{"id":2634,"date":"2026-10-02T11:00:00","date_gmt":"2026-10-02T03:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2634"},"modified":"2026-10-02T19:42:53","modified_gmt":"2026-10-02T11:42:53","slug":"hdi-classification-and-tech","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/hdi-classification-and-tech\/","title":{"rendered":"What Are the Categories of High-Density Printed Circuit Boards? Through-Hole Plating and Layered Board Technology"},"content":{"rendered":"

In the manufacturing of electronic devices, multilayer printed circuit boards are a crucial component. To understand the manufacturing of multilayer printed circuit boards, through-hole plating technology is a fundamental yet critical concept. This article will provide an in-depth discussion of multilayer printed circuit boards with through-hole plating, including their concepts, applications, and manufacturing methods.
\n\"High-Density<\/p>\n

I. The Concept of Through-Hole Plating<\/h2>\n

Through-hole plating, also known as electrochemical deposition, is a process that involves depositing a layer of metal onto a circuit board to achieve electrical conductivity. Through-hole plating technology plays a crucial role in multilayer printed circuit boards, and it serves two primary functions:<\/p>\n

    \n
  1. Interlayer Conductive Paths: Multilayer printed circuit boards typically consist of multiple layers of conductive material. Through-hole plating connects these conductive layers, enabling them to carry current and signals.<\/li>\n
  2. Installing Through-Hole Components: Many electronic components, such as chips, resistors, and capacitors, need to be connected to the circuit board via through-holes. Through-hole plating provides a reliable connection for these components.<\/li>\n<\/ol>\n

    The process of through-hole plating typically involves immersing the circuit board in a solution of metal ions and then applying an electric current to cause the metal to deposit on the inner walls of the through-holes, forming a conductive layer.<\/p>\n

    II. Structure of Multilayer Printed Circuit Boards<\/h2>\n

    Multilayer printed circuit boards are typically constructed by alternately stacking multiple layers of conductive and insulating materials. The following is the basic structure of a multilayer printed circuit board:<\/p>\n

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    1. Inner Conductive Layer<\/strong>: These are the conductive layers located inside the circuit board; they are typically used to transmit signals and power. The inner conductive layers are connected via plated-through holes.<\/li>\n
    2. Insulation Layer<\/strong>: The insulating layer is located between the inner conductive layers and serves to isolate them, preventing signal interference and circuit short circuits.<\/li>\n
    3. Outer Conductive Layer<\/strong>: The outer conductive layers are located on the surface of the circuit board; they are typically used to connect electronic components to external connectors.<\/li>\n<\/ol>\n

      Through-hole plating technology plays a critical role in connecting the inner conductive layers to the outer conductive layers.<\/p>\n

      III. Metal-Core Boards vs. Rigid and Flexible Boards<\/h2>\n

      Multilayer printed circuit boards do not all have the same structure; rather, they are designed and manufactured to meet different applications and requirements. The following are two specific types of multilayer printed circuit boards:<\/p>\n

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      1. Metal-Core Board<\/strong>: Metal-core boards are designed for high-power, high-temperature equipment, such as power supplies. They feature a thick metal layer, and the metal block is typically in direct contact with components that generate a lot of heat to improve heat dissipation efficiency.<\/li>\n
      2. Flex-Rigid Boards<\/a><\/strong>: Rigid-flex boards are designed to meet requirements such as improved performance, reduced weight, and space savings. They typically consist of a combination of rigid and flexible boards, which can reduce the number of connectors required, but they have higher manufacturing costs.<\/li>\n<\/ol>\n

        IV. High-Density Multi-Layer Printed Circuit Boards<\/h2>\n

        High-density stacked printed circuit boards utilize a sequential process for building circuit layers and dielectric layers. The structure of this manufacturing method enables higher circuit density and thinner dielectric layers. High-density stacked printed circuit boards typically have the following characteristics:<\/p>\n