approach for mitigating ECN risks. The review checklist should include the following:<\/p>\n<ol>\n<li><strong>Device Status Verification<\/strong>: Are the product lifecycle, availability, and alternative materials clearly defined?;<\/li>\n<li><strong>Packaging Verification<\/strong>: Compare the datasheet with the PCB package one by one;<\/li>\n<li><strong>DFM Review<\/strong>: Pads, spacing, silkscreen, process margins, and mark points;<\/li>\n<li><strong>DFT Verification<\/strong>: Do the number, location, and spacing of the test points meet the equipment requirements?;<\/li>\n<li><strong>Thermal Design Verification<\/strong>: Heat source distribution, heat dissipation paths, temperature monitoring points;<\/li>\n<li><strong>CTE Verification<\/strong>: Are the thermal expansion coefficients of the key components and the substrate material compatible?;<\/li>\n<li><strong>Document Review<\/strong>: Are the Gerber files, coordinate data, BOM, and assembly drawings complete and consistent?<\/li>\n<\/ol>\n<p>The key to evaluation is not the process itself, but rather<strong>Have different characters cross-check each other at the same point in time<\/strong>. Since hardware, layout, manufacturing processes, and procurement each focus on different aspects, a centralized review can uncover issues that would be difficult for a single person to detect.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-8638\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/embedded-passive-components.jpg\" alt=\"Why Choose Embedded Passive Components?\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/embedded-passive-components.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/embedded-passive-components-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/embedded-passive-components-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/embedded-passive-components-768x432.jpg 768w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>See the ALIVH process<a href=\"\/en\/blog\/alivh-pcb\/\">Key Points of the ALIVH PCB Manufacturing Process<\/a>; For manufacturing capabilities, see<a href=\"\/en\/capabilities\/\">PCB Manufacturing Capabilities<\/a>\u3002<\/p>\n<h1>Conclusion<\/h1>\n<p>ECNs are a common challenge in the electronics manufacturing industry, but most engineering changes can be effectively avoided through careful component selection, memory selection, consideration of MSLs, design for testability, appropriate cooling and heat dissipation strategies, thermal expansion coefficient matching, and collaboration with OEM customers. These approaches will help ensure that projects proceed as planned and reduce the risk of delays and cost overruns.<\/p>\n<h2>Advanced: How to Manage Inevitable Changes<\/h2>\n<p>Even with thorough preventive measures, engineering changes cannot be completely eliminated. In such cases, it is important to minimize the impact of these changes:<\/p>\n<ul>\n<li><strong>Tiered Management<\/strong>: Distinguish between changes that affect functionality and those that affect the process; the former must be fully validated, while the latter may simplify the process;<\/li>\n<li><strong>Strict version control<\/strong>: Document version numbers, BOM version numbers, and physical identifiers must match; do not mix them;<\/li>\n<li><strong>Evaluating Work in Progress<\/strong>: Clarify how to handle materials already used, work-in-progress panels, and finished products;<\/li>\n<li><strong>Complete traceability records<\/strong>: Record the reason for the change, the details of the change, and the verification results to facilitate future review;<\/li>\n<li><strong>Notify all relevant parties<\/strong>: Including procurement, production, testing, and subcontractors.<\/li>\n<\/ul>\n<p>Article 3 is the one most likely to be overlooked:<strong>If you only modify the file without handling work-in-progress, it will result in a mix of old and new versions on the production line.<\/strong>...This is one of the scenarios most prone to quality issues in mass production.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1226\" height=\"690\" class=\"alignnone size-large wp-image-8530\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/fpcb-characteristics-of-material-process-components.jpg\" alt=\"A Discussion of the Characteristics of FPCBs from the Perspectives of Materials, Manufacturing Processes, and Key Components\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/fpcb-characteristics-of-material-process-components.jpg 1226w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/fpcb-characteristics-of-material-process-components-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/fpcb-characteristics-of-material-process-components-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/fpcb-characteristics-of-material-process-components-768x432.jpg 768w\" sizes=\"auto, (max-width: 1226px) 100vw, 1226px\" \/><\/p>\n<p>For the proofing process, see<a href=\"\/en\/blog\/pcb-prototyping-process-precautions\/\">A Detailed Explanation of the PCB Prototyping Process and Key Considerations<\/a>; For layout rules, see<a href=\"\/en\/blog\/13-rules-for-layout-of-printed-circuit-board-components\/\">13 Rules for Laying Out Components on Printed Circuit Boards<\/a>\u3002<\/p>\n<h2>Frequently Asked Questions<\/h2>\n<h3>1. What is an ECN?<\/h3>\n<p>ECN stands for Engineering Change Notice, a common challenge in the electronics manufacturing industry that can lead to extended production cycles and increased costs.<\/p>\n<h3>2. Why is component selection so important?<\/h3>\n<p>The selection of components directly affects the performance and reliability of a circuit board; an inappropriate choice may result in engineering changes.<\/p>\n<h3>3. Why is it important to consider memory selection?<\/h3>\n<p>The choice of memory is closely related to a project\u2019s performance and specifications; selecting the appropriate memory can help avoid engineering changes later on.<\/p>\n<h3>4. What is a Moisture Sensitivity Level (MSL)?<\/h3>\n<p>MSL refers to the moisture sensitivity level of electronic components, which is critical for the storage and handling of certain components; an incorrect selection may result in engineering changes.<\/p>\n<h3>5. Why is it important to consider cooling and heat dissipation?<\/h3>\n<p>Cooling and heat dissipation affect component temperatures; improper selection may lead to overheating issues, requiring engineering changes.<\/p>\n<h3>6. What is the difference between ECN and ECO?<\/h3>\n<p>An ECN (Engineering Change Notice) focuses on notification and documentation, describing changes that are to be made; an ECO (Engineering Change Order) focuses on authorization and execution, instructing that the changes be implemented as required. In practice, the two are often used in conjunction: a notice is first issued for review, and once approved, an order is issued for implementation. Definitions may vary slightly among companies.<\/p>\n<h3>7. Why does selecting memory types so often lead to changes?<\/h3>\n<p>This is because memory components undergo rapid generational updates, have poor pin compatibility, and experience significant fluctuations in lead times. New-generation products often feature changes in capacity, speed, and packaging; if future upgrade paths are not considered during the design phase, a board redesign will be necessary once the original model becomes out of stock or is discontinued. Therefore, when selecting memory components, provisions should be made for compatible packaging and an alternative supplier.<\/p>\n<h3>8. What specific failures can result from a mismatch in thermal expansion coefficients?<\/h3>\n<p>A typical symptom is fatigue cracking of solder joints after temperature cycling, which is particularly evident in BGAs and devices with large-area pads. Differences in thermal expansion between the device package, solder, and substrate generate stress with each temperature cycle, and cracks form as the number of cycles accumulates. This issue can be significantly mitigated by selecting compatible board materials and employing proper pad design.<\/p>\n<h3>9. Is the additional cost of DFT worth it?<\/h3>\n<p>It\u2019s usually worth it. The only additions are a few test pads and a small number of layout constraints, yet these result in higher test coverage and lower testing costs. Boards without test points must rely solely on flying-probe testing or functional testing; insufficient coverage can lead to defects slipping through, and the costs of rework and after-sales service far exceed the investment required to reserve test points.<\/p>\n<h3>10. How can we mitigate the risks associated with the discontinuation of components?<\/h3>\n<p>Three approaches: First, when selecting parts, prioritize those with long lifecycles and avoid those in the NRND status; second, set aside alternative parts for critical components and note them in the BOM; third, establish communication channels with suppliers to receive timely notifications of discontinuation. For products with long lifecycles, strategic stockpiling of critical materials may also be considered.<\/p>\n<h3>11. What should I do if problems still arise after the review meeting is over?<\/h3>\n<p>First, determine whether the issue was \u201cnot checked\u201d or \u201cchecked but overlooked.\u201d The former indicates that the checklist needs to be expanded, while the latter suggests that the review process was not carried out properly. An effective approach is to categorize and track the causes of each ECN, identify the most frequent categories, and use that information to refine the review checklist\u2014the checklist should evolve continuously through project retrospectives rather than remain static.<\/p>\n<p><strong>Related Processes<\/strong>\uff1a<a href=\"\/en\/blog\/embedded-passive-components\/\">Why Choose Embedded Passive Components?<\/a> \u00b7 <a href=\"\/en\/blog\/alivh-pcb\/\">Key Points of the ALIVH PCB Manufacturing Process<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>\u7535\u8def\u677f\u5de5\u7a0b\u66f4\u6539\uff08ECN\uff09\u662f\u7535\u5b50\u5236\u9020\u4e1a\u4e2d\u5e38\u89c1\u7684\u6311\u6218\u4e4b\u4e00\u3002\u5b83\u4e0d\u4ec5\u8ba9PCB\u5382\u5bb6\u5934\u75db\uff0c\u540c\u65f6\u4e5f\u4f1a\u5bf9\u7535\u5b50\u5382\u5546\u9020\u6210\u9ebb\u70e6\uff0c\u5bfc\u81f4 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"Shenzhen PCB Manufacturer Shares Five Tips for Avoiding Engineering Changes to Embedded Circuit Boards - Jingpeng Electronics","description":"How can you avoid engineering changes to embedded circuit boards? Clearly define component and memory selection, MSL ratings, design for testability, and thermal expansion considerations. By conducting a self-inspection based on the checklist in this article, you can avoid one round of prototype rework."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[26,412],"tags":[],"class_list":["post-2782","post","type-post","status-publish","format-standard","hentry","category-blog","category-sourcing-cost"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2782","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=2782"}],"version-history":[{"count":3,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2782\/revisions"}],"predecessor-version":[{"id":19984,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2782\/revisions\/19984"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=2782"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=2782"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=2782"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}