{"id":2659,"date":"2026-10-29T15:00:00","date_gmt":"2026-10-29T07:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2659"},"modified":"2026-10-10T00:08:24","modified_gmt":"2026-10-09T16:08:24","slug":"pcb-size-planning-control","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/pcb-size-planning-control\/","title":{"rendered":"How to Plan the Dimensions of a Multilayer PCB? Grid, Line Width, and Microvia Copper Pad Dimensions"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<p>Multilayer printed circuit boards are an indispensable component of modern electronic devices. They consist of dielectric layers and circuit traces, which are distributed both on the surface of the dielectric material and within it. When designing multilayer printed circuit boards, a series of design principles must be followed to ensure that electronic components are connected effectively and maintain high performance. This article will explore these design principles in depth.<\/p>\n<h2>Advanced: What Exactly Is \"Dimension Planning\" Planning?<\/h2>\n<p>Dimensional planning for multilayer boards involves more than just specifying a length and width; it requires determining three types of dimensions simultaneously, all of which are interdependent:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Scale Levels<\/th>\n<th>Contents<\/th>\n<th>Subject to whose authority?<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Board-level scale<\/td>\n<td>Length, Width, Panel Thickness, and Panel Joining Method<\/td>\n<td>Structural Space, Panel Utilization<\/td>\n<\/tr>\n<tr>\n<td>Line Width Scale<\/td>\n<td>Trace Width and Spacing, Copper Thickness, Impedance and Trace Width<\/td>\n<td>Current Carrying Capacity, Impedance, Etching Capability<\/td>\n<\/tr>\n<tr>\n<td>Hole and Pad Dimensions<\/td>\n<td>Hole diameter, pad diameter, solder ring width<\/td>\n<td>Drilling capacity, interlayer alignment accuracy<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<ul>\n<li><strong>The Board Determines the Cost<\/strong>: The panel thickness and number of layers directly determine the lamination process and material usage;<\/li>\n<li><strong>Line width determines density<\/strong>: The smaller the line width and spacing, the more lines can be laid out per unit area, but the higher the process requirements;<\/li>\n<li><strong>Holes and Pads Determine Yield<\/strong>: Insufficient weld ring width is the direct cause of an open circuit when the layers are misaligned, and this is the area where the most allowance should be provided.<\/li>\n<\/ul>\n<p>Of the three,<strong>The allowances for holes and pads are the most susceptible to being reduced.<\/strong>\u2014Because it does not take up visible routing space. However, in actual production, problems caused by insufficient solder rings are often more critical than those caused by insufficient trace width, and they cannot be easily remedied by redesigning the layout.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"990\" height=\"760\" class=\"alignnone size-large wp-image-7598\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/09\/new-product_multilayer-pcb.webp\" alt=\"Multilayer Printed Circuit Boards\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/09\/new-product_multilayer-pcb.webp 990w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/09\/new-product_multilayer-pcb-300x230.webp 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/09\/new-product_multilayer-pcb-768x590.webp 768w\" sizes=\"auto, (max-width: 990px) 100vw, 990px\" \/><\/p>\n<p>For information on how to determine the number of layers, see<a href=\"\/en\/blog\/how-to-determine-the-number-of-pcb-layers\/\">How to Determine the Number of PCB Layers<\/a>; For the characteristics of multilayer boards, see<a href=\"\/en\/blog\/multilayer-circuit-board-vs-double-sided-board\/\">Characteristics of Multilayer Printed Circuit Boards and How They Differ from Double-Sided Boards<\/a>\u3002<\/p>\n<h2>1. Grid<\/h2>\n<p>The grid is the foundation of multilayer PCB design. In the early days, PCB design was based on a grid with each square measuring 1\/10 inch (equivalent to 100 mils or 2.5 mm). This grid system allowed component positions to be expressed in relative coordinates. However, with the development of the electronics industry\u2014particularly the rise of surface-mount technology\u2014grid-based design has gradually lost its constraints. Modern PCB design is no longer bound by the grid; via placement is now primarily determined by electrical connectivity rather than being limited to grid positions.<\/p>\n<p>The departure from the grid principle has had an impact on electrical testing. Traditionally, the connection points on electronic components were designed based on the grid principle, allowing for electrical testing using generic fixtures. However, as the grid principle has been abandoned, testing now requires a denser arrangement of contact points. For small-volume production, flying probe testers are increasingly used, while large-volume production relies on custom fixtures for testing.<\/p>\n<h2>Advanced: Quick Reference for Converting Between mil and mm<\/h2>\n<p>The PCB industry has long used imperial units, and it is common for drawings and specifications to use both mils and millimeters interchangeably. The following are common conversion factors:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Imperial<\/th>\n<th>Metric<\/th>\n<th>Common Uses<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>1 mil<\/td>\n<td>0.0254 mm<\/td>\n<td>Basic Unit<\/td>\n<\/tr>\n<tr>\n<td>4 mil<\/td>\n<td>Approximately 0.10 mm<\/td>\n<td>Lower Limit for Standard Line Width and Spacing<\/td>\n<\/tr>\n<tr>\n<td>6 mil<\/td>\n<td>Approximately 0.15 mm<\/td>\n<td>A more relaxed, conventional design<\/td>\n<\/tr>\n<tr>\n<td>8 mil<\/td>\n<td>Approximately 0.20 mm<\/td>\n<td>Standard Lower Limit for Mechanical Drilling<\/td>\n<\/tr>\n<tr>\n<td>10 mil<\/td>\n<td>Approximately 0.25 mm<\/td>\n<td>Early Grid-Based Reference<\/td>\n<\/tr>\n<tr>\n<td>100 mil<\/td>\n<td>2.54 mm<\/td>\n<td>Traditional grid spacing<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<ul>\n<li><strong>When reviewing specifications, first confirm the units.<\/strong>: Mistaking 4 mil for 4 mm is the most common mistake made by beginners;<\/li>\n<li><strong>Align with the panel manufacturer<\/strong>: For line width and spacing restrictions, specify whether they refer to the \u201cminimum line width \/ minimum spacing\u201d or both must be met;<\/li>\n<li><strong>Calculate the impedance line width separately<\/strong>: The line width required to meet impedance specifications is often much greater than the minimum line width capability; the two are not the same thing.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-6105\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/PCB-via.jpg\" alt=\"PCB Through-Holes\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/PCB-via.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/PCB-via-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/PCB-via-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/PCB-via-768x432.jpg 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/PCB-via-400x225.jpg 400w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>For design considerations regarding conductive holes, see<a href=\"\/en\/blog\/high-speed-pcb-design-via\/\">Considerations for Via Design in High-Speed PCB Design<\/a>; For drilling quality, see<a href=\"\/en\/blog\/pcb-drilling-quality-issues\/\">Quality Issues in the PCB Drilling Process<\/a>\u3002<\/p>\n<h2>2. Line Width and Spacing<\/h2>\n<p>With the continuous advancement of electronic devices, fine-line design has become an inevitable trend in high-density printed circuit boards. However, fine-line design must take into account factors such as changes in resistance and characteristic impedance. The size of the trace spacing is determined by the insulating properties of the dielectric material; 4 mil is typically used as a target value. However, with advancing product requirements and manufacturing technologies, trace spacing can be reduced to as little as 2 mil or even smaller. As trace spacing on semiconductor packaging boards continues to shrink, maintaining sufficient insulation has become a critical challenge.<\/p>\n<h2>Advanced: How to Choose Between Through-Holes, Blind Holes, Buried Holes, and Micro-Holes<\/h2>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Type<\/th>\n<th>Processing Methods<\/th>\n<th>Typical Pore Size<\/th>\n<th>Cost<\/th>\n<th>Applicable<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Through-hole<\/td>\n<td>Mechanical Drilling<\/td>\n<td>0.2 mm or greater<\/td>\n<td>\u4f4e<\/td>\n<td>Universal Interconnect<\/td>\n<\/tr>\n<tr>\n<td>Blind hole<\/td>\n<td>Laser or Depth-Controlled Drilling<\/td>\n<td>\u00b10.1 mm<\/td>\n<td>Upper-middle<\/td>\n<td>High-Density Fan-Out<\/td>\n<\/tr>\n<tr>\n<td>Blind Hole<\/td>\n<td>Must be pressed in stages<\/td>\n<td>Same as a blind hole<\/td>\n<td>\u9ad8<\/td>\n<td>In-plane interconnects<\/td>\n<\/tr>\n<tr>\n<td>Micro-pores (stacked pores \/ staggered pores)<\/td>\n<td>Laser Drilling<\/td>\n<td>Less than 0.1 mm<\/td>\n<td>\u9ad8<\/td>\n<td>HDI Multi-Layer Interconnects<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The core logic behind the selection is<strong>Meet fan-out requirements using the least expensive holes<\/strong>. The cost of blind vias is cumulative: each additional type of via requires an extra lamination and drilling cycle, which increases both lead time and yield pressure. Therefore, the standard practice is to use through-holes first and reserve blind vias only for areas where fan-out is not possible, such as BGAs.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"840\" height=\"210\" class=\"alignnone size-large wp-image-4773\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/What_is_a_microvia_hole.png.webp\" alt=\"PCB Microvia\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/What_is_a_microvia_hole.png.webp 840w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/What_is_a_microvia_hole.png-300x75.webp 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/What_is_a_microvia_hole.png-768x192.webp 768w\" sizes=\"auto, (max-width: 840px) 100vw, 840px\" \/><\/p>\n<p>For process instructions regarding microporous materials, see<a href=\"\/en\/blog\/laser-drilling-hdi-circuit-board\/\">Applications of Laser Drilling in HDI Printed Circuit Boards<\/a>; For the multi-stage blind hole design, see<a href=\"\/en\/blog\/design-and-fabrication-of-multi-stage-blind-hole-circuit-board\/\">Design and Fabrication Methods for Multi-Stage Blind Orifice Plates<\/a>\u3002<\/p>\n<h2>3. Microhole Diameter and Copper Pad Diameter<\/h2>\n<p>The design of microvias and copper pads is also a key factor in multilayer printed circuit boards. The diameter of a copper pad is typically designed to be 2.5 to 3 times the via diameter. As circuit boards have evolved, microholes have been increasingly used for interlayer connections, particularly in high-density packaging boards. The cost of producing small-diameter microholes is relatively high; mechanical drilling typically produces holes larger than 8 mil, while smaller-diameter holes require more expensive processes and are therefore generally reserved for high-density packaging boards.<\/p>\n<h2>Advanced: How to Determine the Width of a Weld Bead<\/h2>\n<p>The annular ring is the width of the remaining copper ring between the hole wall and the outer edge of the pad after drilling. Its function is to<strong>Compensating for Interlayer Alignment Deviations<\/strong>...is the item that requires the most allowance in dimensional planning:<\/p>\n<ul>\n<li><strong>Layer bias is inevitable.<\/strong>: Both lamination and drilling have tolerances, which are particularly noticeable in multilayer boards; the more layers there are, the greater the cumulative deviation;<\/li>\n<li><strong>Insufficient weld ring can result in an open circuit or reduced reliability.<\/strong>: The contact area between the bore wall and the inner copper layer is insufficient, making it prone to fracture under thermal stress;<\/li>\n<li><strong>Default Values<\/strong>: The weld on the outer layer can be slightly smaller than that on the inner layer, since alignment is visible on the outer layer; a larger allowance should be left for the inner layer;<\/li>\n<li><strong>Holes in the disc require special treatment.<\/strong>: When the pad is a through-hole, there is no solder ring; this requires a plugging and electroplating process.<\/li>\n<\/ul>\n<p>A practical method for determining this: Compare the width of the weld ring with the sheet manufacturer\u2019s interlayer alignment tolerance,<strong>The weld ring should be significantly larger than this tolerance.<\/strong>Otherwise, you\u2019re gambling on yield. PCB manufacturers typically specify minimum solder ring requirements in their process capability tables, which can be adopted directly.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"962\" height=\"540\" class=\"alignnone size-large wp-image-7157\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-via-hole.jpg\" alt=\"VIA Vias\" \/><\/p>\n<p>For key points on the lamination process, see<a href=\"\/en\/blog\/multi-layer-circuit-board-lamination-process\/\">Lamination Process: The Heart of High-Layer-Count PCB Manufacturing<\/a>; For inner-layer pattern transfer, see<a href=\"\/en\/blog\/the-difference-between-dry-film-and-wet-film-in-pcb-inner-layer\/\">The Difference Between Dry Film and Wet Film for PCB Inner Layers<\/a>\u3002<\/p>\n<h2>4. Interlayer Structure<\/h2>\n<p>The number of layers in a multilayer printed circuit board (PCB) is primarily determined by the required wiring density. As electronic components continue to grow in complexity, the number of layers has gradually increased. The interlayer structure has become critical in the design process, particularly for high-density PCBs. Generally, power and ground planes are typically located on inner rigid layers, while signal layers are fabricated using multilayer traces to achieve the desired impedance characteristics. The thickness control and tolerance requirements for interlayer dielectric layers are also very strict, which is particularly important for products with stringent electrical performance requirements.<\/p>\n<p>When designing high-density multilayer printed circuit boards, it is essential to comprehensively consider factors such as trace density, electrical characteristics, interlayer thickness, and trace width and thickness. To minimize board bending and warping, a symmetrical lamination design is typically employed. In summary, the design of high-density printed circuit boards requires careful consideration of various factors to ensure effective connections between electronic components and high performance.<\/p>\n<p>The following are some key principles for designing multilayer printed circuit boards. By following these principles, you can ensure the design of high-performance printed circuit boards that meet the needs of the ever-evolving electronics industry.<\/p>\n<h2>Advanced: Four Trade-offs in High-Density Fiberboard<\/h2>\n<ol>\n<li><strong>Line Width and Spacing vs. Cost<\/strong>: With each process step, both price and delivery time increase significantly; we avoid shortening lead times whenever possible;<\/li>\n<li><strong>Pore Diameter vs. Thickness-to-Diameter Ratio<\/strong>: The smaller the hole diameter and the thicker the board, the more difficult the electroplating process becomes, and the higher the risk of uneven copper plating;<\/li>\n<li><strong>Number of Layers vs. Number of Pressing Cycles<\/strong>: An increase in the number of layers provides routing resources, but also introduces risks related to lamination and alignment;<\/li>\n<li><strong>Density vs. Testability<\/strong>: High density makes it difficult to include test points, so the test plan must be arranged during the design phase.<\/li>\n<\/ol>\n<p>Article 4 is often overlooked. If a high-density board lacks test points, it can only be tested using a flying probe, which is slow and has limited coverage, making it very difficult to control costs in mass production.<strong>Reserve test points for critical networks during the design phase<\/strong>...is one of the best value-for-money options in high-density design.<\/p>\n<ul>\n<li><strong>Start by designing based on standard capabilities<\/strong>: It\u2019s certainly not enough to discuss special processes yet;<\/li>\n<li><strong>Include constraints in the drawings<\/strong>: The minimum line width, hole diameter, solder ring, and impedance requirements must all be clearly specified;<\/li>\n<li><strong>Conduct a feasibility check before submitting the proposal<\/strong>: Have the panel factory check each item against the capability matrix.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"192\" height=\"155\" class=\"alignnone size-large wp-image-6508\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/Multilayer-PCBs.webp\" alt=\"Multilayer Board\" \/><\/p>\n<p>For the advantages and applications of multilayer boards, see<a href=\"\/en\/blog\/advantages-and-applications-of-multilayer-circuit-boards\/\">Advantages and Applications of Multilayer Printed Circuit Boards<\/a>; For the HDI process, see<a href=\"\/en\/blog\/hdi-manufacturing-process\/\">A Comprehensive Analysis of the HDI PCB Manufacturing Process<\/a>\u3002<\/p>\n<p><strong>Want to learn more?<\/strong><\/p>\n<h2>Frequently Asked Questions (FAQs)<\/h2>\n<ol>\n<li><strong>What is the most important factor in the design of multilayer printed circuit boards?<\/strong> One of the most important factors is the spacing and width of the traces, as well as the design of the microvias and copper pads.<\/li>\n<li><strong>What is the lattice principle?<\/strong> The grid-based method is an early approach to printed circuit board design in which the relative coordinates of component placements are based on a grid system.<\/li>\n<li><strong>Why are the connection points of electronic components no longer restricted by the grid?<\/strong> With the development of the electronics industry, particularly the rise of surface-mount technology, the connection points of electronic components are no longer limited by grid patterns but are increasingly designed with electrical conductivity as the primary goal.<\/li>\n<li><strong>Why is the design of microporous materials and copper pads important?<\/strong> The design of microvias and copper pads affects interlayer connectivity, particularly in high-density packaging boards.<\/li>\n<li><strong>What factors should be considered when designing high-density circuit boards?<\/strong> The design of high-density printed circuit boards requires consideration of factors such as trace density, electrical characteristics, interlayer thickness, and trace width and thickness to ensure effective connections between electronic components and high performance.<\/li>\n<\/ol>\n<h3>6. Do the line width and line spacing have to be the same?<\/h3>\n<p>That is not necessary. Trace width is determined by current-carrying capacity and impedance, while trace spacing is determined by insulation and manufacturing capabilities; the two can differ. A common practice is to use a wider trace width for impedance traces and design the spacing to the minimum value, in order to simultaneously meet both impedance and density requirements within a limited space.<\/p>\n<h3>7. Does the rule that the diameter of the copper pad should be 2.5 to 3 times the hole diameter still apply?<\/h3>\n<p>In high-density designs, this ratio is often reduced. The higher the magnification, the wider the solder ring and the better the reliability; however, it also occupies more space. The actual value should be determined based on the board manufacturer\u2019s interlayer alignment capability and the minimum solder ring size, rather than mechanically applying outdated empirical values.<\/p>\n<h3>8. When is it necessary to switch to laser drilling?<\/h3>\n<p>When the hole diameter is too small for a mechanical drill bit to machine the hole consistently\u2014typically 0.15 mm or smaller\u2014or when blind holes need to be drilled, laser drilling is suitable for creating very small blind holes. However, since it cannot penetrate the entire board in a single pass, through-holes still require mechanical drilling; the two methods are used in combination during the manufacturing process.<\/p>\n<h3>9. How do you determine both the panel thickness and the number of layers?<\/h3>\n<p>First, determine the number of layers based on wiring requirements; then, determine the board thickness based on structural space and impedance requirements; finally, verify that the thickness-to-diameter ratio falls within the manufacturable range. If the thickness-to-diameter ratio exceeds the limit, either the hole diameter must be increased or the board thickness reduced. These three factors must be considered together and cannot be decided independently.<\/p>\n<h3>10. Why is symmetrical pressing more important for high-density fiberboard?<\/h3>\n<p>Asymmetrical stack-ups are prone to warping during lamination and subsequent reflow due to differences in stress on either side; this effect becomes more pronounced as the number of layers increases and the board becomes thinner. Symmetrical lamination\u2014which ensures that the copper distribution and dielectric thickness are as mirror-image as possible on either side of the center plane\u2014is the most effective structural method for controlling warpage.<\/p>\n<h3>11. Should we use the limit values provided by the panel manufacturer directly for the design dimensions?<\/h3>\n<p>Not recommended. Pushing to the limit will affect both yield and lead time, and it will be more difficult to ensure consistency across different batches. Allowing for a margin of one process step results in only a limited increase in cost but significantly improves stability; this is a safer choice, especially for mass-produced products.<\/p>\n<h3>12. Can different hole sizes be used on the same board?<\/h3>\n<p>Yes, and it\u2019s quite common. The trade-off is that the drilling process requires tool changes; the greater the variety of hole types and diameters, the higher the machining time and cost. Limiting the number of hole diameter types (for example, narrowing it down to three or four) is an effective way to reduce drilling costs, and this can be achieved with a few simple constraints during the design phase.<\/p>\n<p><strong>Additional Information<\/strong>\uff1a<a href=\"\/en\/blog\/multilayer-circuit-board-vs-double-sided-board\/\">Characteristics of Multilayer Printed Circuit Boards and How They Differ from Double-Sided Boards<\/a> \u00b7 <a href=\"\/en\/blog\/advantages-and-applications-of-multilayer-circuit-boards\/\">Advantages and Applications of Multilayer Printed Circuit Boards<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>\u591a\u5c42\u7535\u8def\u677f\u662f\u73b0\u4ee3\u7535\u5b50\u8bbe\u5907\u4e2d\u4e0d\u53ef\u6216\u7f3a\u7684\u7ec4\u6210\u90e8\u5206\u3002\u5b83\u4eec\u7531\u4ecb\u7535\u5c42\u548c\u7ebf\u8def\u6784\u6210\uff0c\u7ebf\u8def\u65e2\u5206\u5e03\u5728\u4ecb\u7535\u6750\u6599\u7684\u8868\u9762\uff0c\u4e5f\u5206\u5e03\u5728\u5185\u90e8 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"How to Plan the Dimensions of a Multilayer PCB? Grid, Line Width, and Microvia Copper Pad Dimensions","description":"How should PCB dimensions be planned and controlled? This section explains how to determine design parameters such as grid spacing, trace width and spacing, microvia and copper pad diameters, and interlayer structures. It also highlights common pitfalls to help you avoid easily overlooked details."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[413,26],"tags":[],"class_list":["post-2659","post","type-post","status-publish","format-standard","hentry","category-pcb-basics","category-blog"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2659","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=2659"}],"version-history":[{"count":6,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2659\/revisions"}],"predecessor-version":[{"id":20071,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2659\/revisions\/20071"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=2659"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=2659"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=2659"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}