{"id":2733,"date":"2025-08-25T21:27:43","date_gmt":"2025-08-25T13:27:43","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2733"},"modified":"2026-10-02T17:37:55","modified_gmt":"2026-10-02T09:37:55","slug":"green-oil-plugging","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/green-oil-plugging\/","title":{"rendered":"Common Issues in PCB Solder Mask Window Design"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<div data-zone-id=\"0\" data-line-index=\"0\" data-line=\"true\"><\/div>\n<div data-zone-id=\"0\" data-line-index=\"1\" data-line=\"true\">In the printed circuit board (PCB) manufacturing industry, solder mask window design\u2014a critical factor affecting product quality and production efficiency\u2014often serves as a major point of contention in communications between manufacturers and customers. In particular, customers\u2019 specific requirements for the solder mask treatment of VIA holes (via holes)\u2014such as full solder mask coverage, partial openings, or single-sided openings\u2014can, if not handled properly, not only lead to production rework and increased costs but also cause serious issues such as soldering failures and signal interference down the line.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"1\" data-line=\"true\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-6583\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/through-hole-cover-oil-vs-through-hole-window-opening.jpg\" alt=\"The Difference Between Via Filling and Via Exposed\" width=\"972\" height=\"548\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/through-hole-cover-oil-vs-through-hole-window-opening.jpg 972w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/through-hole-cover-oil-vs-through-hole-window-opening-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/through-hole-cover-oil-vs-through-hole-window-opening-768x433.jpg 768w\" sizes=\"auto, (max-width: 972px) 100vw, 972px\" \/><\/div>\n<div data-zone-id=\"0\" data-line-index=\"1\" data-line=\"true\">According to industry statistics, the PCB defect rate caused by improper green-oil window design accounts for 18%-25% of the total defect rate, directly affecting order delivery times and customer satisfaction.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"2\" data-line=\"true\">As a professional PCB manufacturer, how can we effectively address the challenges of green solder mask window design and strike a balance between customer requirements and production feasibility? This article will provide industry professionals with practical technical guidelines and solutions\u2014covering aspects such as the selection of surface treatment methods, key points for reviewing green solder mask window designs, process optimization strategies, and handling special scenarios\u2014to help improve production efficiency and product yield.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"3\" data-line=\"true\">\n<h2 class=\"heading-h2\">I. Key Challenges in PCB Solder Mask Window Design: Analyzing the Conflict Between Customer Requirements and Production Constraints<\/h2>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"4\" data-line=\"true\">In the PCB manufacturing process, the primary function of solder mask is to protect copper foil circuits, prevent oxidation and corrosion, and avoid soldering short circuits. Solder mask openings, on the other hand, are exposed areas reserved for critical regions such as pads, test points, and VIA holes, and they directly impact subsequent assembly and electrical performance. Currently, the challenges customers face with solder mask window design are primarily concentrated on the handling of VIA holes, which can be categorized into three types:<\/div>\n<div data-zone-id=\"0\" data-line-index=\"5\" data-line=\"true\">\n<h3 class=\"heading-h3\">(1) VIA holes fully covered with green solder mask (no openings)<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"6\" data-line=\"true\">Some customers, due to product sealing and dust-proofing requirements, request that VIA holes be completely covered with solder mask, without leaving any openings. Although this design enhances the protection of the PCB surface, it can lead to two major issues during production: First, after the green solder mask cures, it may block the vias, preventing solder from penetrating during subsequent through-hole soldering and affecting electrical conductivity; Second, if a tin-plating surface treatment is used, the high-temperature molten tin may react with the solder mask inside the holes, causing bubbles or peeling and damaging the protective solder mask layer.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"7\" data-line=\"true\">\n<h3 class=\"heading-h3\">(2) Localized VIA Hole Opening (Partial Exposure)<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"8\" data-line=\"true\">To balance protection and soldering requirements, customers often request that VIA holes be opened only in specific areas (such as exposing the outer third of the hole\u2019s edge). The challenge with this design lies in controlling the precision of the windowing\u2014if the windowed area is too small, the effective pad area will be insufficient, leading to cold solder joints during soldering; if the windowed area is too large and exceeds design standards, too much copper foil will be exposed, increasing the risk of oxidation and short circuits. In addition, localized exposure may cause uneven adhesion between the solder mask and the substrate, leading to cracking during subsequent high- and low-temperature testing.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"9\" data-line=\"true\">\n<h3 class=\"heading-h3\">(3) VIA with single-sided window (exposed only on the front or back side)<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"10\" data-line=\"true\">Single-sided window designs are commonly found in PCB products with single-sided soldering or special structures (such as the need for localized electrical connectivity in multilayer boards), but this design places extremely high demands on process compatibility. If the surface treatment method is chosen improperly (such as tin plating), the VIA holes in single-sided windows are prone to forming \u201ctin balls\u201d during production\u2014 \u2014 that is, molten tin seeps into the hole on the side without a window and forms metal particles upon cooling. This not only affects the appearance but may also cause the particles to detach during use, leading to circuit short circuits.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"11\" data-line=\"true\">To address these challenges, manufacturers need to adopt an approach that involves \u201cfirst determining the surface treatment and then optimizing the green ink process,\u201d thereby mitigating production risks at the source while meeting customers\u2019 personalized needs.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"12\" data-line=\"true\">\n<h2 class=\"heading-h2\">II. Surface Treatment Methods: The \u201cPre-Filter\u201d Designed by Green Oil Window\u201d<\/h2>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"13\" data-line=\"true\">PCB surface treatment is a key factor in determining the feasibility of the green solder mask window process. Differences in temperature and chemical properties among various treatment methods directly affect the compatibility of green solder mask treatment for VIA holes. Manufacturers must first identify the type of surface treatment selected by the customer before developing a corresponding green solder mask window solution. The specific classifications and compatibility are as follows:<\/div>\n<div data-zone-id=\"0\" data-line-index=\"14\" data-line=\"true\">\n<h3 class=\"heading-h3\">(1) Hot Air Solder Leveling (HASL): The \u201cNo-Go Zone\u201d for Single-Sided Plugged-Hole Processes\u201d<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"15\" data-line=\"true\">Solder spraying is a widely used surface treatment method in the industry. It works by applying a molten tin-lead alloy (or lead-free tin alloy) evenly to the surface of a PCB at high temperatures (approximately 240\u2013260\u00b0C) to form a protective layer. However, the high temperatures involved in the tin-spraying process create an inherent conflict with single-sided VIA plugging (single-sided solder mask coverage):<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"wX363VuA\" data-start=\"1\"><b>The Risk of Thesis Plagiarism<\/b>: The filling depth of green solder paste in single-sided plated-through holes is typically only 1\/2 to 2\/3 of the hole depth, and the areas not filled with green solder paste form \u201cvoids.\u201d During the tin plating process, molten tin at high temperatures easily penetrates these voids and solidifies upon cooling into tin beads with diameters of 0.1\u20130.3 mm. If these tin beads remain inside the holes or on the surface, they will be deemed cosmetic defects by customers and must be manually removed, increasing production time.<\/li>\n<\/ol>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"x1CCUb7X\" data-start=\"2\"><b>The Risk of Green Paint Peeling Off<\/b>: The high temperatures involved in tin plating can weaken the bond between the green solder mask on single-sided filled vias and the substrate. This is particularly true at the edges of the vias, where the green solder mask is prone to peeling or flaking, exposing the copper foil and increasing the risk of oxidation. According to test data, under the tin-spraying process, the solder mask delamination rate for single-sided filled vias reaches as high as 12%, which is significantly higher than the 3% rate for double-sided filled vias.<\/li>\n<\/ol>\n<div data-zone-id=\"0\" data-line-index=\"18\" data-line=\"true\"><b>Conclusion<\/b>: If a customer chooses tin plating as the surface treatment, designs featuring single-sided VIA plugging (single-sided windowing + solder mask coverage) must be strictly prohibited. It is recommended to switch to double-sided plugging or a fully open-window process to fundamentally prevent issues with solder balls and solder mask delamination.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"19\" data-line=\"true\">\n<h3 class=\"heading-h3\">(2) Electroless Nickel-Gold (ENIG): The \u201cIdeal Partner\u201d for Single-Sided Plugged Holes\u201d<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"20\" data-line=\"true\">The electroless plating process uses chemical deposition to form a nickel layer (5\u201310 \u03bcm thick) and a gold layer (0.05\u20130.1 \u03bcm thick) on the surface of a PCB. It offers the advantages of high-temperature resistance, oxidation resistance, and low contact resistance, and the process temperature is only 80\u201390\u00b0C. and it is highly compatible with green solder mask:<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"i7cZzN8I\" data-start=\"1\"><b>No risk of solder balls<\/b>: The electroplating process does not require high-temperature metal melting, so molten tin does not seep into the vias. Even when vias are designed with single-sided plugging, this ensures that the vias remain clean and free of metal particle residue.<\/li>\n<\/ol>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"XprPGDhG\" data-start=\"2\"><b>High stability of green oil<\/b>: The low-temperature process does not compromise the bond strength between the green solder mask and the substrate. The green solder mask with single-sided via filling maintains good adhesion even after electroless gold plating. Following high-low temperature cycling tests (\u201340\u00b0C to 125\u00b0C, 100 cycles), the cracking rate of the green solder mask is less than 2%.<\/li>\n<\/ol>\n<div data-zone-id=\"0\" data-line-index=\"23\" data-line=\"true\"><b>Suitable Scenarios<\/b>: The electroless gold plating process is suitable for high-precision, high-reliability PCB products (such as medical devices and communication modules). If a customer requires single-sided via exposure with solder mask coverage and has high requirements for soldering stability, electroless gold plating is the preferred surface treatment method.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"24\" data-line=\"true\">\n<h3 class=\"heading-h3\">(3) OSP (Organic Protective Layer): The \u201cBest Value Choice\u201d for Low-Cost Applications\u201d<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"25\" data-line=\"true\">The OSP process provides short-term oxidation protection by forming a thin organic film (0.2\u20130.5 \u03bcm thick) on the surface of copper foil. It offers the advantages of a simple process, low cost, and lead-free, environmentally friendly characteristics. The process temperature is approximately 100\u2013120\u00b0C, and it is highly compatible with green solder mask:<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"JIcuRhhv\" data-start=\"1\"><b>Single-Sided Hole-Filling Compatibility<\/b>: OSP's low-temperature treatment does not cause the green mask to peel off, and the organic film covers only the exposed copper foil without affecting the areas covered by the green mask; therefore, a single-sided via plugging design is acceptable.<\/li>\n<\/ol>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"p3w2iYXy\" data-start=\"2\"><b>Important Notes<\/b>: The OSP protective layer has a relatively short shelf life (typically 6 months). If a customer\u2019s PCB needs to be stored for an extended period, it must be vacuum-sealed after single-sided via plating and include a desiccant to prevent the solder mask and OSP layer from aging together.<\/li>\n<\/ol>\n<div data-zone-id=\"0\" data-line-index=\"28\" data-line=\"true\"><b>Suitable Scenarios<\/b>: OSP is suitable for cost-sensitive PCB products with short production cycles, such as those used in consumer electronics (e.g., home appliances and toys). If the customer\u2019s requirements for VIA via-hole solder mask design are simple (e.g., single-sided openings), OSP can serve as a cost-effective surface treatment option.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"29\" data-line=\"true\">\n<h3 class=\"heading-h3\">(4) Electroless Silver Plating (ENIAg): A \u201cBalanced Solution\u201d for Applications with Moderate Reliability Requirements\u201d<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"30\" data-line=\"true\">The silver plating process forms a silver layer (0.1\u20130.3 \u03bcm thick) on the surface of a PCB through chemical deposition. It features good electrical conductivity and excellent solderability. The process temperature is approximately 70\u201385\u00b0C, and its compatibility with solder mask falls between that of gold plating and OSP:<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"29XOGmzq\" data-start=\"1\"><b>Feasibility of Single-Sided Hole Plugging<\/b>: The low-temperature properties of silver plating make it suitable for single-sided VIA plugging designs; however, the risk of \u201csilver migration\u201d must be taken into account \u2014 \u2014 If a PCB is exposed to a high-humidity environment for an extended period (relative humidity &gt; 60%), the exposed silver layer may undergo an electrochemical reaction with the copper foil at the edges of the solder mask, forming conductive silver filaments that can cause short circuits.<\/li>\n<\/ol>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"E2CVWqTc\" data-start=\"2\"><b>Optimization Suggestions<\/b>: If the customer chooses a silver plating + single-sided blind via design, a \u201csolder mask bridge\u201d (a solder mask isolation strip with a width of \u22650.1 mm) must be added along the edge of the solder mask window to reduce the contact area between the silver layer and the copper foil. We also recommend that the customer control environmental humidity during product use to prevent silver migration.<\/li>\n<\/ol>\n<div data-zone-id=\"0\" data-line-index=\"33\" data-line=\"true\"><b>Suitable Scenarios<\/b>: Immersion silver plating is suitable for PCB products with moderate reliability requirements, such as those used in industrial control and automotive electronics. If a customer requires single-sided via exposure and the operating environment has controlled humidity, immersion silver plating is a choice that balances performance and cost.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"34\" data-line=\"true\"><b>Surface Treatment and Green Oil Window Process Compatibility Chart<\/b><\/div>\n<div data-zone-id=\"0\" data-line-index=\"35\" data-line=\"true\">\n<div class=\"jp-tw\">\n<table class=\"ace-table\" border=\"1\" data-ace-table-col-widths=\"200;200;200;200;200;\">\n<colgroup>\n<col width=\"200\" \/>\n<col width=\"200\" \/>\n<col width=\"200\" \/>\n<col width=\"200\" \/>\n<col width=\"200\" \/><\/colgroup>\n<tbody>\n<tr>\n<td>\n<div data-zone-id=\"xr1sllj5rojjlclimsc6uikmfwgi8da5m86xc1jztbbsft14uzr0y9vzjgn97wciwu381y\" data-line-index=\"0\" data-line=\"true\">Surface Treatment Methods<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1sllj5rojjlclimsc6uikmfwgi8da5m86xc10nm90v9rvjfwu9p0mogkt252rrgwv4e7\" data-line-index=\"0\" data-line=\"true\">Adapted for the \"Green Oil Window\" Process<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1sllj5rojjlclimsc6uikmfwgi8da5m86xc1jyej4ifuzmt8buhrrtd534mj9ucfuz6q\" data-line-index=\"0\" data-line=\"true\">Prohibited \/ Use with Caution Processes<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1sllj5rojjlclimsc6uikmfwgi8da5m86xc1atyk30t5sj0cojzpnidmg9y4hs7uwlu1\" data-line-index=\"0\" data-line=\"true\">Core Strengths<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1sllj5rojjlclimsc6uikmfwgi8da5m86xc1d3o80n98r5s0ehkgvh8rc9abcpm6p9jc\" data-line-index=\"0\" data-line=\"true\">Applicable Scenarios<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td>\n<div data-zone-id=\"xr17btntb2osc5vndfy98n61tb57t985mgrxc1jztbbsft14uzr0y9vzjgn97wciwu381y\" data-line-index=\"0\" data-line=\"true\">Hot Air Solder Leveling (HASL)<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr17btntb2osc5vndfy98n61tb57t985mgrxc10nm90v9rvjfwu9p0mogkt252rrgwv4e7\" data-line-index=\"0\" data-line=\"true\">Double-sided plug holes, fully open windows<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr17btntb2osc5vndfy98n61tb57t985mgrxc1jyej4ifuzmt8buhrrtd534mj9ucfuz6q\" data-line-index=\"0\" data-line=\"true\">Single-sided plug holes<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr17btntb2osc5vndfy98n61tb57t985mgrxc1atyk30t5sj0cojzpnidmg9y4hs7uwlu1\" data-line-index=\"0\" data-line=\"true\">Low cost, high protection<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr17btntb2osc5vndfy98n61tb57t985mgrxc1d3o80n98r5s0ehkgvh8rc9abcpm6p9jc\" data-line-index=\"0\" data-line=\"true\">Consumer electronics, low-end industrial equipment<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td>\n<div data-zone-id=\"xr1zgigb2vdvodf70680b4t8ziiu4i4da1dxc1jztbbsft14uzr0y9vzjgn97wciwu381y\" data-line-index=\"0\" data-line=\"true\">Electrolytic Nickel-in-Gold (ENIG)<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1zgigb2vdvodf70680b4t8ziiu4i4da1dxc10nm90v9rvjfwu9p0mogkt252rrgwv4e7\" data-line-index=\"0\" data-line=\"true\">Single-sided plugged holes, with localized openings<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1zgigb2vdvodf70680b4t8ziiu4i4da1dxc1jyej4ifuzmt8buhrrtd534mj9ucfuz6q\" data-line-index=\"0\" data-line=\"true\">\u65e0<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1zgigb2vdvodf70680b4t8ziiu4i4da1dxc1atyk30t5sj0cojzpnidmg9y4hs7uwlu1\" data-line-index=\"0\" data-line=\"true\">High-temperature resistance, high reliability<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1zgigb2vdvodf70680b4t8ziiu4i4da1dxc1d3o80n98r5s0ehkgvh8rc9abcpm6p9jc\" data-line-index=\"0\" data-line=\"true\">Medical Devices, Communication Modules<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td>\n<div data-zone-id=\"xr1p9sc4non4govoz6jgmnyestfedr9o6w4xc1jztbbsft14uzr0y9vzjgn97wciwu381y\" data-line-index=\"0\" data-line=\"true\">OSP<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1p9sc4non4govoz6jgmnyestfedr9o6w4xc10nm90v9rvjfwu9p0mogkt252rrgwv4e7\" data-line-index=\"0\" data-line=\"true\">Single-sided plug holes, fully open windows<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1p9sc4non4govoz6jgmnyestfedr9o6w4xc1jyej4ifuzmt8buhrrtd534mj9ucfuz6q\" data-line-index=\"0\" data-line=\"true\">Local Window Opening (High Precision Required)<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1p9sc4non4govoz6jgmnyestfedr9o6w4xc1atyk30t5sj0cojzpnidmg9y4hs7uwlu1\" data-line-index=\"0\" data-line=\"true\">Low cost, lead-free, and environmentally friendly<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1p9sc4non4govoz6jgmnyestfedr9o6w4xc1d3o80n98r5s0ehkgvh8rc9abcpm6p9jc\" data-line-index=\"0\" data-line=\"true\">Home Appliances, Toys<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td>\n<div data-zone-id=\"xr1hgobmt5ytvukyqj1qqy4smb0hj0jvl52xc1jztbbsft14uzr0y9vzjgn97wciwu381y\" data-line-index=\"0\" data-line=\"true\">Silver Plating (ENIAg)<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1hgobmt5ytvukyqj1qqy4smb0hj0jvl52xc10nm90v9rvjfwu9p0mogkt252rrgwv4e7\" data-line-index=\"0\" data-line=\"true\">Single-sided plugged holes, with localized openings<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1hgobmt5ytvukyqj1qqy4smb0hj0jvl52xc1jyej4ifuzmt8buhrrtd534mj9ucfuz6q\" data-line-index=\"0\" data-line=\"true\">Single-sided plugging in high-humidity environments<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1hgobmt5ytvukyqj1qqy4smb0hj0jvl52xc1atyk30t5sj0cojzpnidmg9y4hs7uwlu1\" data-line-index=\"0\" data-line=\"true\">Good electrical conductivity and excellent weldability<\/div>\n<\/td>\n<td>\n<div data-zone-id=\"xr1hgobmt5ytvukyqj1qqy4smb0hj0jvl52xc1d3o80n98r5s0ehkgvh8rc9abcpm6p9jc\" data-line-index=\"0\" data-line=\"true\">Industrial Control, Automotive Electronics<\/div>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"36\" data-line=\"true\">\n<h2 class=\"heading-h2\">III. Design Review for Green Oil Windows: A Critical Step from \u201cCustomer Requirements\u201d to \u201cTechnical Implementation\u201d<\/h2>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"37\" data-line=\"true\">Once the surface treatment method has been determined, the manufacturer must conduct a detailed review of the green-oil window design documents provided by the customer, focusing on identifying \u201cpotential process risks,\u201d and communicate with the customer to develop optimization plans to avoid rework during later stages of production. The review should focus on the following key areas:<\/div>\n<div data-zone-id=\"0\" data-line-index=\"38\" data-line=\"true\">\n<h3 class=\"heading-h3\">(1) VIA Hole Solder Paste Coverage: Avoid Designs Where \u201cSolder Paste Covers the Hole Opening\u201d<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"39\" data-line=\"true\">Customers often request that the green solder mask completely cover the VIA openings (i.e., that the edge of the green solder mask be flush with the opening) for \u201caesthetic\u201d or \u201cprotective\u201d reasons; however, this design can easily lead to two major problems during production:<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"0g4dZ6Aw\" data-start=\"1\"><b>The Hidden Dangers of Sesizhu<\/b>: Regardless of the surface treatment used, the holes in the green solder mask will result in a \u201cgap\u201d at the junction between the hole and the solder mask; if the subsequent soldering temperature is too high, solder is likely to seep into the gap, forming solder balls;<\/li>\n<\/ol>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"15cuBPAQ\" data-start=\"2\"><b>Green-on-Green Peeling Risk<\/b>: Stress concentration occurs at the interface between the substrate and the copper foil around the hole opening, and the solder mask covering the hole opening exacerbates this stress. During subsequent machining operations (such as cutting or drilling), the solder mask is prone to peeling away from the hole opening.<\/li>\n<\/ol>\n<div data-zone-id=\"0\" data-line-index=\"42\" data-line=\"true\"><b>Optimization Suggestions<\/b>: After consulting with the client, the design was changed from \u201cgreen solder covering the hole opening\u201d to \u201cgreen solder flowing into the hole\u201d \u2014 \u2014 This allows the green solder mask to flow naturally into the hole (to a depth of \u22641\/3 of the hole depth), while leaving a 0.1\u20130.2 mm exposed area around the hole opening (i.e., a \u201ctin ring\u201d). This design ensures the protective function of the green solder mask while preventing the formation of gaps and reducing the risk of solder balls.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"43\" data-line=\"true\">\n<h3 class=\"heading-h3\">(2) Local windowing accuracy: Keep the \u201cwindow deviation\u201d within the specified range<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"44\" data-line=\"true\">When a customer requests a local cutout for a VIA hole, the dimensional accuracy of the cutout area must be verified to ensure compliance with PCB manufacturing standards (IPC-6012):<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"b7P0HfZ1\" data-start=\"1\"><b>Minimum Window Opening Size<\/b>: The exposed area of a local opening must be \u22650.2 mm \u00d7 0.2 mm (i.e., 8 mil \u00d7 8 mil); if it is smaller than this size, the effective soldering area of the pad will be insufficient, which will affect soldering reliability;<\/li>\n<\/ol>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"6Uil740O\" data-start=\"2\"><b>Deviation in Window Placement<\/b>: The deviation between the center of the local opening and the center of the VIA hole must be \u22640.1 mm (4 mil). If the deviation is too large, it may cause the green solder mask to cover critical paths or expose too much copper foil;<\/li>\n<\/ol>\n<ol start=\"3\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"Z0ljIxtx\" data-start=\"3\"><b>Width of L\u00fcyou Bridge<\/b>: If multiple VIA holes are adjacent and all use local openings, the width of the solder mask bridge between adjacent opening areas must be \u22650.1 mm (4 mil) to prevent the bridge from breaking due to excessive narrowness, which could cause a short circuit.<\/li>\n<\/ol>\n<div data-zone-id=\"0\" data-line-index=\"48\" data-line=\"true\"><b>Review Tools<\/b>: Use CAD design software (such as Altium Designer or AutoCAD) to perform layer analysis on the Gerber files provided by the customer, noting any deviations in the dimensions and positions of the cutouts. If these deviations exceed the standard range, prepare a \u201cDesign Optimization Report\u201d that includes the standard requirements and a risk assessment, and consult with the customer to make adjustments.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"49\" data-line=\"true\">\n<h3 class=\"heading-h3\">(3) \u201cSymmetry\u201d of Single-Sided Window Openings: Avoiding \u201cUneven Stress on One Side\u201d<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"50\" data-line=\"true\">For VIA single-sided window designs, the selection of the window surface and the symmetry of the green solder mask coverage must be reviewed:<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"UDdzDNr1\" data-start=\"1\"><b>Compatibility with Window Openings<\/b>: If the PCB is a multilayer board, when cutting a window on one side, ensure that the side with the window matches the side where soldering will take place\u2014for example, if the customer is soldering on the front side of the PCB, the window should be cut on the front side to avoid cutting it on the back side, which would prevent the solder from making contact with the traces inside the holes during soldering;<\/li>\n<\/ol>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"ELalNatC\" data-start=\"2\"><b>Green Cover Symmetry<\/b>: Even with single-sided vias, the solder mask coverage must remain symmetrical to prevent uneven distribution of the solder mask within the vias, which could cause stress imbalance when the PCB is heated and result in warping.<\/li>\n<\/ol>\n<div data-zone-id=\"0\" data-line-index=\"53\" data-line=\"true\"><b>Case Studies<\/b>: A customer designed single-sided via windows (reverse-side windows) for a multilayer communication board, but subsequent soldering had to be performed on the front side, resulting in poor electrical continuity within the vias after soldering. After reviewing the design and identifying the issue, the manufacturer recommended that the customer change the configuration to \u201cfront-side windowing with partial solder mask coverage\u201d and adjust the solder mask fill depth. This ultimately resolved the conductivity issue, reducing the defect rate from 25% to 3%.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"54\" data-line=\"true\">\n<h2 class=\"heading-h2\">IV. The \u201cBest Solution\u201d for the \u201cGreen Window\u201d Issue: Process Optimization and Scenario Adaptation<\/h2>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"55\" data-line=\"true\">Based on the type of surface treatment and the results of the green solder mask window design review, manufacturers can choose either the \u201cdouble-sided via-filling process\u201d or the \u201ctin ring around the green solder mask window\u201d as the core solution. The applicable scenarios, key operational points, and advantages of these two approaches are as follows:<\/div>\n<div data-zone-id=\"0\" data-line-index=\"56\" data-line=\"true\">\n<h3 class=\"heading-h3\">(1) Double-Sided Plugging Process: The \u201cPreferred Solution\u201d for Applications Requiring High Reliability\u201d<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"57\" data-line=\"true\">The double-sided via plugging process involves using screen printing or vacuum via plugging equipment to simultaneously fill the via holes on both the front and back sides of the PCB with solder mask, achieving full coverage of the via holes. This is followed by processes such as pre-curing, exposure, development, and final curing to form a complete solder mask protective layer. This process is suitable for all surface finishes and is particularly well-suited for high-reliability PCB products:<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"uu8UgNpd\" data-start=\"1\"><b>Core Strengths<\/b>\uff1a<\/li>\n<\/ol>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">No risk of solder balls: Full-hole green solder mask filling prevents voids inside the holes, ensuring that no molten solder seeps in or metal particles remain, regardless of whether the process involves spray tinning, electroless gold plating, or OSP;<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">High Protection: Double-sided plugging completely isolates the VIA holes from the outside environment, effectively protecting against moisture, dust, and corrosive gases, and extending the PCB's service life;<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">Structural Stability: The green solder mask is evenly distributed within the holes, reducing uneven stress on the PCB when it is heated and minimizing the risk of warping.<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"waDgkglu\" data-start=\"2\"><b>Key Points for Operation<\/b>\uff1a<\/li>\n<\/ol>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">Green ink selection: Use a \u201chigh-filling photosensitive green ink\u201d (such as the Sun Ink PSER-4000 series) to ensure that the green ink completely fills the holes without any air bubbles;<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">Curing parameters: Pre-curing temperature should be maintained at 70\u201380\u00b0C for 15\u201320 minutes; final curing temperature should be maintained at 150\u2013160\u00b0C for 60\u201390 minutes to ensure the green solder mask is fully cured and to prevent peeling later on;<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">Hole Diameter Compatibility: Double-sided plugging is suitable for VIA holes with a diameter of \u22650.2 mm. If the hole diameter is &lt;0.2 mm, vacuum plugging equipment must be used to prevent the solder mask from failing to fill the hole.<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ol start=\"3\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"53RSeri9\" data-start=\"3\"><b>Applicable Scenarios<\/b>: PCB products with extremely high reliability requirements, such as those used in medical devices, aerospace, and automotive electronics, or scenarios where customers require VIA holes to be fully covered with green solder mask and have no openings.<\/li>\n<\/ol>\n<div data-zone-id=\"0\" data-line-index=\"67\" data-line=\"true\">\n<h3 class=\"heading-h3\">(2) Tin Ring Process for the Edges of Green-Coated Windows: A \u201cBalanced Solution\u201d That Strikes a Balance Between Cost and Performance\u201d<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"68\" data-line=\"true\">The \u201ctin ring\u201d process for green mask windows involves leaving a 1\u20132 mil (0.025\u20130.05 mm) exposed copper foil area around the edges of the VIA hole\u2019s green mask window to form a \u201ctin ring,\u201d which is then coated with a surface treatment (such as tin plating or electroless gold plating). This process is suitable for designs with localized or single-sided windows:<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"rxtWylj2\" data-start=\"1\"><b>Core Strengths<\/b>\uff1a<\/li>\n<\/ol>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">Preventing Solder Beads: The presence of the solder ring creates a \u201cbuffer zone\u201d between the green solder mask and the hole opening; even if molten solder seeps in during solder spraying, it will be guided to the surface by the solder ring, preventing the formation of solder beads inside the hole;<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">Improving Soldering Reliability: The tin ring increases the effective area of the pad, allowing the solder to adhere better during the soldering process and reducing the risk of cold solder joints;<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">Cost-effective: No need to add additional via-filling equipment; simply adjust the size of the openings in the green film, making it suitable for small- to medium-volume production.<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"AkJ84Uaa\" data-start=\"2\"><b>Key Points for Operation<\/b>\uff1a<\/li>\n<\/ol>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">Solder Ring Dimension Control: The width of the solder ring must be strictly controlled between 1 and 2 mil. If the width is less than 1 mil, it will not provide adequate protection; if the width exceeds 2 mil, it will expose too much copper foil, increasing the risk of oxidation;<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">Surface Treatment Compatibility: In the tin-plating process, the tin ring forms a uniform tin layer; in the electroless gold plating process, the tin ring forms a nickel-gold layer. Both ensure good solderability;<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">Visual Inspection: After production, AOI (Automated Optical Inspection) equipment must be used to check whether the solder ring is intact and to verify that there are no residues of green solder mask or unevenly exposed copper foil.<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ol start=\"3\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"bw4MoAao\" data-start=\"3\"><b>Applicable Scenarios<\/b>: PCB products for applications with moderate reliability requirements, such as consumer electronics and industrial control, or scenarios where customers require localized or single-sided cutouts and are cost-sensitive.<\/li>\n<\/ol>\n<div data-zone-id=\"0\" data-line-index=\"78\" data-line=\"true\">\n<h3 class=\"heading-h3\">(3) Handling Special Situations: Matching the Type of Photosensitive Ink to the Process<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"79\" data-line=\"true\">It is important to note that both of the above methods are based on \u201cstandard photosensitive green solder mask\u201d (UV-curable). If the customer uses \u201cthermosetting green solder mask,\u201d the process parameters must be adjusted to prevent the solder mask from failing:<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"yqvbHepi\" data-start=\"1\"><b>Properties of Thermosetting Green Enamel<\/b>: Thermosetting green solder mask does not require UV exposure and cures at high temperatures (120\u2013140\u00b0C), but it has poor flow properties, weaker filling capability than standard photoresist green solder mask, and lower compatibility with surface treatments;<\/li>\n<\/ol>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"QiDGv3SD\" data-start=\"2\"><b>Recommendations for Process Adjustments<\/b>\uff1a<\/li>\n<\/ol>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">If using thermosetting solder mask, the double-sided via-filling process is not recommended; instead, you may opt for the \u201csingle-sided via-filling + solder ring\u201d combination to reduce the amount of solder mask used;<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">Thermosetting green mask has poor compatibility with the tin-spraying process and is prone to peeling; it is recommended to use it in combination with immersion gold or OSP surface treatment;<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<ul>\n<li style=\"list-style-type: none;\">\n<ul>\n<li class=\"temp-li bullet2\" data-line=\"true\" data-list=\"bullet2\">Extended curing time: The final curing time for thermosetting green solder mask must be extended to 120\u2013150 minutes to ensure complete curing and improve adhesion.<\/li>\n<\/ul>\n<\/li>\n<\/ul>\n<div data-zone-id=\"0\" data-line-index=\"85\" data-line=\"true\">\n<h2 class=\"heading-h2\">V. Manufacturers\u201c \u201dCustomer Communication Strategies\u201c: From \u201dPassive Acceptance\u201c to \u201dActive Guidance\u201d<\/h2>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"86\" data-line=\"true\">In addition to technical solutions, manufacturers must also establish an efficient customer communication mechanism to guide customers in optimizing the design of green-paint windows early in the project, thereby reducing production risks later on. Specific strategies are as follows:<\/div>\n<div data-zone-id=\"0\" data-line-index=\"87\" data-line=\"true\">\n<h3 class=\"heading-h3\">(1) Provide the \u201cGreen Window Design Specifications Manual\u201d<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"88\" data-line=\"true\">Distribute the standardized \u201cPCB Solder Mask Window Design Specifications Manual\u201d to customers in advance, clearly outlining the following:<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"6p5WCPnE\" data-start=\"1\">Design requirements for green solder mask windows corresponding to different surface treatments (e.g., tin plating prohibits single-sided via filling);<\/li>\n<\/ol>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"WtwXhmUw\" data-start=\"2\">Standard range for VIA hole dimensions (e.g., local opening area \u2265 0.2 mm \u00d7 0.2 mm);<\/li>\n<\/ol>\n<ol start=\"3\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"TJhRBPit\" data-start=\"3\">Examples of Common Design Errors (with Images of Defective Products) and Optimization Solutions;<\/li>\n<\/ol>\n<ol start=\"4\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"0hb7SiF4\" data-start=\"4\">The manufacturer's process capability parameters (such as minimum solder ring width and maximum via diameter).<\/li>\n<\/ol>\n<div data-zone-id=\"0\" data-line-index=\"93\" data-line=\"true\">Use the manual to guide customers in avoiding risks during the design phase and reducing the cost of later revisions.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"94\" data-line=\"true\">\n<h3 class=\"heading-h3\">(2) Issuing a \u201cDesign Feasibility Assessment Report\u201d<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"95\" data-line=\"true\">Within 24 hours of receiving the client\u2019s design documents, we will issue a \u201cGreen Oil Window Design Feasibility Assessment Report,\u201d which includes the following:<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"hCh3jyRp\" data-start=\"1\">Analysis of the Compatibility Between Surface Treatment and Green Oil Window Design;<\/li>\n<\/ol>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"n9PMT29n\" data-start=\"2\">Potential risk factors (e.g., Sesizhu, peeling of green paint) and risk levels (high \/ medium \/ low);<\/li>\n<\/ol>\n<ol start=\"3\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"w2uYtUMO\" data-start=\"3\">Optimization Recommendations (with revised design drawings);<\/li>\n<\/ol>\n<ol start=\"4\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"RV4I4AEd\" data-start=\"4\">Optimized cost and timeline estimates.<\/li>\n<\/ol>\n<div data-zone-id=\"0\" data-line-index=\"100\" data-line=\"true\">Reports should include data and visualizations to help clients clearly understand the need for optimization (e.g., \u201cIf no adjustments are made, the defect rate is projected to reach 151 TP3T, and the delivery cycle will be extended by 3 days\u201d).<\/div>\n<div data-zone-id=\"0\" data-line-index=\"101\" data-line=\"true\">\n<h3 class=\"heading-h3\">(3) Providing \u201cSample Testing Services\u201d<\/h3>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"102\" data-line=\"true\">For high-value or complex PCB orders, we offer a \u201csample testing service\u201d:<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"RWuyhZHQ\" data-start=\"1\">Based on the customer\u2019s original design and the manufacturer\u2019s optimized design, produce 2\u20135 samples;<\/li>\n<\/ol>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"qTeiZkPe\" data-start=\"2\">Perform surface treatment, welding tests, and high- and low-temperature cycling tests on the samples, and issue test reports;<\/li>\n<\/ol>\n<ol start=\"3\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"LqmrwiYP\" data-start=\"3\">Show clients the differences in appearance and performance between the two design prototypes, and use data to demonstrate the advantages of the optimized solution.<\/li>\n<\/ol>\n<div data-zone-id=\"0\" data-line-index=\"106\" data-line=\"true\">Conduct sample testing to build customer confidence in the optimization plan and drive design adjustments.<\/div>\n<div data-zone-id=\"0\" data-line-index=\"107\" data-line=\"true\">\n<h2 class=\"heading-h2\">VI. The \u201cQuality Closed-Loop\u201d in PCB Solder Mask Window Design\u201d<\/h2>\n<\/div>\n<div data-zone-id=\"0\" data-line-index=\"108\" data-line=\"true\">To address customer issues regarding green-painted window designs, a closed-loop quality process must be established: \u201cSurface Treatment Assessment \u2192 Design Review \u2192 Process Optimization \u2192 Customer Communication\u201d:<\/div>\n<ol start=\"1\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"Avaqd8Wv\" data-start=\"1\"><b>Preliminary Assessment<\/b>: First, determine the type of surface treatment. The tin plating process must not involve single-sided via filling; electroless gold, OSP, and electroless silver can be used for single-sided or partial windowing;<\/li>\n<\/ol>\n<ol start=\"2\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"ZhsPBuTO\" data-start=\"2\"><b>Thorough Review<\/b>: Focus on identifying issues such as holes in the green oil cover, insufficient precision in localized cutouts, and asymmetry in single-sided cutouts, and prepare an optimization report;<\/li>\n<\/ol>\n<ol start=\"3\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"YgJIiDmz\" data-start=\"3\"><b>Process Selection<\/b>\uff1a\u9ad8\u53ef\u9760\u6027\u9700\u6c42\u9009\u53cc\u9762\u585e\u5b54\uff0c\u4e2d\u7b49\u9700\u6c42\u9009\u9521\u5708\u5de5\u827a\uff0c\u70ed\u56fa\u5316\u7eff\u6cb9\u9700\u8c03\u6574\u53c2\u6570\uff1b<\/li>\n<\/ol>\n<ol start=\"4\">\n<li class=\"temp-li number1\" data-line=\"true\" data-list=\"number1\" data-ol-id=\"HqW3HxpV\" data-start=\"4\"><b>\u4e3b\u52a8\u6c9f\u901a<\/b>\uff1a\u901a\u8fc7\u89c4\u8303\u624b\u518c\u3001\u8bc4\u4f30\u62a5\u544a\u3001\u6837\u54c1\u6d4b\u8bd5\uff0c\u5f15\u5bfc\u5ba2\u6237\u4f18\u5316\u8bbe\u8ba1\uff0c\u5e73\u8861\u9700\u6c42\u4e0e\u53ef\u884c\u6027\u3002<\/li>\n<\/ol>\n<div data-zone-id=\"0\" data-line-index=\"113\" data-line=\"true\">\u5728\u7535\u8def\u677f\u5236\u9020\u884c\u4e1a\uff0c\u7eff\u6cb9\u7a97\u8bbe\u8ba1\u7684\u7ec6\u8282\u5904\u7406\u76f4\u63a5\u51b3\u5b9a\u4ea7\u54c1\u8d28\u91cf\u4e0e\u5ba2\u6237\u6ee1\u610f\u5ea6\u3002\u5236\u9020\u5546\u9700\u4ee5\u6280\u672f\u4e3a\u6838\u5fc3\uff0c\u4ee5\u6c9f\u901a\u4e3a\u6865\u6881\uff0c\u5c06 \u201c\u5ba2\u6237\u75db\u70b9\u201d \u8f6c\u5316\u4e3a \u201c\u8d28\u91cf\u4eae\u70b9\u201d\uff0c\u5728\u6ee1\u8db3\u4e2a\u6027\u5316\u9700\u6c42\u7684\u540c\u65f6\uff0c\u5efa\u7acb\u9ad8\u6548\u3001\u53ef\u9760\u7684\u751f\u4ea7\u4f53\u7cfb\u3002\u672a\u6765\uff0c\u968f\u7740 PCB \u5411\u9ad8\u5bc6\u5ea6\u3001\u9ad8\u53ef\u9760\u6027\u53d1\u5c55\uff08\u5982 5G \u57fa\u7ad9\u3001\u65b0\u80fd\u6e90\u6c7d\u8f66 PCB\uff09\uff0c\u7eff\u6cb9\u7a97\u5de5\u827a\u5c06\u8fdb\u4e00\u6b65\u5347\u7ea7\uff0c\u5236\u9020\u5546\u9700\u6301\u7eed\u5173\u6ce8\u884c\u4e1a\u6280\u672f\u52a8\u6001\uff0c\u4f18\u5316\u89e3\u51b3\u65b9\u6848\uff0c\u4e3a\u5ba2\u6237\u63d0\u4f9b\u66f4\u4f18\u8d28\u7684\u4ea7\u54c1\u4e0e\u670d\u52a1\u3002<\/div>","protected":false},"excerpt":{"rendered":"<p>\u5728\u7535\u8def\u677f\uff08PCB\uff09\u5236\u9020\u884c\u4e1a\uff0c\u7eff\u6cb9\u7a97\u8bbe\u8ba1\u4f5c\u4e3a\u5f71\u54cd\u4ea7\u54c1\u8d28\u91cf\u4e0e\u751f\u4ea7\u6548\u7387\u7684\u5173\u952e\u73af\u8282\uff0c\u5e38\u6210\u4e3a\u5236\u9020\u5546\u4e0e\u5ba2\u6237\u6c9f\u901a\u7684\u6838\u5fc3\u75db\u70b9\u3002 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":6583,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"Common Issues in PCB Solder Mask Window Design","description":"What are the common pitfalls in green solder mask design? This article explains the compatibility between green solder masks and surface treatment processes\u2014such as tin plating and electroless gold plating\u2014for three specific requirements: full VIA coverage, partial openings, and single-sided openings."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[26],"tags":[345],"class_list":["post-2733","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-345"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2733","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=2733"}],"version-history":[{"count":2,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2733\/revisions"}],"predecessor-version":[{"id":13370,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2733\/revisions\/13370"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media\/6583"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=2733"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=2733"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=2733"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}