{"id":2626,"date":"2023-08-16T18:06:09","date_gmt":"2023-08-16T10:06:09","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2626"},"modified":"2026-10-02T19:42:52","modified_gmt":"2026-10-02T11:42:52","slug":"through-hole-cover-oil-vs-through-hole-window-opening","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/through-hole-cover-oil-vs-through-hole-window-opening\/","title":{"rendered":"The Difference Between Via Filling and Via Exposed"},"content":{"rendered":"<p>The distinction between \u201cvia window\u201d and \u201cvia cover\u201d on printed circuit boards, as well as the proper use of PAD and VIA, is indeed a source of confusion. Many customers and design engineers may encounter these terms when submitting design files but are unsure of their meanings or how to select the correct options. The following explanations and clarifications address these issues, and we hope they will help everyone better understand and handle them.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-6583\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/through-hole-cover-oil-vs-through-hole-window-opening.jpg\" alt=\"The Difference Between Via Filling and Via Exposed\" width=\"972\" height=\"548\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/through-hole-cover-oil-vs-through-hole-window-opening.jpg 972w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/through-hole-cover-oil-vs-through-hole-window-opening-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/through-hole-cover-oil-vs-through-hole-window-opening-768x433.jpg 768w\" sizes=\"auto, (max-width: 972px) 100vw, 972px\" \/><\/p>\n<h2>Conductive Holes, Key Holes, and Design Specifications<\/h2>\n<p>In printed circuit board (PCB) design, via holes and keyholes serve as pathways connecting circuits across different layers. However, due to non-standard design practices, design engineers often confuse the properties of via holes and keyholes. For example, conductive vias may sometimes be treated as keyhole vias, or keyhole vias may be configured with conductive via properties, which can lead to errors and issues during the manufacturing process.<\/p>\n<h2>The Difference Between VIA and PAD<\/h2>\n<p>VIA refers to a through-hole used to connect different layers of a printed circuit board. A PAD, on the other hand, refers to a pad used to connect the leads of electronic components. It is very important to distinguish between the two, as they serve different functions in the operation and manufacturing of printed circuit boards.<\/p>\n<h2>\u201cThe Difference Between \u201dVia Exposure\u201c and \u201dVia Cover\u201d<\/h2>\n<ul>\n<li><strong>Via Holes and Windows<\/strong>: When manufacturing printed circuit boards, it is sometimes necessary to create openings at specific locations\u2014that is, to remove the solder mask (green coating)\u2014to facilitate soldering. This is typically done for through-holes that connect different layers, such as those connecting inner-layer circuits to outer-layer circuits. Since these openings are created to facilitate soldering, the solder mask is not applied around the through-holes.<\/li>\n<li><strong>Via Filling<\/strong>: In some cases, it is desirable to apply a solder mask to a printed circuit board to protect the circuitry from environmental influences. In such cases, the solder mask is applied over the through-holes to create a \u201ccover coat\u201d effect. Through-hole cover coating is suitable for applications where soldering is not required; in these cases, the solder mask is applied over the through-holes.<\/li>\n<\/ul>\n<h2>How to Choose the Right Option<\/h2>\n<p>When submitting design files, you must select either the \u201cVia Cutout\u201d or \u201cVia Mask\u201d option based on your specific needs. If your design requires soldering, ensure that no solder mask is applied around the through-holes, and select \u201cVia Cutout.\u201d If you want to protect the circuit from external environmental factors, select \u201cVia Mask.\u201d<\/p>\n<p>In addition, be sure to use VIA and PAD correctly in accordance with design specifications and property settings. Avoid confusing through-holes with pin holes to prevent issues during production and manufacturing.<\/p>\n<p>Understanding and adhering to the correct design specifications and property settings is crucial for the manufacture of printed circuit boards. Both design engineers and film processing engineers should actively work to improve their understanding of these terms and properties to ensure the accuracy of design files and the smooth progress of the manufacturing process.<\/p>","protected":false},"excerpt":{"rendered":"<p>\u5173\u4e8e\u5370\u5237\u7ebf\u8def\u677f\u4e2d\u7684\u201c\u8fc7\u5b54\u5f00\u7a97\u201d\u548c\u201c\u8fc7\u5b54\u76d6\u6cb9\u201d\u7684\u533a\u5206\u4ee5\u53caPAD\u548cVIA\u7684\u7528\u6cd5\uff0c\u786e\u5b9e\u662f\u4e00\u4e2a\u5bb9\u6613\u5f15\u8d77\u6df7\u6dc6\u7684\u95ee\u9898\u3002\u8bb8\u591a [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":6583,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"The Difference Between Via Filling and Via Exposed","description":"What is the difference between via filling and via opening? Explain the design specifications for conductive vias and through-hole components, as well as the differences between VIAs and PADS, and describe how to select between the two via treatment methods based on specific requirements."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[26],"tags":[153,141],"class_list":["post-2626","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-153","tag-141"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2626","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=2626"}],"version-history":[{"count":1,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2626\/revisions"}],"predecessor-version":[{"id":19288,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2626\/revisions\/19288"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media\/6583"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=2626"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=2626"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=2626"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}