{"id":2722,"date":"2025-02-14T09:09:09","date_gmt":"2025-02-14T01:09:09","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2722"},"modified":"2026-10-02T17:37:52","modified_gmt":"2026-10-02T09:37:52","slug":"laser-drilling-hdi-circuit-board","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/laser-drilling-hdi-circuit-board\/","title":{"rendered":"Applications of Laser Drilling in HDI Printed Circuit Boards"},"content":{"rendered":"

In the printed circuit board manufacturing industry,HDI<\/a>The manufacturing process for (High-Density Interconnect) PCBs is becoming increasingly complex, and laser drilling technology has become a key part of that process.<\/p>\n

This article will take an in-depth look at the laser drilling process in HDI PCB manufacturing, with a particular focus on technologies related to CO\u2082 and UV lasers, as well as the different types of dual-head laser drilling systems.<\/p>\n

\"Applications<\/p>\n

1. CO\u2082 Lasers and Ultraviolet Lasers<\/h3>\n

In printed circuit board manufacturing, laser drilling technology uses two main types of lasers: CO\u2082 lasers and ultraviolet lasers. CO\u2082 lasers operate in the far-infrared wavelength range and are suitable for creating micro-through-holes with diameters greater than 100 \u03bcm. In contrast, UV lasers operate in the ultraviolet wavelength range and are suitable for creating micro-holes with diameters less than 100 \u03bcm\u2014even as small as less than 50 \u03bcm. CO\u2082 lasers are widely used for producing large holes due to their high production efficiency, as the drilling time required is very short. UV lasers, on the other hand, offer excellent production capabilities when creating small holes.<\/p>\n

2. Dual-head laser drilling system<\/h3>\n

To meet the growing demand for micro-via holes, many printed circuit board manufacturers have introduced dual-head laser drilling systems. These systems include:<\/p>\n

    \n
  1. Dual-Head UV Drilling System:<\/strong> These systems are suitable for drilling holes smaller than 90 \u03bcm with a high aspect ratio. Ultraviolet lasers can create small holes, but at a slower rate.<\/li>\n
  2. Dual-Head CO\u2082 Laser Drilling System:<\/strong> These systems use Q-switched RF-pumped CO\u2082 lasers. They feature high repetition rates (up to 100 kHz), short drilling times, and a wide working area. However, the drilling quality may be lower.<\/li>\n
  3. Hybrid Laser Drilling System (CO\u2082 and UV):<\/strong> This is the most common dual-head laser drilling system currently available on the market. It consists of an ultraviolet laser head and a CO\u2082 laser head, enabling simultaneous drilling of copper and dielectric materials. The ultraviolet laser is used to drill copper, followed by the CO\u2082 laser to drill the dielectric. This combined approach is highly effective in improving production efficiency.<\/li>\n<\/ol>\n

    3. Factors Affecting Laser Drilling Speed<\/h3>\n

    Whether it is a dual-head, single-wavelength system or a dual-head, dual-wavelength system, both are influenced by the following two main factors:<\/p>\n

      \n
    1. Laser Energy\/Pulse Energy:<\/strong> The energy of the laser pulse and the transmitted power of the beam directly affect the drilling time. The higher the laser energy, the greater the pulse energy, and the faster the drilling speed.<\/li>\n
    2. Beam Positioning System:<\/strong> The beam positioning system determines the speed at which the beam moves between the two holes. These two factors together determine the speed at which the laser drilling machine produces the required micro-holes.<\/li>\n<\/ol>\n

      4. Applications of Drilling Technology<\/h3>\n

      Ultraviolet lasers are suitable for creating small holes and can remove all common copper traces, including copper foil ranging from 3 to 36 \u03bcm, 1 oz, and even electroplated copper foil. However, for non-homogeneous materials such as reinforced glass FR-4, the results are generally poor because removing the glass requires a high energy density, which may damage the inner-layer pads.<\/p>\n

      CO\u2082 lasers are well-suited for removing dielectric materials and perform well even on non-uniform materials, but they generally cannot create holes smaller than 75 \u03bcm, nor can they remove copper. However, they can remove pretreated thin copper foil less than 5 \u03bcm thick.<\/p>\n

      The hybrid laser drilling system incorporates both UV and CO\u2082 lasers, enabling it to perform exceptionally well across a variety of applications. The UV laser is used to create small holes and remove copper, while the CO\u2082 laser is used for rapid drilling of dielectrics.<\/p>\n

      5. Dual-head laser drilling system with programmable distance<\/h3>\n

      Today, most dual-head laser drilling systems feature programmable spacing. This means that the distance between the two drill heads can be adjusted to accommodate different panel specifications, unlike traditional systems where the spacing is fixed. This provides manufacturers with greater flexibility to adapt to varying production needs.<\/p>\n

      With the widespread adoption of HDI PCBs, laser drilling technology has become increasingly important in PCB manufacturing. CO\u2082 lasers and UV lasers each have their own unique characteristics, and dual-head laser drilling systems offer a solution for efficient production. The choice of laser drilling technology depends on the required hole diameter and material. Continued advancements in laser drilling technology will further drive the development of PCB manufacturing to meet the demands of increasingly complex electronic devices.<\/p>\n

      Frequently Asked Questions<\/h2>\n

      1. Why use laser drilling technology?<\/h3>\n

      Laser drilling technology can produce microscopic holes to meet the requirements of high-density circuit boards while improving production efficiency.<\/p>\n

      2. What is the difference between CO\u2082 lasers and UV lasers?<\/h3>\n

      CO\u2082 lasers are suitable for creating large holes, while UV lasers are suitable for small holes. They differ in wavelength and application areas.<\/p>\n

      3. What are the advantages of a laser drilling system with programmable distance?<\/h3>\n

      Systems with programmable spacing offer greater flexibility and can accommodate the production needs of circuit boards of various specifications.<\/p>\n

      4. In which fields is laser drilling technology widely used?<\/h3>\n

      Laser drilling technology is widely used in PCB manufacturing, semiconductor manufacturing, and electronic equipment manufacturing, among other fields.<\/p>\n

      5. Is laser drilling technology suitable for all materials?<\/h3>\n

      Laser drilling technology is suitable for most materials, including copper, dielectrics, and reinforced glass. However, for certain non-homogeneous materials, its effectiveness may be limited.<\/p>","protected":false},"excerpt":{"rendered":"

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