{"id":2692,"date":"2026-11-09T17:00:00","date_gmt":"2026-11-09T09:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2692"},"modified":"2026-10-08T20:16:23","modified_gmt":"2026-10-08T12:16:23","slug":"pcb-wiring-between-components","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/pcb-wiring-between-components\/","title":{"rendered":"How to Route Wires Between PCB Components? Crossed Traces, Ground Points, and Trace Width Selection"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<p>Printed circuit boards are a critical component of electronic devices, and the way components are wired together directly affects the device\u2019s performance and reliability. In this article, we will take an in-depth look at the wiring methods used between components on a printed circuit board and how to make informed design decisions.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"842\" height=\"474\" class=\"alignnone size-large wp-image-8807\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/accurate-line-resistance-control-for-established-wiring-methods.jpg\" alt=\"A Method for Precise Trace Resistance Control in Implementing a Specified Routing Scheme on a PCB\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/accurate-line-resistance-control-for-established-wiring-methods.jpg 842w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/accurate-line-resistance-control-for-established-wiring-methods-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/accurate-line-resistance-control-for-established-wiring-methods-768x432.jpg 768w\" sizes=\"auto, (max-width: 842px) 100vw, 842px\" \/><\/p>\n<h2>Solutions for Cross-Circuit Issues<\/h2>\n<p>In printed circuit board design, crosstalk is a common issue that requires careful handling. There are typically two ways to address this problem:<strong>\u94bb<\/strong>\u548c<strong>\u7ed5<\/strong>\u3002<\/p>\n<ol>\n<li><strong>\u94bb<\/strong>: This means routing a lead through the gaps beneath other resistors, capacitors, or transistor pins. This method effectively prevents short circuits.<\/li>\n<li><strong>\u7ed5<\/strong>: Another method is to have the lead \u201cwrap around\u201d one end of a wire it might cross. This approach can also help us solve the problem of crossed circuits.<\/li>\n<\/ol>\n<p>In certain special circumstances\u2014such as when a circuit is very complex\u2014the use of jumper wires is permitted to resolve cross-circuit issues and simplify the design. However, this should be a last resort, as it may introduce other potential problems.<\/p>\n<h2>Advanced: The True Solution to Cross-Disciplinary Issues in Modern Design<\/h2>\n<p>The \"drilling\" and \"routing\" techniques described in the original text are routing techniques from the era of single-sided boards. With double-sided and multilayer boards, crossing paths is no longer solved by routing around them, but rather by<strong>Change Floor<\/strong>\u4e0e<strong>Via<\/strong>. Only by understanding this change can you correctly apply the intuition gained from manual routing to EDA tools:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Solution<\/th>\n<th>Applicable Board Types<\/th>\n<th>Cost<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Drill \/ Wind<\/td>\n<td>Single-sided board<\/td>\n<td>As the trace length increases, parasitic parameters increase.<\/td>\n<\/tr>\n<tr>\n<td>Jumper Wire<\/td>\n<td>Single-sided PCB, Prototype<\/td>\n<td>Cannot be mass-produced; poor reliability<\/td>\n<\/tr>\n<tr>\n<td>Via-to-Via Layer Change<\/td>\n<td>Double-sided boards and above<\/td>\n<td>Occupies two layers of space and adds vias<\/td>\n<\/tr>\n<tr>\n<td>Adjust the layout<\/td>\n<td>All Board Types<\/td>\n<td>Preferred option at no additional cost<\/td>\n<\/tr>\n<tr>\n<td>Add a wiring layer<\/td>\n<td>Multilayer Board<\/td>\n<td>Rising Costs<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The priorities are clear:<strong>First, adjust the layout; then, change the floor; and finally, consider adding a floor.<\/strong>. Many network configurations that seem impossible to set up can actually be resolved simply by swapping the positions of two components\u2014and this costs nothing.<\/p>\n<ul>\n<li><strong>The number of crossovers is an indicator<\/strong>: An abnormally low coverage rate often indicates a problem with the layout, rather than an insufficient number of layers;<\/li>\n<li><strong>Vias aren't free.<\/strong>: Each via takes up space on each layer, which is particularly noticeable in dense BGA areas;<\/li>\n<li><strong>Jumper wires are used only on prototypes.<\/strong>: This must be eliminated in mass production; otherwise, automated assembly will not be possible.<\/li>\n<\/ul>\n<ol>\n<li>First, use the density of the rat's nest to assess the quality of the layout;<\/li>\n<li>Adjust the position and orientation of components to reduce intersections;<\/li>\n<li>Resolve any remaining intersections by alternating layers, and finally assess whether additional layers are needed.<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1407\" height=\"791\" class=\"alignnone size-large wp-image-8931\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-layout-design-specification.jpg\" alt=\"PCB Layout Design Specifications\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-layout-design-specification.jpg 1407w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-layout-design-specification-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-layout-design-specification-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-layout-design-specification-768x432.jpg 768w\" sizes=\"auto, (max-width: 1407px) 100vw, 1407px\" \/><\/p>\n<p>For layout rules, see<a href=\"\/en\/blog\/13-rules-for-layout-of-printed-circuit-board-components\/\">13 Rules for Laying Out Components on Printed Circuit Boards<\/a>; For common errors, see<a href=\"\/en\/blog\/common-errors-in-printed-circuit-board-design\/\">How to Avoid Common Mistakes in Printed Circuit Board Design<\/a>\u3002<\/p>\n<h2>Component Mounting Methods<\/h2>\n<p>There are two common mounting methods for components such as resistors, diodes, and tubular capacitors:<strong>Upright<\/strong>\u548c<strong>Horizontal<\/strong>\u3002<\/p>\n<ol>\n<li><strong>Upright<\/strong>: This mounting method refers to the installation and soldering of components perpendicular to the circuit board. Its advantage is that it saves space, since the components are mounted perpendicular to the circuit board and occupy a relatively small surface area.<\/li>\n<li><strong>Horizontal<\/strong>: Horizontal mounting refers to the installation and soldering of components so that their bodies are parallel to and in close contact with the circuit board. Its advantage is that it provides better mechanical strength because there is a larger contact area between the component and the circuit board.<\/li>\n<\/ol>\n<p>It is important to note that these two different mounting methods result in different hole spacings for components on the printed circuit board; therefore, this factor must be taken into account when designing the circuit board.<\/p>\n<h2>Selecting an Earthing Point<\/h2>\n<p>In circuit board design, ground points within the same circuit stage should be located as close together as possible. In addition, the power supply filter capacitors for that stage should be connected to the ground point for that stage. This principle is crucial for ensuring the stable operation of the circuit.<\/p>\n<p>It is particularly important to note that the ground points for the base and emitter of the transistor in this stage must not be too far apart; otherwise, interference and oscillation may occur. Circuit designs that employ the \u201csingle-point grounding method\u201d can help ensure circuit stability; this method requires the circuit to operate relatively stably and be less prone to oscillation.<\/p>\n<h2>Arrangement of the Main Ground Wire<\/h2>\n<p>The ground plane is an important component of a printed circuit board, and its layout must follow certain principles. Generally, it should be arranged strictly in the order of high-frequency, medium-frequency, and low-frequency; in principle, it should be arranged from low-voltage to high-voltage.<\/p>\n<p>Violating this principle and haphazardly connecting the ground wire in various ways may cause the circuit to become unstable or even fail to function properly. This is especially true for frequency-conversion heads, regenerative heads, and frequency-modulation heads, among others.<a href=\"\/en\/high-frequency-pcb\/\">High-Frequency Circuits<\/a>...The layout requirements for ground traces are even more stringent. High-frequency circuits often use large-area, enclosing ground traces to ensure effective shielding.<\/p>\n<h2>Advanced: Three Grounding Topologies and Their Applicable Scenarios<\/h2>\n<p>The original text describes the \u201csingle-point grounding method\u201d and the hierarchical arrangement of the main ground bus\u2014these are classic best practices from the low-frequency era. A comprehensive grounding strategy can be divided into three topologies based on signal frequency:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Topology<\/th>\n<th>Applicable Frequency<\/th>\n<th>Instructions<\/th>\n<th>Risks<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Single-Point Grounding (Series)<\/td>\n<td>Low frequency, &lt; 1 MHz<\/td>\n<td>The ground wires from each unit are connected to a single point.<\/td>\n<td>The ground wire is long, resulting in high impedance at high frequencies.<\/td>\n<\/tr>\n<tr>\n<td>Single-Point Grounding (Parallel)<\/td>\n<td>Low frequency, &lt; 1 MHz<\/td>\n<td>Each unit has its own independent return connection to ground<\/td>\n<td>There are many ground wires, and the wiring is complex.<\/td>\n<\/tr>\n<tr>\n<td>Multiple-Point Grounding<\/td>\n<td>High frequency, &gt; 10 MHz<\/td>\n<td>Connect to a low-impedance ground plane as close as possible<\/td>\n<td>Ground loops are prone to forming at low frequencies.<\/td>\n<\/tr>\n<tr>\n<td>Mixed Grounding<\/td>\n<td>Wideband Mixing<\/td>\n<td>Process by frequency band and use capacitors\/inductors for isolation<\/td>\n<td>High design complexity<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The key metric for making this determination is<strong>The impedance of the ground wire, not its resistance<\/strong>. As the frequency increases, the inductive reactance of the ground wire becomes dominant, and a long ground wire can create common-impedance coupling\u2014which is precisely why the original text emphasizes that \u201cground points within the same circuit level should be as close together as possible.\u201d In the high-frequency range, it is best to simply use a continuous ground plane instead of a ground wire to keep the return path as short as possible.<\/p>\n<ul>\n<li><strong>Low-Frequency Analog Circuits<\/strong>: Single-point grounding to prevent common-mode interference introduced by ground loops;<\/li>\n<li><strong>Digital and High-Frequency Circuits<\/strong>: Complete ground plane + multipoint grounding;<\/li>\n<li><strong>Hybrid System<\/strong>: Separate the digital ground and analog ground into distinct zones and connect them at a single point to prevent digital noise from entering the analog section.<\/li>\n<\/ul>\n<ol>\n<li>First, identify the signal frequency ranges for each section of the board;<\/li>\n<li>Select a grounding topology based on frequency;<\/li>\n<li>In a hybrid system, ensure proper partitioning and single-point connections.<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"800\" height=\"450\" class=\"alignnone size-large wp-image-6393\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/rf-pcb-design.jpg\" alt=\"RF PCB Design\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/rf-pcb-design.jpg 800w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/rf-pcb-design-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/rf-pcb-design-768x432.jpg 768w\" sizes=\"auto, (max-width: 800px) 100vw, 800px\" \/><\/p>\n<p>See High-Frequency Design<a href=\"\/en\/high-frequency-pcb\/\">High-Frequency Circuit Boards<\/a>; For signal integrity, see<a href=\"\/en\/blog\/pcb-design-signal-integrity\/\">Signal Integrity Issues in PCB Design<\/a>\u3002<\/p>\n<h2>Selecting Lead Width and Length<\/h2>\n<p>High-current traces, such as common ground lines and power supply traces for power amplifiers, should be as wide as possible. This reduces trace resistance and voltage drop, thereby minimizing oscillation caused by parasitic coupling. High-impedance traces should be kept as short as possible, while low-impedance traces can be slightly longer. This is because high-impedance traces are prone to picking up signals, which can cause circuit instability.<\/p>\n<p>In circuit board design, selecting appropriate trace widths and lengths is one of the key factors in ensuring the circuit functions properly.<\/p>\n<h2>Advanced: The Quantitative Relationship Between Wire Gauge and Current Carrying Capacity<\/h2>\n<p>The original text states that high-current traces should be as wide as possible, but does not specify a specific magnitude. The most commonly used reference in engineering is the empirical data from IPC-2221, which, under conditions of 1 oz copper thickness and a temperature rise of 10 \u00b0C, specifies:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Line Width<\/th>\n<th>Outer-layer current-carrying<\/th>\n<th>Inner-layer current-carrying<\/th>\n<th>Typical Applications<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>0.25 mm (10 mil)<\/td>\n<td>Approx. 1.0 A<\/td>\n<td>Approximately 0.7 A<\/td>\n<td>General-purpose signals and a small amount of power<\/td>\n<\/tr>\n<tr>\n<td>0.50 mm (20 mil)<\/td>\n<td>Approximately 1.8 A<\/td>\n<td>Approximately 1.2 A<\/td>\n<td>General Power Circuit<\/td>\n<\/tr>\n<tr>\n<td>1.00 mm (40 mil)<\/td>\n<td>Approx. 3.0 A<\/td>\n<td>Approx. 2.0 A<\/td>\n<td>Main Power Supply, Motor Drive<\/td>\n<\/tr>\n<tr>\n<td>2.00 mm (80 mil)<\/td>\n<td>Approx. 5.0 A<\/td>\n<td>Approximately 3.5 A<\/td>\n<td>High-Current Busbar<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>There are three correction rules to follow when using this:<strong>The inner layer is folded to about 70 percent of its original size.<\/strong>(Poor heat dissipation),<strong>Doubling the copper thickness does not mean doubling the current-carrying capacity<\/strong>(The heat dissipation area has not increased accordingly),<strong>Short trace lengths can be slightly relaxed.<\/strong>(Heat can be conducted along the copper foil to the pad, where it is dissipated.)<\/p>\n<ul>\n<li><strong>Allow for a 20%\u201330% margin<\/strong>: Addressing copper thickness tolerances and ambient temperature;<\/li>\n<li><strong>For high-current applications, copper plating is the preferred method.<\/strong>: It saves more space than using wider lines and provides better heat dissipation;<\/li>\n<li><strong>Note the pressure drop<\/strong>: In long-distance power transmission, voltage drop may become a bottleneck sooner than current carrying capacity.<\/li>\n<\/ul>\n<ol>\n<li>List the current values for all power and ground networks;<\/li>\n<li>Select the line width according to the table above and allow for a margin;<\/li>\n<li>Verify that the voltage drop along the trace length meets the requirements.<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"800\" height=\"450\" class=\"alignnone size-large wp-image-805\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/pcb-layout-e1691117215111.webp\" alt=\"PCB Layout Services\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/pcb-layout-e1691117215111.webp 800w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/pcb-layout-e1691117215111-300x169.webp 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/06\/pcb-layout-e1691117215111-768x432.webp 768w\" sizes=\"auto, (max-width: 800px) 100vw, 800px\" \/><\/p>\n<p>For key points on copper-clad laminates, see<a href=\"\/en\/blog\/8-issues-for-pcb-copper-clad-coating\/\">8 Things to Keep in Mind When Applying Copper to a PCB<\/a>; For spacing requirements, see<a href=\"\/en\/blog\/pcb-spacing\/\">Electrical Safety Clearances<\/a>\u3002<\/p>\n<h2>Conclusion<\/h2>\n<p>The layout of connections between components on a circuit board is critical to the performance and reliability of electronic devices. Designers must carefully consider solutions for cross-talk, component placement, ground point selection, the arrangement of the common ground, and the width and length of traces to ensure circuit stability and performance.<\/p>\n<p>Whether in high-frequency or low-frequency circuits, proper PCB design is key to ensuring the proper operation of equipment. We hope the information in this article will help you better understand the key issues in PCB design.<\/p>\n<h2>Advanced: Writing Heuristics into the EDA Constraint Manager<\/h2>\n<p>The rules of thumb from the original text (keep ground points close together, widen traces for high currents, and shorten traces for high impedance) all have corresponding constraint expressions in modern EDA tools. By formalizing these rules, the tools can automatically check for compliance during the design process:<\/p>\n<ul>\n<li><strong>Network Class<\/strong>: Group power, ground, high-speed, and differential signals, and set line width and spacing rules for each group;<\/li>\n<li><strong>Length Constraints<\/strong>: Set a maximum length for high-impedance or timing-sensitive networks; the tool provides real-time prompts;<\/li>\n<li><strong>Differential Pair Constraints<\/strong>: Set the line width, spacing, and equal-length tolerance to automatically perform serpentine compensation;<\/li>\n<li><strong>Room Rules<\/strong>: Set spacing and copper layout rules in the simulation and RF areas that differ from the global settings.<\/li>\n<\/ul>\n<p>The advantage of doing this is that<strong>Inspections Shift from Manual to Automated<\/strong>. Designers don't need to remember every best practice; as long as the rules are set up correctly, DRC will continuously enforce them. At the same time, rule files can be shared within the team to ensure consistency across different projects.<\/p>\n<ol>\n<li>Classify networks by signal type;<\/li>\n<li>Set line width, spacing, and length constraints for each category;<\/li>\n<li>Set area rules for specific areas;<\/li>\n<li>After routing, run a full DRC check to confirm there are no violations.<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"768\" class=\"alignnone size-large wp-image-10381\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-electrostatic-protection-design.jpg\" alt=\"Electrostatic Protection Design for PCBs\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-electrostatic-protection-design.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-electrostatic-protection-design-300x225.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-electrostatic-protection-design-768x576.jpg 768w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<p>See the multilayer board structure<a href=\"\/en\/blog\/multilayer-circuit-board-vs-double-sided-board\/\">Characteristics of Multilayer Printed Circuit Boards and How They Differ from Double-Sided Boards<\/a>; For information on sheet materials, see<a href=\"\/en\/capabilities\/pcb-materials\/\">PCB Sheets<\/a>\u3002<\/p>\n<h2>Frequently Asked Questions<\/h2>\n<h3>1. What is a cross-circuit?<\/h3>\n<p>Cross-talk is a common issue in printed circuit board design, referring to the problem of traces from different circuits crossing each other.<\/p>\n<h3>2. What is the \u201csingle-point grounding method\u201d?<\/h3>\n<p>\u201cThe \u201dsingle-point grounding method\u201d is a circuit design principle that requires grounding points within the same circuit stage to be as close together as possible to ensure circuit stability.<\/p>\n<h3>3. Why is it important to consider the width and length of the leads?<\/h3>\n<p>The width and length of the leads affect the resistance and impedance of the circuit and must therefore be carefully considered in circuit board design.<\/p>\n<h3>4. What is the difference between vertical and horizontal PCB mounting?<\/h3>\n<p>Vertical mounting refers to the installation of components perpendicular to the circuit board, while horizontal mounting refers to the installation of components parallel to and flush against the circuit board. These two methods differ in terms of component hole spacing.<\/p>\n<h3>5. What are the principles for arranging the main ground wire?<\/h3>\n<p>The general principle for arranging ground wires is to arrange them in the order of high frequency, medium frequency, and low frequency, ensuring that they are arranged from low-voltage to high-voltage circuits to ensure circuit stability.<\/p>\n<h3>6. Why are high-impedance traces prone to picking up interference?<\/h3>\n<p>High-impedance nodes have poor driving capability, so the same coupling current will cause greater voltage disturbances at these nodes; at the same time, the parasitic capacitance between them and adjacent conductors creates a voltage divider, making it easier for interference signals to be picked up. Therefore, high-impedance traces should be kept as short as possible and routed away from interference sources; if necessary, they should be surrounded by a shielding ground plane.<\/p>\n<h3>7. How do you determine the hole spacing for vertical and horizontal installations?<\/h3>\n<p>For horizontal mounting, the hole spacing is equal to the length of the component body plus the bend radius of the leads at both ends; it is typically 2\u20134 mm longer than the body. For vertical mounting, the hole spacing is equal to the diameter or width of the component body, and the spacing between the leads after molding must also be taken into account. When designing, use the package dimensions specified in the datasheet as a reference and allow for manufacturing tolerances.<\/p>\n<h3>8. How did the \"Earth-Environment Road\" come about, and what are its hazards?<\/h3>\n<p>When there are multiple ground points in a circuit and a potential difference exists between them, a loop current is generated in the closed loop formed by the ground wires; this is known as a ground loop. It introduces interference currents into the signal loop, manifesting as low-frequency hum, measurement drift, or data errors. Single-point grounding and isolators (such as optocouplers and isolation transformers) are commonly used methods for suppressing this phenomenon.<\/p>\n<h3>9. Can vias be used to change layers for high-current traces?<\/h3>\n<p>Yes, but you\u2019ll need to connect multiple vias in parallel. The current-carrying capacity of a single via is determined by the cross-sectional area of the copper plating on the via walls; a 0.3 mm via with 25 \u03bcm of copper plating can carry approximately 1 A. When a high-current path changes layers, a row of vias should be placed, and the total cross-sectional area should be verified to ensure it meets the requirements. Also, pay attention to the specifications for via copper thickness.<\/p>\n<h3>10. What should be considered when using copper pads instead of traces?<\/h3>\n<p>Keep the following three points in mind: First, ensure that the connection between the copper plane and the traces is wide enough to avoid creating a bottleneck; second, provide sufficient ground vias in the copper plane, otherwise it may become a floating conductor; third, for current-carrying copper planes, create openings and apply solder to them\u2014this can improve current-carrying capacity and heat dissipation without increasing the copper thickness.<\/p>\n<h3>11. Why is a large-area, encircling ground required for high-frequency circuits?<\/h3>\n<p>Extensive grounding provides a low-impedance return path for high-frequency signals while also acting as a shield, confining the electric field between the signal lines and the ground plane, thereby reducing external radiation and sensitivity to external interference. This is also why the original text mentions that grounding requirements are stricter for frequency-conversion heads and frequency-modulation heads\u2014they operate at high frequencies with weak signals and are therefore most sensitive to interference.<\/p>\n<h3>12. Can single-point grounding and multi-point grounding be used together?<\/h3>\n<p>Yes, this is known as hybrid grounding. A typical approach is to use single-point grounding for the low-frequency analog section and multi-point grounding with a full ground plane for the digital and high-frequency sections, connecting the two at a single point\u2014or using ferrite beads, 0 \u03a9 resistors, or capacitors at the connection point to provide frequency-band isolation. The key is to first analyze the signal frequencies and noise characteristics of each section before deciding on the connection method.<\/p>\n<p><strong>Related Processes<\/strong>\uff1a<a href=\"\/en\/blog\/13-rules-for-layout-of-printed-circuit-board-components\/\">13 Rules for Laying Out Components on Printed Circuit Boards<\/a> \u00b7 <a href=\"\/en\/blog\/common-errors-in-printed-circuit-board-design\/\">How to Avoid Common Mistakes in Printed Circuit Board Design<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>\u7535\u8def\u677f\u662f\u7535\u5b50\u8bbe\u5907\u4e2d\u81f3\u5173\u91cd\u8981\u7684\u7ec4\u6210\u90e8\u5206\uff0c\u800c\u5176\u4e2d\u5143\u4ef6\u4e4b\u95f4\u7684\u63a5\u7ebf\u5b89\u6392\u65b9\u5f0f\u5bf9\u8bbe\u5907\u7684\u6027\u80fd\u548c\u53ef\u9760\u6027\u6709\u7740\u76f4\u63a5\u7684\u5f71\u54cd\u3002\u5728\u8fd9\u7bc7\u6587 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":8807,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"How to Route Wires Between PCB Components? Crossed Traces, Ground Points, and Trace Width Selection","description":"How should components be wired together? This section explains solutions for crossed circuits, component mounting methods, ground point selection, the arrangement of the main ground wire, and lead dimensions. 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