{"id":2587,"date":"2024-05-15T13:06:09","date_gmt":"2024-05-15T05:06:09","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2587"},"modified":"2026-10-02T17:33:52","modified_gmt":"2026-10-02T09:33:52","slug":"production-process-of-halogen-free-pcb","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/production-process-of-halogen-free-pcb\/","title":{"rendered":"Manufacturing Process for Halogen-Free PCBs"},"content":{"rendered":"

Halogen-free PCBs (Printed Circuit Boards) differ in some ways from conventional PCBs, and their manufacturing process involves multiple precision steps. Jingpeng Electronics will take an in-depth look at the key process considerations in halogen-free PCB manufacturing to ensure you understand how to produce high-quality halogen-free PCBs.<\/p>\n

\"Halogen-Free<\/p>\n

1. Printed Circuit Board Lamination<\/h2>\n

The first step in manufacturing printed circuit boards is lamination. Lamination parameters vary depending on the substrate materials used by different companies. For example, for multilayer boards made from Shengyi substrates and PP, a lower substrate heating rate (1.0\u20131.5\u00b0C\/min) and multi-stage pressure application are typically required to ensure adequate resin flow and good bond strength. During the high-temperature phase, a longer holding time is required; typically, the temperature must be maintained above 180\u00b0C for 50 minutes. This ensures that the finished board exhibits excellent adhesion between the copper foil and the substrate and does not exhibit delamination or bubbling issues after undergoing six thermal shock cycles.<\/p>\n

2. Drillability<\/h2>\n

Drilling conditions are critical to the quality of PCB hole walls. Due to the higher rigidity of halogen-free copper-clad laminates, drilling parameters must be adjusted compared to standard copper-clad laminates. For example, if a company uses Shengyi S1155\/S0455 core boards and PP to manufacture a four-layer board, the drilling parameters will need to differ slightly from standard settings. Generally, when drilling halogen-free boards, the rotational speed should be increased by approximately 5\u201310%, while the feed and retract speeds should be reduced by 10\u201315%. This results in smoother hole walls.<\/p>\n

3. Alkali Resistance<\/h2>\n

Generally speaking, halogen-free laminates have lower alkali resistance than standard FR-4, so extra caution is required during the etching process and rework after solder mask application. The immersion time in alkaline film-stripping solutions should not be too long to prevent white spots from appearing on the substrate. When reworking the solder mask on halogen-free boards, it is recommended to first produce a pilot board to determine the optimal parameters before proceeding with batch rework.<\/p>\n

4. Halogen-Free Solder Mask Production<\/h2>\n

There are currently a variety of halogen-free solder mask inks available on the market; their performance is similar to that of ordinary liquid photoresist inks, and they are applied in a similar manner.<\/p>\n

5. Summary<\/h2>\n

Due to advantages such as low water absorption and compliance with environmental requirements, demand for halogen-free PCBs continues to grow. Major substrate suppliers have also invested more funds in the research and development of halogen-free substrates and halogen-free polypropylene (PP). We can expect to see more affordable halogen-free substrates on the market in the future. Therefore, PCB manufacturers should actively adopt halogen-free substrates, develop detailed plans, and gradually expand their market share to meet the ever-growing market demand.<\/p>\n

The manufacturing process for halogen-free PCBs requires precise parameters and careful handling. By understanding and correctly applying the key process points outlined above, you can ensure the production of high-quality, high-performance halogen-free PCBs.<\/p>\n

\n

Frequently Asked Questions<\/h2>\n

1. What is the difference between halogenated and halogen-free PCBs?<\/strong><\/p>\n

Halogen-free PCBs have a lower water absorption rate and offer superior environmental performance, making them suitable for applications with stricter environmental requirements.<\/p>\n

2. Why is drillability important?<\/strong><\/p>\n

Drilling machinability affects the quality of PCB hole walls and is critical to the reliability of electrical connections.<\/p>\n

3. What are the characteristics of the alkali resistance of halogen-free PCBs?<\/strong><\/p>\n

In general, halogen-free PCBs have poor alkali resistance, so extra care must be taken during the etching and rework processes.<\/p>\n

4. Why should rework testing be conducted on halogen-free boards first?<\/strong><\/p>\n

Rework testing can help determine the optimal parameters to ensure the quality and performance of halogen-free PCBs.<\/p>\n

5. What are the future trends in the halogen-free PCB market?<\/strong><\/p>\n

As environmental standards continue to rise, demand for halogen-free PCBs will continue to grow, and the market outlook is promising.<\/p>","protected":false},"excerpt":{"rendered":"

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