{"id":2741,"date":"2026-10-13T17:00:00","date_gmt":"2026-10-13T09:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2741"},"modified":"2026-10-08T20:14:37","modified_gmt":"2026-10-08T12:14:37","slug":"gold-plating-vs-enig","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/gold-plating-vs-enig\/","title":{"rendered":"Comparison of Gold Plating and Immersion Gold on Printed Circuit Boards"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<p>Printed circuit boards play a crucial role in modern electronics manufacturing, and electroplating is one of the key processes involved. Different types of PCB electroplating can meet a wide range of needs, but they also contribute to the diversity of the PCB market. This article will provide an in-depth look at the various types of PCB electroplating and their applications.<\/p>\n<h2>1. First, identify the issue: What problem does surface treatment address?<\/h2>\n<p>Copper is the ideal metal for interconnects, but it has one fatal flaw\u2014<strong>It oxidizes when exposed to air, and copper oxide is not weldable.<\/strong>. The entire purpose of surface treatment (Surface Finish) is to seal the bare copper with a thin protective layer prior to final soldering, while ensuring that this protective layer can be easily displaced or dissolved by the solder during the soldering process.<\/p>\n<p>Mainstream surface treatments can be divided into two broad categories based on whether they contain gold, and the applications for each category differ significantly:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Process<\/th>\n<th>Typical Thickness<\/th>\n<th>Flatness<\/th>\n<th>Service Life<\/th>\n<th>Solderability<\/th>\n<th>Relative Cost<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>HASL Tin Plating (Lead-Containing)<\/td>\n<td>Sn 1\u201315 \u03bcm<\/td>\n<td>\u5dee<\/td>\n<td>12 months<\/td>\n<td>\u4f18<\/td>\n<td>1\u00d7<\/td>\n<\/tr>\n<tr>\n<td>HASL Lead-Free Solder Paste<\/td>\n<td>Sn 1\u201315 \u03bcm<\/td>\n<td>\u5dee<\/td>\n<td>12 months<\/td>\n<td>\u826f<\/td>\n<td>1.1\u20131.3\u00d7<\/td>\n<\/tr>\n<tr>\n<td>OSP Organic Solder Protection Film<\/td>\n<td>0.2\u20130.5 \u03bcm<\/td>\n<td>\u4f18<\/td>\n<td>6 months<\/td>\n<td>Good (decreased after one reflux)<\/td>\n<td>1.2\u20131.5\u00d7<\/td>\n<\/tr>\n<tr>\n<td>Tin Plating \/ Silver Plating<\/td>\n<td>0.1\u20131.2 \u03bcm<\/td>\n<td>\u4f18<\/td>\n<td>6\u201312 months<\/td>\n<td>\u826f<\/td>\n<td>1.8\u20132.5\u00d7<\/td>\n<\/tr>\n<tr>\n<td>ENIG Chemical Gold Plating<\/td>\n<td>Ni 3\u20136 \u03bcm \/ Au 0.05\u20130.1 \u03bcm<\/td>\n<td>\u4f18<\/td>\n<td>12 months+<\/td>\n<td>\u4f18<\/td>\n<td>2.5\u20133.5\u00d7<\/td>\n<\/tr>\n<tr>\n<td>ENEPIG<\/td>\n<td>Ni 3\u20136 \/ Pd 0.05\u20130.15 \/ Au 0.03\u20130.1 \u03bcm<\/td>\n<td>\u4f18<\/td>\n<td>12 months+<\/td>\n<td>Premium (can be accented with gold thread)<\/td>\n<td>3.5\u20135\u00d7<\/td>\n<\/tr>\n<tr>\n<td>Hard Gold Plating (Gold Fingers)<\/td>\n<td>Ni 3\u20136 \u03bcm \/ Au 0.5\u20131.5 \u03bcm<\/td>\n<td>\u4f18<\/td>\n<td>24 months+<\/td>\n<td>Excellent (Wear Resistance)<\/td>\n<td>4\u20138\u00d7 (local)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"576\" class=\"alignnone size-large wp-image-13254\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/11\/pcb-immersion-gold-and-electroplating.webp\" alt=\"PCB\u6c89\u91d1\u4e0e\u7535\u9540\u91d1\u5de5\u827a\u5bf9\u6bd4\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/11\/pcb-immersion-gold-and-electroplating.webp 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/11\/pcb-immersion-gold-and-electroplating-300x169.webp 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/11\/pcb-immersion-gold-and-electroplating-768x432.webp 768w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<h2>2. Full-board gold plating<\/h2>\n<p>Full-board gold plating is a common type of printed circuit board plating, which includes gold plating, nickel-gold plating, electrolytic gold plating, electroplated gold, and electroplated nickel-gold plating. These processes involve dissolving nickel and gold in a chemical solution, then immersing the circuit board in an electroplating tank to deposit a nickel-gold plating layer on the copper foil surface through an electrical current. Electrolytic nickel-gold plating is widely used in electronic products due to its high hardness, wear resistance, and resistance to oxidation.<\/p>\n<h2>3. Gold Inlay<\/h2>\n<p><a href=\"\/en\/capabilities\/pcb-surface-finishes\/\">Shen Jin<\/a>This is a type of electroplating in which a coating is formed through chemical redox reactions. Typically, the gold layer produced by electroless gold plating is thicker; this is a type of chemical nickel-gold metal deposition method. Electroless gold plating is generally used in applications that require a thicker gold layer, which is why this process is often referred to as electroless gold plating.<\/p>\n<p>Here, it\u2019s important to clarify a key engineering point; otherwise, it\u2019s easy to make the wrong choice during the selection process:<strong>The layer of gold in dip-plated gold is actually much thinner than that in electroplated gold.<\/strong>. The gold layer in ENIG is typically only 0.05\u20130.1 \u03bcm (2\u20134 \u03bcin) thick, and its purpose is to protect the underlying nickel layer from oxidation; In contrast, the gold layer in hard gold plating can reach 0.5\u20131.5 \u03bcm (20\u201360 \u03bcin)\u2014a difference in thickness of one order of magnitude\u2014which is why hard gold can withstand the wear and tear of repeated insertion and removal. The real difference between the two lies in<strong>Deposition Mechanism<\/strong>\u4e0e<strong>Crystal Structure<\/strong>...rather than \u201dwhich one is thicker.\u201d For a detailed breakdown of the technical principles, see<a href=\"\/en\/blog\/enig-production-process-and-its-advantages-and-disadvantages\/\">ENIG Production Process and Its Advantages and Disadvantages<\/a>\u3002<\/p>\n<h2>4. Gold-plated circuit boards<\/h2>\n<p>With the advancement of integrated circuits, the number of IC pins has increased, and traditional vertical tin-spraying processes struggle to ensure that small pads are evenly coated, posing challenges for surface-mount technology. In addition, tin-sprayed circuit boards have a relatively short shelf life. Gold-plated circuit boards were developed to address these issues:<\/p>\n<ul>\n<li>In surface-mount technology, particularly for ultra-small surface-mount components, the flatness of the pads directly affects the quality of the solder paste printing process, which in turn affects the quality of the subsequent reflow soldering.<\/li>\n<li>During the prototyping phase, circuit boards often have to sit unused for weeks or even months, and gold-plated circuit boards have a much longer shelf life than lead-tin alloy boards, making them a popular choice.<\/li>\n<\/ul>\n<p>However, as circuit layout has become increasingly dense, trace widths and spacing have shrunk to 3\u20134 mils, leading to the problem of gold wire short circuits. Furthermore, as signal frequencies increase, signal transmission through multilayer boards has a greater impact on signal quality. This phenomenon is known as the skin effect, whereby high-frequency alternating current tends to concentrate on the surface of the conductor.<\/p>\n<h2>5. Immersion Gold Circuit Board<\/h2>\n<p>To address the aforementioned issues with gold-plated circuit boards, people have begun using electroless gold-plated circuit boards, which have the following characteristics:<\/p>\n<ul>\n<li>Gold plating and gold-plated finishes form different crystal structures, resulting in a more yellow appearance that better meets customer requirements.<\/li>\n<li>The crystal structure of sintered gold is relatively dense, making it easy to weld; it does not cause welding issues, thereby reducing customer complaints.<\/li>\n<li>In immersion-gold printed circuit boards, gold is plated only on the pads, so the skin effect has a minimal impact on signal transmission.<\/li>\n<li>Electroplated gold circuit boards have a denser crystal structure and are less prone to oxidation.<\/li>\n<li>Since the metal layer on an immersion gold PCB is limited to the pads, gold wire short circuits do not occur.<\/li>\n<li>The solder mask on an embedded gold PCB bonds more securely to the copper layer.<\/li>\n<li>Immersion gold circuit boards do not affect the spacing between traces.<\/li>\n<\/ul>\n<p>Overall, gold-plated circuit boards are a type of electroplating that meets the demands of modern electronics manufacturing. Not only do they have an attractive appearance, but they also perform exceptionally well in terms of signal transmission and soldering.<\/p>\n<h2>6. Comparison of the Principles Behind the Two Processes<\/h2>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1200\" height=\"675\" class=\"alignnone size-large wp-image-12112\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/10\/enepig.jpg\" alt=\"Guide to the Chemical Nickel-Palladium-Gold Plating Process\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/10\/enepig.jpg 1200w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/10\/enepig-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/10\/enepig-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/10\/enepig-768x432.jpg 768w\" sizes=\"auto, (max-width: 1200px) 100vw, 1200px\" \/><\/p>\n<p>When you compare gold-plated and gold-filled items side by side, the difference is immediately apparent:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Comparison Items<\/th>\n<th>Electrolytic Nickel-Gold Plating (Electrolytic Ni\/Au)<\/th>\n<th>Electrolytic Nickel Immersion Gold (ENIG)<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Deposition Mechanism<\/td>\n<td>When an external current is applied, metal ions are reduced at the cathode.<\/td>\n<td>Self-catalyzed chemical redox reaction; no power supply required<\/td>\n<\/tr>\n<tr>\n<td>Is a conductive path required?<\/td>\n<td>Yes, the circuits on the entire board must be electrically connected.<\/td>\n<td>No, isolated pads can also be gold-plated.<\/td>\n<\/tr>\n<tr>\n<td>Coating Range<\/td>\n<td>Full-board conductor (requires leads; to be etched and severed later)<\/td>\n<td>Areas where only the copper pads are exposed<\/td>\n<\/tr>\n<tr>\n<td>Gold Layer Thickness<\/td>\n<td>0.5\u20131.5 \u03bcm (thicker versions available upon request)<\/td>\n<td>0.05\u20130.1 \u03bcm (subject to process limits)<\/td>\n<\/tr>\n<tr>\n<td>Nickel Coating Thickness<\/td>\n<td>3\u20136 \u03bcm<\/td>\n<td>3\u20136 \u03bcm<\/td>\n<\/tr>\n<tr>\n<td>Crystal Structure<\/td>\n<td>Columnar, dense but with internal stress<\/td>\n<td>Layered, phosphorus-containing, and more compact in structure<\/td>\n<\/tr>\n<tr>\n<td>Thickness Uniformity<\/td>\n<td>Due to the current distribution, the edges are thicker and the center is thinner.<\/td>\n<td>Chemical deposition, good uniformity<\/td>\n<\/tr>\n<tr>\n<td>Cost<\/td>\n<td>Gold is used in large quantities and is expensive.<\/td>\n<td>It uses very little gold and is low-cost.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The production line steps for the two processes are as follows:<\/p>\n<ol>\n<li><strong>Electroplated Nickel-Gold<\/strong>: Pretreatment (degreasing, micro-etching, activation) \u2192 Nickel plating (Watt nickel or aminosulfonic acid nickel) \u2192 Rinsing \u2192 Gold plating (acidic gold or cyanide gold) \u2192 Rinsing \u2192 Drying \u2192 Etching to sever the plated leads.<\/li>\n<li><strong>ENIG<\/strong>: Pretreatment (degreasing, micro-etching, activation) \u2192 Chemical nickel plating (reduction with hypophosphite, with concurrent precipitation of phosphorus) \u2192 Water rinse \u2192 Chemical gold plating (displacement reaction, in which gold displaces nickel from the surface) \u2192 Water rinse \u2192 Drying.<\/li>\n<\/ol>\n<p>\u201dAmong them\"<strong>Is a conductive path required?<\/strong>\u201cThis is the most fundamental difference between the two in terms of process. For electroplated gold, the conductors on the entire board must be electrically connected in order to carry current; this often requires the additional routing of \u201delectroplating leads\u201d during design, which are then etched away after plating\u2014a significant burden in fine-pitch designs. ENIG relies on chemical deposition and does not have this issue; this is the fundamental reason why it has completely replaced electroplated gold on high-density boards. For detailed differences between the two, please refer to<a href=\"\/en\/blog\/the-difference-between-deposited-nickel-gold-and-electroplated-nickel-gold\/\">The Difference Between Electroless Nickel-Gold and Electrolytic Nickel-Gold<\/a>\u3002<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-8896\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/differences-between-pcb-nickel-palladium-gold-and-nickel-gold-electroplating.jpg\" alt=\"Differences Between Nickel-Palladium-Gold and Nickel-Gold Plating on PCBs\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/differences-between-pcb-nickel-palladium-gold-and-nickel-gold-electroplating.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/differences-between-pcb-nickel-palladium-gold-and-nickel-gold-electroplating-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/differences-between-pcb-nickel-palladium-gold-and-nickel-gold-electroplating-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/differences-between-pcb-nickel-palladium-gold-and-nickel-gold-electroplating-768x432.jpg 768w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<h2>7. Gold-Wire Short Circuits and the Skin Effect: Why High-Density Boards Have Moved Away from Electroplated Gold<\/h2>\n<p>The two issues mentioned in the original text are critical when it comes to high-density fiberboard:<\/p>\n<h3>7.1 Gold Wire Short<\/h3>\n<p>Electroplating deposits a layer of gold on all exposed conductors, including the sides of the traces. When the line width and spacing are reduced to 3\u20134 mil (75\u2013100 \u03bcm), the edges of the gold layer remaining after etching form<strong>Slender metal strands (slivers)<\/strong>...These could potentially spill over during subsequent processes and bridge adjacent traces, causing a short circuit. ENIG is deposited only on the pads; there is no gold layer on the sides of the traces, which eliminates this problem in principle.<\/p>\n<h3>7.2 Skin Effect<\/h3>\n<p>High-frequency alternating current tends to flow near the surface of a conductor. The higher the frequency, the thinner the surface layer where the current is concentrated\u2014the skin depth of copper is approximately 2.1 \u03bcm at 1 GHz and approximately 0.66 \u03bcm at 10 GHz. This means that<strong>The current in high-frequency signals flows primarily within the outermost few micrometers of the conductor.<\/strong>. With electroplated gold, the entire surface of the trace is coated with a layer of gold and nickel, so the signal must travel near the nickel layer, which has a higher resistivity (approximately 7.0 \u00d7 10\u207b\u2078 \u03a9\u00b7m, four times that of copper), resulting in a significant increase in signal loss. ENIG applies gold plating only to the pads, while the surface of the traces remains copper, resulting in better high-frequency performance.<\/p>\n<p>The skin depth of copper at several common frequencies, for easy estimation:<\/p>\n<ul>\n<li><strong>100 kHz<\/strong>: Approximately 0.21 mm \u2014 the skin effect does not need to be considered for thick copper plates.<\/li>\n<li><strong>1 MHz<\/strong>: Approximately 66 \u03bcm \u2014 2 oz of copper (70 \u03bcm) is close to the critical limit.<\/li>\n<li><strong>1 GHz<\/strong>: Approximately 2.1 \u03bcm \u2014 at this point, the roughness of the copper foil begins to dominate the losses.<\/li>\n<li><strong>10 GHz<\/strong>: Approximately 0.66 \u03bcm \u2014 The surface treatment layer is part of the current path, and the plating material directly affects losses.<\/li>\n<\/ul>\n<p>This is why RF boards and high-speed digital boards almost without exception opt for ENIG or other non-electrolytic gold plating processes, while hard gold plating is reserved only for<strong>Gold-plated contacts that need to be repeatedly plugged in and unplugged<\/strong>Applications involving this type of wear.<\/p>\n<h2>8. Pad Flatness and Shelf Life<\/h2>\n<p>Flatness is a critical factor for fine-pitch components. The tin layer thickness in Hot Air Solder Leveling (HASL) is uneven, with height differences between pads reaching 10\u201330 \u03bcm. For BGAs and QFNs with a pitch of 0.4 mm or less, this unevenness is sufficient to cause uneven solder paste deposition, leading to cold solder joints or short circuits. The surface roughness of ENIG is typically within 1\u20132 \u03bcm, making it the default choice for fine-pitch components.<\/p>\n<p>In terms of shelf life, ENIG can last for more than 12 months under standard storage conditions (dry, sealed, and protected from sulfidation), while OSP lasts only 6 months and its performance degrades after a single reflow cycle. Although tin plating can also be stored for 12 months, it exhibits poor surface flatness.<strong>During the prototyping phase, when circuit boards are left unused for weeks or even months, ENIG is the most reliable option.<\/strong>\u2014This is precisely why the original text mentioned that gold-plated boards were popular during the pilot production phase, and ENIG offers the same advantage at a lower cost.<\/p>\n<p>Even the longest shelf life depends on proper storage. Key points for storing ENIG boards:<\/p>\n<ul>\n<li><strong>Vacuum-sealed + desiccant<\/strong>, Use as soon as possible after opening; if left exposed for more than 24 hours, it is recommended to bake it.<\/li>\n<li><strong>Avoid environments containing sulfur<\/strong>: Sulfur reacts with silver and copper to form sulfides; silver-plated plates are particularly susceptible to this reaction.<\/li>\n<li><strong>Avoid direct contact with the pads<\/strong>: The salt and oils in fingerprints can stain the gold surface.<\/li>\n<li><strong>First In, First Out<\/strong>: Batch Management: Boards that are more than 12 months old must undergo a re-test for solderability before soldering.<\/li>\n<\/ul>\n<h2>9. Selecting a Model Based on the Application<\/h2>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Use Cases<\/th>\n<th>Preferred Process<\/th>\n<th>Alternatives<\/th>\n<th>Reasons Not to Choose It<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>BGA \/ Fine-pitch (0.4 mm or less)<\/td>\n<td>ENIG<\/td>\n<td>ENEPIG<\/td>\n<td>Insufficient tin plating flatness; OSP failure after multiple reflow cycles<\/td>\n<\/tr>\n<tr>\n<td>Golden Finger \/ Repeatedly Plugging In and Unplugging<\/td>\n<td>Hard Gold Plating (Partial)<\/td>\n<td>Gold Plating + Spot Hard Gold Plating<\/td>\n<td>The ENIG gold layer is too thin; it wears through after just a few dozen insertions and removals.<\/td>\n<\/tr>\n<tr>\n<td>Gold wire bonding (COB\/bonding) is required<\/td>\n<td>ENEPIG<\/td>\n<td>Soft Gold Plating<\/td>\n<td>Insufficient adhesion between the ENIG nickel layer and the gold wires<\/td>\n<\/tr>\n<tr>\n<td>High-frequency \/ High-speed (\u22655 GHz)<\/td>\n<td>ENIG or OSP<\/td>\n<td>Sunk Silver<\/td>\n<td>Electroplated gold causes signals to propagate near the nickel layer, resulting in increased signal loss.<\/td>\n<\/tr>\n<tr>\n<td>Cost-sensitive, high-volume consumer products<\/td>\n<td>Lead-Free Solder Plating \/ OSP<\/td>\n<td>\u2014<\/td>\n<td>ENIG costs 2\u20133 times as much<\/td>\n<\/tr>\n<tr>\n<td>Press-fit Connection<\/td>\n<td>\u55b7\u9521 \/ OSP<\/td>\n<td>ENIG<\/td>\n<td>\u786c\u91d1\u5c42\u592a\u786c\u4f1a\u5f71\u54cd\u538b\u63a5\u533a\u5f62\u53d8<\/td>\n<\/tr>\n<tr>\n<td>\u8f66\u8f7d \/ \u533b\u7597\u9ad8\u53ef\u9760<\/td>\n<td>ENIG \/ ENEPIG<\/td>\n<td>\u2014<\/td>\n<td>OSP \u4e0e\u55b7\u9521\u7684\u957f\u671f\u53ef\u9760\u6027\u4e0d\u8db3<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>\u5982\u679c\u8981\u5728\u9540\u91d1\u4e0e\u6c89\u91d1\u4e4b\u95f4\u505a\u9009\u62e9\uff0c\u5224\u65ad\u8def\u5f84\u5f88\u77ed\uff1a<strong>\u5148\u770b\u6709\u6ca1\u6709\u63d2\u62d4\u6216\u6253\u91d1\u7ebf\u9700\u6c42<\/strong>\u2014\u2014\u6709\u5c31\u7528\u786c\u91d1\uff08\u5c40\u90e8\uff09\u6216 ENEPIG\uff1b<strong>\u6ca1\u6709\u5c31\u9009 ENIG<\/strong>\uff0c\u5b83\u5728\u5e73\u6574\u5ea6\u3001\u5f85\u7528\u5bff\u547d\u3001\u9ad8\u9891\u7279\u6027\u3001\u6210\u672c\u56db\u9879\u4e0a\u7efc\u5408\u6700\u4f18\u3002\u66f4\u7ec6\u7684\u9009\u578b\u903b\u8f91\u89c1<a href=\"\/en\/blog\/how-to-choose-gold-plating-or-immersion-gold-surface-treatment\/\">\u5982\u4f55\u9009\u62e9\u9540\u91d1\u6216\u6c89\u91d1\u8868\u9762\u5904\u7406<\/a>\uff0c\u56db\u79cd\u5e38\u89c1\u5de5\u827a\u7684\u6a2a\u5411\u5bf9\u6bd4\u89c1<a href=\"\/en\/blog\/four-common-pcb-surface-treatments\/\">4 Common PCB Surface Treatments<\/a>\u3002<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1080\" height=\"608\" class=\"alignnone size-large wp-image-8466\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-gold-finger.jpg\" alt=\"Guide to PCB Gold Finger Design and Manufacturing\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-gold-finger.jpg 1080w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-gold-finger-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-gold-finger-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-gold-finger-768x432.jpg 768w\" sizes=\"auto, (max-width: 1080px) 100vw, 1080px\" \/><\/p>\n<h2>10. \u5e38\u89c1\u7f3a\u9677\uff1a\u9ed1\u76d8\u4e0e\u91d1\u8106<\/h2>\n<p>\u9540\u91d1\u7c7b\u5de5\u827a\u6709\u4e24\u4e2a\u81ed\u540d\u662d\u8457\u7684\u5931\u6548\u6a21\u5f0f\uff0c\u91c7\u8d2d\u4e0e\u54c1\u8d28\u90fd\u5e94\u4e86\u89e3\uff1a<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Defects<\/th>\n<th>Phenomenon<\/th>\n<th>Root Cause<\/th>\n<th>Countermeasures<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>\u9ed1\u76d8\uff08Black Pad\uff09<\/td>\n<td>\u710a\u76d8\u53d1\u9ed1\uff0c\u710a\u63a5\u540e\u710a\u70b9\u5f3a\u5ea6\u6781\u4f4e\u3001\u6613\u8131\u843d<\/td>\n<td>\u6c89\u91d1\u6db2\u5bf9\u954d\u5c42\u8fc7\u5ea6\u8150\u8680\uff0c\u5f62\u6210\u5bcc\u78f7\u8106\u5316\u5c42<\/td>\n<td>\u63a7\u5236\u91d1\u69fd\u53c2\u6570\u4e0e\u6d78\u91d1\u65f6\u95f4\uff1b\u6539\u7528 ENEPIG<\/td>\n<\/tr>\n<tr>\n<td>\u91d1\u8106\uff08Gold Embrittlement\uff09<\/td>\n<td>\u710a\u70b9\u53d1\u8106\u3001\u5f3a\u5ea6\u4e0b\u964d<\/td>\n<td>\u91d1\u6eb6\u5165\u710a\u6599\u8d85\u8fc7 3 wt%\uff0c\u5f62\u6210\u8106\u6027\u7684 AuSn\u2084 \u91d1\u5c5e\u95f4\u5316\u5408\u7269<\/td>\n<td>\u63a7\u5236\u91d1\u5c42\u539a\u5ea6\uff1b\u710a\u63a5\u524d\u642a\u9521\u53bb\u91d1<\/td>\n<\/tr>\n<tr>\n<td>\u954d\u5c42\u6c27\u5316 \/ \u4e0d\u4e0a\u9521<\/td>\n<td>\u710a\u76d8\u53d8\u8272\u3001\u62d2\u710a<\/td>\n<td>\u91d1\u5c42\u592a\u8584\u6216\u6709\u5b54\u9699\uff0c\u954d\u5c42\u88ab\u6c27\u5316<\/td>\n<td>\u63d0\u9ad8\u91d1\u539a\u81f3 0.08 \u03bcm \u4ee5\u4e0a\uff1b\u7f29\u77ed\u5b58\u653e\u65f6\u95f4<\/td>\n<\/tr>\n<tr>\n<td>\u91d1\u9762\u53d1\u767d \/ \u6c61\u67d3<\/td>\n<td>\u5916\u89c2\u5f02\u5e38\uff0c\u53ef\u710a\u6027\u4e0b\u964d<\/td>\n<td>\u6c34\u6d17\u4e0d\u5145\u5206\u3001\u6709\u673a\u7269\u6b8b\u7559<\/td>\n<td>\u52a0\u5f3a\u6c34\u6d17\uff1b\u6539\u7528\u5782\u76f4\u6c89\u91d1\u7ebf<\/td>\n<\/tr>\n<tr>\n<td>\u91d1\u624b\u6307\u78e8\u635f\u9732\u954d<\/td>\n<td>\u63d2\u62d4\u82e5\u5e72\u6b21\u540e\u9732\u51fa\u954d\u5c42<\/td>\n<td>\u91d1\u5c42\u539a\u5ea6\u4e0d\u8db3\u6216\u786c\u5ea6\u4e0d\u591f<\/td>\n<td>\u786c\u91d1\u52a0\u539a\u5230 0.76 \u03bcm\uff0830 \u03bcin\uff09\u4ee5\u4e0a<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>Among them<strong>\u9ed1\u76d8<\/strong>\u662f\u6700\u9ebb\u70e6\u7684\u4e00\u79cd\u2014\u2014\u5b83\u5728\u5916\u89c2\u4e0a\u53ef\u80fd\u5b8c\u5168\u6b63\u5e38\uff0c\u53ea\u6709\u710a\u63a5\u540e\u505a\u62c9\u529b\u6d4b\u8bd5\u6216\u5207\u7247\u624d\u4f1a\u66b4\u9732\uff0c\u4e00\u65e6\u6279\u91cf\u53d1\u751f\uff0c\u635f\u5931\u6781\u5927\u3002\u56e0\u6b64\u9ad8\u53ef\u9760\u9879\u76ee\u901a\u5e38\u8981\u6c42\u677f\u5382\u63d0\u4f9b\u6c89\u91d1\u836f\u6c34\u7684\u53c2\u6570\u7ba1\u63a7\u8bb0\u5f55\u4e0e\u5468\u671f\u6027\u5207\u7247\u62a5\u544a\u3002\u6c89\u91d1\u677f\u6c27\u5316\u7684\u5206\u6790\u4e0e\u5bf9\u7b56\u89c1<a href=\"\/en\/blog\/pcb-gold-plating-oxidation-analysis-solutions\/\">Analysis of Oxidation Issues in Gold-Plated PCBs and Countermeasures<\/a>\u3002<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1200\" height=\"675\" class=\"alignnone size-large wp-image-8477\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/electroplated-nickel-gold-plate-without-tin-coating.jpg\" alt=\"\u7535\u9540\u954d\u91d1\u677f\u4e0d\u4e0a\u9521\u7684\u539f\u56e0\u548c\u89e3\u51b3\u65b9\u6848\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/electroplated-nickel-gold-plate-without-tin-coating.jpg 1200w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/electroplated-nickel-gold-plate-without-tin-coating-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/electroplated-nickel-gold-plate-without-tin-coating-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/electroplated-nickel-gold-plate-without-tin-coating-768x432.jpg 768w\" sizes=\"auto, (max-width: 1200px) 100vw, 1200px\" \/><\/p>\n<p>\u6765\u6599\u68c0\u9a8c\u73af\u8282\u5bf9\u9540\u91d1\u7c7b\u5de5\u827a\u7684\u5e38\u89c4\u68c0\u67e5\u9879\uff1a<\/p>\n<ul>\n<li><strong>Appearance<\/strong>\uff1a\u91d1\u9762\u8272\u6cfd\u5747\u5300\uff0c\u65e0\u53d1\u9ed1\u3001\u53d1\u767d\u3001\u6c34\u5370\u3001\u5212\u4f24\u3002<\/li>\n<li><strong>\u91d1\u539a \/ \u954d\u539a<\/strong>\uff1aXRF \u8367\u5149\u6d4b\u539a\uff0c\u6309 IPC-4552 \u5224\u5b9a\u3002<\/li>\n<li><strong>Solderability<\/strong>\uff1a\u6f02\u9521\u8bd5\u9a8c\uff08235 \u2103\u30012\u20133 s\uff09\uff0c\u6da6\u6e7f\u9762\u79ef \u226595%\u3002<\/li>\n<li><strong>\u9644\u7740\u529b<\/strong>\uff1a\u80f6\u5e26\u8bd5\u9a8c\uff0c\u9540\u5c42\u4e0d\u5f97\u8131\u843d\u3002<\/li>\n<li><strong>\u5b54\u9699\u7387<\/strong>\uff1a\u785d\u9178\u84b8\u6c7d\u8bd5\u9a8c\u6216\u7535\u5316\u5b66\u6cd5\uff0c\u8bc4\u4f30\u91d1\u5c42\u81f4\u5bc6\u6027\u3002<\/li>\n<\/ul>\n<h2>11. \u7ed3\u8bba<\/h2>\n<p>\u7535\u8def\u677f\u7535\u9540\u7c7b\u578b\u7684\u9009\u62e9\u53d6\u51b3\u4e8e\u591a\u4e2a\u56e0\u7d20\uff0c\u5305\u62ec\u5e94\u7528\u9700\u6c42\u3001\u6210\u672c\u548c\u6027\u80fd\u3002\u5728\u9009\u62e9\u7535\u8def\u677f\u65f6\uff0c\u52a1\u5fc5\u8003\u8651\u60a8\u7684\u5177\u4f53\u9700\u6c42\uff0c\u4ee5\u786e\u4fdd\u9009\u62e9\u4e86\u6700\u9002\u5408\u7684\u7535\u9540\u7c7b\u578b\u3002\u540c\u65f6\uff0c\u4e86\u89e3\u5404\u79cd\u7535\u9540\u7c7b\u578b\u7684\u7279\u70b9\u5c06\u6709\u52a9\u4e8e\u60a8\u66f4\u597d\u5730\u7406\u89e3\u7535\u8def\u677f\u5e02\u573a\u7684\u591a\u6837\u6027\u3002<\/p>\n<p>\u4e00\u53e5\u8bdd\u603b\u7ed3\u9009\u578b\uff1a<strong>\u8981\u63d2\u62d4\u8010\u78e8\u5c31\u7528\u7535\u9540\u786c\u91d1\uff0c\u8981\u6253\u91d1\u7ebf\u7528 ENEPIG\uff0c\u5176\u4f59\u7edd\u5927\u591a\u6570\u573a\u666f ENIG \u662f\u6027\u4ef7\u6bd4\u6700\u4f18\u89e3\uff0c\u6210\u672c\u6781\u5ea6\u654f\u611f\u4e14\u65e0\u7ec6\u95f4\u8ddd\u65f6\u7528\u55b7\u9521\u6216 OSP\u3002<\/strong>\u5177\u4f53\u5de5\u827a\u53c2\u6570\u4e0e\u80fd\u529b\u6e05\u5355\u89c1<a href=\"\/en\/capabilities\/pcb-surface-finishes\/\">\u8868\u9762\u5904\u7406\u5de5\u827a\u80fd\u529b<\/a>\u3002<\/p>\n<h2>Frequently Asked Questions<\/h2>\n<h3>1. \u4e3a\u4ec0\u4e48\u6c89\u91d1\u7535\u8def\u677f\u5728\u9ad8\u5bc6\u5ea6\u8868\u9762\u8d34\u88c5\u5de5\u827a\u4e2d\u66f4\u5e38\u89c1\uff1f<\/h3>\n<p>\u6c89\u91d1\u7535\u8def\u677f\u7684\u710a\u76d8\u5e73\u6574\u5ea6\u5bf9\u4e8e\u9ad8\u5bc6\u5ea6\u8868\u9762\u8d34\u88c5\u5de5\u827a\u7684\u8d28\u91cf\u81f3\u5173\u91cd\u8981\uff0c\u56e0\u6b64\u5b83\u5728\u8fd9\u79cd\u5e94\u7528\u4e2d\u66f4\u5e38\u89c1\u3002<\/p>\n<h3>2. \u4e3a\u4ec0\u4e48\u6c89\u91d1\u7535\u8def\u677f\u5728\u8bd5\u5236\u9636\u6bb5\u66f4\u53d7\u6b22\u8fce\uff1f<\/h3>\n<p>\u6c89\u91d1\u7535\u8def\u677f\u7684\u5f85\u7528\u5bff\u547d\u6bd4\u94c5\u9521\u5408\u91d1\u677f\u957f\uff0c\u8fd9\u4f7f\u5f97\u5b83\u5728\u8bd5\u5236\u9636\u6bb5\u66f4\u53d7\u6b22\u8fce\u3002<\/p>\n<h3>3. \u8d8b\u80a4\u6548\u5e94\u5bf9\u7535\u8def\u677f\u6709\u4ec0\u4e48\u5f71\u54cd\uff1f<\/h3>\n<p>\u8d8b\u80a4\u6548\u5e94\u4f1a\u5bfc\u81f4\u9ad8\u9891\u4fe1\u53f7\u5728\u5bfc\u7ebf\u8868\u9762\u96c6\u4e2d\u4f20\u8f93\uff0c\u5f71\u54cd\u4fe1\u53f7\u8d28\u91cf\u3002<\/p>\n<h3>4. \u6c89\u91d1\u7535\u8def\u677f\u548c\u9540\u91d1\u7535\u8def\u677f\u6709\u4ec0\u4e48\u533a\u522b\uff1f<\/h3>\n<p>\u6c89\u91d1\u7535\u8def\u677f\u548c\u9540\u91d1\u7535\u8def\u677f\u5728\u6676\u4f53\u7ed3\u6784\u3001\u710a\u63a5\u6027\u80fd\u3001\u5f85\u7528\u5bff\u547d\u548c\u4fe1\u53f7\u4f20\u8f93\u65b9\u9762\u5b58\u5728\u533a\u522b\u3002<\/p>\n<h3>5. \u5982\u4f55\u9009\u62e9\u9002\u5408\u81ea\u5df1\u9700\u6c42\u7684\u7535\u8def\u677f\u7535\u9540\u7c7b\u578b\uff1f<\/h3>\n<p>\u9009\u62e9\u7535\u8def\u677f\u7535\u9540\u7c7b\u578b\u5e94\u8003\u8651\u5e94\u7528\u9700\u6c42\u3001\u6210\u672c\u548c\u6027\u80fd\uff0c\u6700\u597d\u54a8\u8be2\u4e13\u4e1a\u5236\u9020\u5546\u7684\u5efa\u8bae\u3002\u5982\u679c\u60a8\u9700\u8981\u66f4\u591a\u4fe1\u606f\uff0c\u8bf7\u968f\u65f6\u4e0e\u6211\u4eec\u8054\u7cfb\u3002<\/p>\n<h3>6. \u6c89\u91d1\u548c\u9540\u91d1\uff0c\u5230\u5e95\u54ea\u4e2a\u91d1\u5c42\u66f4\u539a\uff1f<\/h3>\n<p>\u9540\u91d1\uff08\u7535\u9540\u786c\u91d1\uff09\u66f4\u539a\uff0c\u91d1\u5c42\u901a\u5e38 0.5\u20131.5 \u03bcm\uff1b\u6c89\u91d1\uff08ENIG\uff09\u53ea\u6709 0.05\u20130.1 \u03bcm\uff0c\u5dee\u4e00\u4e2a\u6570\u91cf\u7ea7\u3002\u6c89\u91d1\u91cc\u7684&#8221;\u6c89&#8221;\u6307\u7684\u662f\u5316\u5b66\u6c89\u79ef\u65b9\u5f0f\uff0c\u4e0d\u662f\u539a\u5ea6\u3002\u6c89\u91d1\u7684\u91d1\u5c42\u53ea\u8d77\u4fdd\u62a4\u954d\u5c42\u4e0d\u88ab\u6c27\u5316\u7684\u4f5c\u7528\uff0c\u710a\u63a5\u65f6\u91d1\u4f1a\u8fc5\u901f\u6eb6\u5165\u710a\u6599\uff0c\u771f\u6b63\u5f62\u6210\u710a\u70b9\u7684\u662f\u4e0b\u9762\u7684\u954d\u3002<\/p>\n<h3>7. 3-4 mil \u7ebf\u8ddd\u4e0b\u4e3a\u4ec0\u4e48\u4e0d\u80fd\u7528\u6574\u677f\u9540\u91d1\uff1f<\/h3>\n<p>\u56e0\u4e3a\u7535\u9540\u91d1\u4f1a\u6c89\u79ef\u5728\u8d70\u7ebf\u4fa7\u9762\uff0c\u8680\u523b\u540e\u6b8b\u7559\u7684\u91d1\u5c42\u8fb9\u7f18\u4f1a\u5f62\u6210\u7ec6\u957f\u91d1\u5c5e\u987b\uff08sliver\uff09\uff0c\u5728\u540e\u7eed\u5de5\u5e8f\u4e2d\u503e\u5012\u8de8\u63a5\u5230\u76f8\u90bb\u8d70\u7ebf\uff0c\u9020\u6210\u91d1\u4e1d\u77ed\u8def\u3002\u7ebf\u8ddd\u8d8a\u5c0f\u98ce\u9669\u8d8a\u9ad8\u3002ENIG \u53ea\u5728\u710a\u76d8\u4e0a\u6c89\u79ef\uff0c\u8d70\u7ebf\u4fa7\u9762\u6ca1\u6709\u91d1\u5c42\uff0c\u4ece\u539f\u7406\u4e0a\u907f\u514d\u4e86\u8fd9\u4e2a\u95ee\u9898\u3002<\/p>\n<h3>8. \u91d1\u624b\u6307\u4e3a\u4ec0\u4e48\u4e00\u5b9a\u8981\u7535\u9540\u786c\u91d1\u800c\u4e0d\u80fd\u7528\u6c89\u91d1\uff1f<\/h3>\n<p>\u56e0\u4e3a\u63d2\u62d4\u78e8\u635f\u3002\u6c89\u91d1\u7684\u91d1\u5c42\u53ea\u6709 0.05\u20130.1 \u03bcm\uff0c\u63d2\u62d4\u51e0\u5341\u6b21\u5c31\u4f1a\u78e8\u7a7f\u9732\u51fa\u954d\u5c42\uff0c\u954d\u6c27\u5316\u540e\u63a5\u89e6\u7535\u963b\u6025\u5267\u4e0a\u5347\u3002\u7535\u9540\u786c\u91d1\u539a\u5ea6\u53ef\u8fbe 0.5\u20131.5 \u03bcm \u4e14\u786c\u5ea6\u9ad8\uff08\u6dfb\u52a0\u94b4\u6216\u954d\u7684\u5408\u91d1\u91d1\uff09\uff0c\u80fd\u627f\u53d7\u6570\u767e\u5230\u4e0a\u5343\u6b21\u63d2\u62d4\u3002\u5e38\u89c1\u505a\u6cd5\u662f\u6574\u677f\u505a ENIG\uff0c\u518d\u5728\u91d1\u624b\u6307\u533a\u57df\u5c40\u90e8\u52a0\u9540\u786c\u91d1\u3002<\/p>\n<h3>9. \u4ec0\u4e48\u662f\u9ed1\u76d8\uff1f\u600e\u4e48\u907f\u514d\uff1f<\/h3>\n<p>\u9ed1\u76d8\u662f ENIG \u7279\u6709\u7684\u5931\u6548\u6a21\u5f0f\uff1a\u6c89\u91d1\u6db2\u5bf9\u954d\u5c42\u8fc7\u5ea6\u8150\u8680\uff0c\u5728\u954d\u91d1\u754c\u9762\u5f62\u6210\u5bcc\u78f7\u8106\u5316\u5c42\uff0c\u5916\u89c2\u53ef\u80fd\u6b63\u5e38\u4f46\u710a\u70b9\u5f3a\u5ea6\u6781\u4f4e\u3001\u6613\u8131\u843d\u3002\u907f\u514d\u529e\u6cd5\u662f\u63a7\u5236\u91d1\u69fd\u53c2\u6570\uff08\u6e29\u5ea6\u3001pH\u3001\u91d1\u6d53\u5ea6\uff09\u4e0e\u6d78\u91d1\u65f6\u95f4\uff0c\u5173\u952e\u9879\u76ee\u6539\u7528 ENEPIG\uff08\u94af\u5c42\u80fd\u963b\u9694\u954d\u7684\u8fc7\u5ea6\u8150\u8680\uff09\uff0c\u5e76\u8981\u6c42\u677f\u5382\u63d0\u4f9b\u53c2\u6570\u7ba1\u63a7\u8bb0\u5f55\u4e0e\u5468\u671f\u5207\u7247\u62a5\u544a\u3002<\/p>\n<h3>10. ENIG \u7684\u91d1\u5c42\u539a\u5ea6\u8981\u6c42\u591a\u5c11\u5408\u9002\uff1f<\/h3>\n<p>IPC-4552 \u5bf9 ENIG \u7684\u91d1\u5c42\u8981\u6c42\u662f 0.05\u20130.125 \u03bcm\uff082\u20135 \u03bcin\uff09\u3002\u592a\u8584\uff08&lt;0.05 \u03bcm\uff09\u954d\u5c42\u6613\u6c27\u5316\u5bfc\u81f4\u62d2\u710a\uff1b\u592a\u539a\uff08&gt;0.15 \u03bcm\uff09\u4f1a\u589e\u52a0\u91d1\u8106\u98ce\u9669\uff0c\u4e14\u6210\u672c\u4e0a\u5347\u3002\u5e38\u89c4\u63a8\u8350\u63a7\u5236\u5728 0.08\u20130.10 \u03bcm\uff0c\u540c\u65f6\u954d\u5c42\u4fdd\u8bc1 3\u20136 \u03bcm\u3002<\/p>\n<p><strong>Further Reading<\/strong>\uff1a<a href=\"\/en\/blog\/pcb-immersion-gold-and-electroplating\/\">PCB\u6c89\u91d1\u4e0e\u9540\u91d1\u5de5\u827a\u539f\u7406<\/a> \u00b7 <a href=\"\/en\/blog\/tips-for-purchasing-smt-machines\/\">How to Choose the Right SMT Placement Machine<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>\u7535\u8def\u677f\u5728\u73b0\u4ee3\u7535\u5b50\u5236\u9020\u4e2d\u626e\u6f14\u7740\u81f3\u5173\u91cd\u8981\u7684\u89d2\u8272\uff0c\u800c\u7535\u9540\u662f\u5176\u4e2d\u4e00\u4e2a\u5173\u952e\u7684\u5de5\u827a\u3002\u4e0d\u540c\u7c7b\u578b\u7684\u7535\u8def\u677f\u7535\u9540\u80fd\u591f\u6ee1\u8db3\u5404\u79cd\u4e0d\u540c\u7684 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"Comparison of Gold Plating and Immersion Gold on Printed Circuit Boards - Jingpeng Electronics","description":"What is the difference between gold plating and electroless gold plating? This article compares the differences between full-board gold plating and electroless gold plating in terms of process, cost, solderability, and applicable scenarios. It provides ready-to-use parameters and key operational guidelines."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[406,26],"tags":[],"class_list":["post-2741","post","type-post","status-publish","format-standard","hentry","category-pcb-manufacturing","category-blog"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2741","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=2741"}],"version-history":[{"count":3,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2741\/revisions"}],"predecessor-version":[{"id":19881,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2741\/revisions\/19881"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=2741"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=2741"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=2741"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}