{"id":2446,"date":"2026-11-12T17:00:00","date_gmt":"2026-11-12T09:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2446"},"modified":"2026-10-08T20:16:37","modified_gmt":"2026-10-08T12:16:37","slug":"pcb-structure-functions-overview","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/pcb-structure-functions-overview\/","title":{"rendered":"What components make up a PCB? The roles of pads, vias, and filled areas"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<p>As a core component of modern electronic devices, PCBs (Printed Circuit Boards) play a crucial role in the electronics industry due to the various manufacturing methods used for their different layers and structures. This article will provide a detailed overview of the components and manufacturing processes of PCBs, including single-layer, double-layer, and multilayer structures, as well as the primary functions of each layer.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1264\" height=\"711\" class=\"alignnone size-large wp-image-8475\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/smt-mounting-head.jpg\" alt=\"Components and Functions of an SMT Placement Head\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/smt-mounting-head.jpg 1264w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/smt-mounting-head-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/smt-mounting-head-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/smt-mounting-head-768x432.jpg 768w\" sizes=\"auto, (max-width: 1264px) 100vw, 1264px\" \/><\/p>\n<h2>Advanced: The Hierarchical Relationship from Raw Materials to Finished Panels<\/h2>\n<p>The original text lists the constituent elements, such as pads, vias, and traces. To understand their relationships, you can first look at the hierarchy of a PCB, from raw material to finished product:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Level<\/th>\n<th>Content<\/th>\n<th>Note<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Raw Materials<\/td>\n<td>Copper-clad laminate (base material + copper foil)<\/td>\n<td>The Basis for Determining Electrical and Thermal Performance<\/td>\n<\/tr>\n<tr>\n<td>Conductive Patterns<\/td>\n<td>Wires, Pads, Fill Areas<\/td>\n<td>Formed by etching copper foil<\/td>\n<\/tr>\n<tr>\n<td>Interconnection Structure<\/td>\n<td>Through-holes, Blind Holes, Buried Holes<\/td>\n<td>Implementing Inter-Layer Connections<\/td>\n<\/tr>\n<tr>\n<td>Protective Layer<\/td>\n<td>Solder Mask, Surface Treatment<\/td>\n<td>Solder mask, oxidation protection, and guaranteed solderability<\/td>\n<\/tr>\n<tr>\n<td>Identification Layer<\/td>\n<td>Screen-printed layer<\/td>\n<td>Component Part Numbers, Polarity, and Version Information<\/td>\n<\/tr>\n<tr>\n<td>Structural Layer<\/td>\n<td>Plate and frame, mounting holes, electrical boundaries<\/td>\n<td>Mechanical Mounting and Installation Range<\/td>\n<\/tr>\n<tr>\n<td>Finished Product<\/td>\n<td>PCBA<\/td>\n<td>Assemblies After Component Placement<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>This hierarchical relationship illustrates one thing:<strong>The \u201ccomponents\u201d listed in the original text actually belong to different levels and are formed through different manufacturing processes.<\/strong>. The conductors and pads are created through etching; vias are created through drilling and electroplating; screen printing and solder mask application are part of the back-end printing process; and mounting holes and electrical boundaries are part of the structural design. Understanding this allows designers to know at which stage each type of element should be defined.<\/p>\n<ul>\n<li><strong>Conductive Patterns and Interconnects<\/strong>: Once determined during the design phase, it is difficult to change later;<\/li>\n<li><strong>Protection and Identification Layer<\/strong>: Can be adjusted as needed before production, with minimal cost;<\/li>\n<li><strong>Structural Layer<\/strong>: Due to constraints imposed by the housing and assembly, this should be secured first.<\/li>\n<\/ul>\n<ol>\n<li>First, define the panel frame, mounting holes, and electrical boundaries;<\/li>\n<li>Stacking and interconnection schemes;<\/li>\n<li>Finally, refine the solder mask, screen printing, and process requirements.<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"180\" height=\"155\" class=\"alignnone size-large wp-image-6503\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/Double-sided-PCBs-2.webp\" alt=\"Double-sided circuit board\" \/><\/p>\n<p>For the material system, see<a href=\"\/en\/capabilities\/pcb-materials\/\">PCB Sheets<\/a>; For components, see<a href=\"\/en\/components-sourcing\/\">Component Supply<\/a>\u3002<\/p>\n<h2>I. Components of a PCB<\/h2>\n<p>A PCB is a complex assembly that includes multiple important components, each of which has its own unique function:<\/p>\n<h3>1. Pad<\/h3>\n<p>A pad is a metal hole used for soldering.<a href=\"\/en\/components-sourcing\/\">Components<\/a>the pins, ensuring they are securely connected to the circuit board.<\/p>\n<h3>2. Via<\/h3>\n<p>A via is a metal hole used to connect component leads across different layers, enabling signal transmission and electrical connections.<\/p>\n<h3>3. Mounting Holes<\/h3>\n<p>Mounting holes are used to secure the printed circuit board, ensuring it remains firmly in place within the electronic device.<\/p>\n<h3>4. Wires<\/h3>\n<p>Traces are the copper patterns on a circuit board that form the electrical network; they are used to connect the pins of components and enable signal transmission.<\/p>\n<h3>5. Connectors<\/h3>\n<p>Connectors are components used to connect circuit boards, facilitating communication between different circuit boards.<\/p>\n<h3>6. Filling<\/h3>\n<p>Filling refers to the copper plating used in ground plane networks, which helps reduce impedance and improve circuit performance.<\/p>\n<h3>7. Electrical Boundaries<\/h3>\n<p>Electrical boundaries are used to define the dimensions of a circuit board and ensure that all components are placed within the specified limits.<\/p>\n<h2>Advanced: Key Parameters for Pads and Vias<\/h2>\n<p>The original text describes both pads and vias as \u201cmetal holes,\u201d but in reality, their functions and parameter systems are completely different:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Comparison Items<\/th>\n<th>Pad<\/th>\n<th>Via<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Function<\/td>\n<td>Soldered Component Pins<\/td>\n<td>Interlayer Electrical Interconnects<\/td>\n<\/tr>\n<tr>\n<td>Is it welded?<\/td>\n<td>\u662f<\/td>\n<td>Usually not welded<\/td>\n<\/tr>\n<tr>\n<td>Key Parameters<\/td>\n<td>Pad Diameter, Hole Diameter, Solder Mask Opening<\/td>\n<td>Pore size, pad ring width, thickness-to-diameter ratio<\/td>\n<\/tr>\n<tr>\n<td>Design Basis<\/td>\n<td>Component Package Dimensions<\/td>\n<td>Current Carrying Capacity, Process Capability, Wiring Density<\/td>\n<\/tr>\n<tr>\n<td>Surface Treatment<\/td>\n<td>Must be covered<\/td>\n<td>Depends on the process (cutting windows, applying a topcoat, plugging holes)<\/td>\n<\/tr>\n<tr>\n<td>Common Defects<\/td>\n<td>Insufficient solder, cold solder joints, missing pads<\/td>\n<td>Insufficient copper in the holes; separation of the hole walls<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>In pad design,<strong>The annular ring is the parameter most likely to be overlooked.<\/strong>. This refers to the width of the copper ring extending from the hole wall to the outer edge of the pad, which determines whether the connection can be maintained in the event of drilling deviations. According to the general requirements of IPC-6012 Class 2, the minimum width of the hole ring must not be less than 0.05 mm; however, in actual production, designing to this minimum value can easily result in ring breakage or even pad detachment.<\/p>\n<ul>\n<li><strong>0.30 mm pore size<\/strong>: Recommended pad size: \u2265 0.60 mm;<\/li>\n<li><strong>0.50 mm pore size<\/strong>: Recommended pad size: \u2265 0.80 mm;<\/li>\n<li><strong>1.00 mm pore size<\/strong>: The recommended pad size is \u2265 1.40 mm.<\/li>\n<\/ul>\n<p>Regarding vias,<strong>The wall-to-diameter ratio is a hard constraint.<\/strong>: When the board thickness is divided by the hole diameter, the reliable drilling ratio for conventional mechanical drilling is approximately 8:1; when this ratio exceeds 10:1, the uniformity of the copper plating on the hole walls decreases sharply. Therefore, the hole diameter design for high-layer-count PCBs is often not determined by routing requirements, but rather derived by working backward from the board thickness.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"962\" height=\"540\" class=\"alignnone size-large wp-image-7138\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-via-hole.jpg\" alt=\"VIA Vias\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-via-hole.jpg 962w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-via-hole-300x168.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-via-hole-768x431.jpg 768w\" sizes=\"auto, (max-width: 962px) 100vw, 962px\" \/><\/p>\n<p>For a classification of vias, see<a href=\"\/en\/faq\/classification-of-circuit-board-vias\/\">What are the different types of PCB vias?<\/a>; For spacing requirements, see<a href=\"\/en\/blog\/pcb-spacing\/\">Electrical Safety Clearances<\/a>\u3002<\/p>\n<h2>Advanced: Design Constraints for Mounting Holes, Connectors, and Electrical Boundaries<\/h2>\n<p>The original text also lists these three categories as constituent components. They belong to the structural level, and their constraints stem primarily from assembly rather than electrical considerations:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Elements<\/th>\n<th>Key Constraints<\/th>\n<th>Common Values<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Mounting Holes<\/td>\n<td>Fastener Specifications, Hole Rings, and No-Place Zones<\/td>\n<td>M2.5: No routing at 3.5 mm; M3: No routing at 4 mm<\/td>\n<\/tr>\n<tr>\n<td>Connectors<\/td>\n<td>Position Determined by Structure; Space for Insertion and Removal<\/td>\n<td>Determine based on the openings in the housing and the routing of the wiring harness<\/td>\n<\/tr>\n<tr>\n<td>Electrical Boundaries<\/td>\n<td>Plate and Frame Dimensions and Wiring Scope<\/td>\n<td>The distance between the wiring and the edge of the board is typically \u2265 1 mm<\/td>\n<\/tr>\n<tr>\n<td>Process Edge<\/td>\n<td>Placement Conveyance and Gripping<\/td>\n<td>3\u20135 mm<\/td>\n<\/tr>\n<tr>\n<td>Mark Point<\/td>\n<td>Optical Positioning<\/td>\n<td>1.0\u20131.5 mm in diameter, 2\u20133<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The no-go zone around mounting holes is often underestimated. Screw heads and washers have actual outer diameters, and tightening tools require operating space; if components are placed too close together, interference will occur during assembly.<strong>Setting aside a 3.5 mm \/ 4 mm exclusion zone, as specified in the original text, is the safest approach with the lowest cost.<\/strong>; If space is limited and adjustments are needed, you should first test-fit the items to confirm they will fit.<\/p>\n<ul>\n<li><strong>Connectors should be positioned closest to the edge of the panel<\/strong>: Easy to plug in and unplug, and convenient for cable routing;<\/li>\n<li><strong>Do not run cables within the electrical boundary.<\/strong>: Traces may be cut during panel separation;<\/li>\n<li><strong>The flash is removed during the molding process.<\/strong>: When designing, make sure to provide a way to remove it.<\/li>\n<\/ul>\n<h2>II. Structure of a PCB<\/h2>\n<p>PCB boards typically come in three types: single-layer, double-layer, and multilayer. Here is a brief description of each:<\/p>\n<h3>1. Single-Layer PCB<\/h3>\n<p>A single-layer board has copper plating on only one side; the other side is not plated. Components are typically mounted on the unplated side, while the plated side is used for routing and soldering.<\/p>\n<h3>2. Double-Layer PCB<\/h3>\n<p>A double-sided PCB has copper cladding on both sides, typically referred to as the top layer and the bottom layer. Components are usually mounted on the top layer, while the bottom layer is used for soldering the components.<\/p>\n<h3>3. Multilayer Printed Circuit Board (PCB)<\/h3>\n<p>A multilayer board consists of multiple functional layers, including the top layer, the bottom layer, and several intermediate layers. The intermediate layers can serve as conductor layers, signal layers, power layers, ground layers, and so on. Each layer is electrically isolated from the others and connected via vias.<\/p>\n<h2>Advanced: A Comparison of Manufacturing Processes and Costs for Three Structures<\/h2>\n<p>The original text introduces three types of structures: single-layer, double-layer, and multi-layer. By comparing them in terms of manufacturing processes and costs, the criteria for selection become clearer:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Dimension<\/th>\n<th>Single-layer board<\/th>\n<th>Double-layer board<\/th>\n<th>Multilayer Board<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Copper-clad side<\/td>\n<td>Page 1<\/td>\n<td>2 pages<\/td>\n<td>Starting on the 4th floor<\/td>\n<\/tr>\n<tr>\n<td>Interlayer Interconnects<\/td>\n<td>\u65e0<\/td>\n<td>Through-hole<\/td>\n<td>Through-Holes + Blind\/Buried Holes<\/td>\n<\/tr>\n<tr>\n<td>Key Processes<\/td>\n<td>Circuit Lines, Etching, Solder Mask<\/td>\n<td>Add Drilling and Electrolytic Copper Plating<\/td>\n<td>Add an inner layer, laminate, and drill multiple holes<\/td>\n<\/tr>\n<tr>\n<td>Wiring Flexibility<\/td>\n<td>Low; wires must not cross<\/td>\n<td>In, can be crossed<\/td>\n<td>Tall, capable of covering an entire plane<\/td>\n<\/tr>\n<tr>\n<td>Signal Integrity<\/td>\n<td>Poor; no reference plane<\/td>\n<td>Generally<\/td>\n<td>Okay, I have the complete floor plan.<\/td>\n<\/tr>\n<tr>\n<td>Relative Cost<\/td>\n<td>Lowest<\/td>\n<td>Intermediate<\/td>\n<td>Higher, increasing with the number of layers<\/td>\n<\/tr>\n<tr>\n<td>Typical Applications<\/td>\n<td>Adapters, Remote Controls<\/td>\n<td>Home Appliance Control Boards, Industrial Control Boards<\/td>\n<td>Communications equipment, servers<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>A practical criterion:<strong>Is impedance control required?<\/strong>. If the board includes controlled networks such as USB, Ethernet, HDMI, or DDR, it is difficult to ensure impedance consistency on a double-sided board due to the lack of a complete ground plane; in such cases, a four-layer board should be used instead. This is also the root cause of many issues where \u201cthe board powers on normally on a double-sided board but becomes unstable in mass production.\u201d<\/p>\n<ul>\n<li><strong>Functional Prototype<\/strong>: Double-layer boards are usually sufficient and offer the best balance of cost and lead time;<\/li>\n<li><strong>Small-batch production<\/strong>: A four-layer board is a safe starting point;<\/li>\n<li><strong>High-speed or high-density<\/strong>: Six or more stories, or <a href=\"\/en\/hdi-pcb\/\">HDI<\/a> Plan.<\/li>\n<\/ul>\n<ol>\n<li>Count the number of networks and BGA pitch to estimate the minimum number of trace layers;<\/li>\n<li>Determine whether there is a need for impedance control;<\/li>\n<li>Review the number of layers based on the cost target; if further reduction isn't possible, consider using HDI.<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"192\" height=\"155\" class=\"alignnone size-large wp-image-6508\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/Multilayer-PCBs.webp\" alt=\"Multilayer Board\" \/><\/p>\n<p>For details on the multi-layer structure, see<a href=\"\/en\/blog\/multilayer-circuit-board-vs-double-sided-board\/\">Characteristics of Multilayer Printed Circuit Boards and How They Differ from Double-Sided Boards<\/a>; For layout rules, see<a href=\"\/en\/blog\/13-rules-for-layout-of-printed-circuit-board-components\/\">13 Rules for Laying Out Components on Printed Circuit Boards<\/a>\u3002<\/p>\n<h2>III. Operational Aspects of PCBs<\/h2>\n<p>PCB boards consist of various types of functional layers, each of which serves a specific purpose:<\/p>\n<h3>1. Signal Layer<\/h3>\n<p>Signal layers are primarily used for placing components or routing signals. Typically, the top and bottom layers are used for placing components or applying copper, while the intermediate layers are used for routing signals.<\/p>\n<h3>2. Protective Layer<\/h3>\n<p>Protective layers are used to ensure that areas of the circuit board that do not require tin plating are not accidentally plated, thereby maintaining the board's reliability. These include the solder mask layers on the top and bottom layers, as well as the solder paste protective layer.<\/p>\n<h3>3. \u4e1d\u5370\u5c42<\/h3>\n<p>\u4e1d\u5370\u5c42\u4e3b\u8981\u7528\u4e8e\u5728\u5370\u5237\u7535\u8def\u677f\u4e0a\u6807\u8bb0\u5143\u5668\u4ef6\u7684\u6d41\u6c34\u53f7\u3001\u751f\u4ea7\u7f16\u53f7\u3001\u516c\u53f8\u540d\u79f0\u7b49\u91cd\u8981\u4fe1\u606f\u3002<\/p>\n<h3>4. \u5185\u90e8\u5c42<\/h3>\n<p>\u5185\u90e8\u5c42\u4e3b\u8981\u7528\u4f5c\u4fe1\u53f7\u5e03\u7ebf\u5c42\uff0c\u901a\u5e38\u5b58\u5728\u591a\u4e2a\u5185\u90e8\u5c42\uff0c\u5177\u4f53\u6570\u91cf\u53d6\u51b3\u4e8e\u8bbe\u8ba1\u9700\u6c42\u3002<\/p>\n<h3>5. \u5176\u4ed6\u5c42<\/h3>\n<p>\u5176\u4ed6\u5c42\u5305\u62ec\u94bb\u5b54\u65b9\u4f4d\u5c42\uff0c\u7528\u4e8e\u786e\u5b9a\u5370\u5236\u7535\u8def\u677f\u4e0a\u94bb\u5b54\u7684\u4f4d\u7f6e\u3002<\/p>\n<p>\u4ee5\u4e0a\u662fPCB\u7ebf\u8def\u677f\u7684\u57fa\u672c\u7ec4\u6210\u3001\u7ed3\u6784\u548c\u5de5\u4f5c\u5c42\u9762\u7684\u8be6\u7ec6\u4ecb\u7ecd\u3002\u8fd9\u4e9b\u4fe1\u606f\u6709\u52a9\u4e8e\u60a8\u66f4\u597d\u5730\u7406\u89e3PCB\u7ebf\u8def\u677f\u7684\u5de5\u4f5c\u539f\u7406\u548c\u5236\u4f5c\u8fc7\u7a0b\u3002<\/p>\n<h2>\u8fdb\u9636\uff1aEDA \u8f6f\u4ef6\u91cc\u7684\u5c42\u4e0e\u5b9e\u7269\u5c42\u7684\u5bf9\u5e94<\/h2>\n<p>\u539f\u6587\u6309\u529f\u80fd\u4ecb\u7ecd\u4e86\u4fe1\u53f7\u5c42\u3001\u9632\u62a4\u5c42\u3001\u4e1d\u5370\u5c42\u3001\u5185\u90e8\u5c42\u7b49\u3002\u5728 EDA \u8f6f\u4ef6\u4e2d\uff0c\u8fd9\u4e9b\u300c\u5c42\u300d\u6709\u66f4\u7ec6\u5206\u7684\u7c7b\u578b\uff0c\u4e0e\u5b9e\u7269\u4e00\u4e00\u5bf9\u5e94\uff1a<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>EDA \u5c42\u7c7b\u578b<\/th>\n<th>\u5bf9\u5e94\u5b9e\u7269<\/th>\n<th>\u8f93\u51fa\u6587\u4ef6<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Top \/ Bottom Layer<\/td>\n<td>\u9876\u5e95\u5c42\u94dc\u7b94<\/td>\n<td>\u7ebf\u8def Gerber<\/td>\n<\/tr>\n<tr>\n<td>Mid Layer<\/td>\n<td>\u5185\u5c42\u94dc\u7b94<\/td>\n<td>\u5185\u5c42 Gerber<\/td>\n<\/tr>\n<tr>\n<td>Top\/Bottom Solder<\/td>\n<td>Solder Mask Cutouts<\/td>\n<td>\u963b\u710a Gerber<\/td>\n<\/tr>\n<tr>\n<td>Top \/ Bottom Paste<\/td>\n<td>Steel Mesh Perforations<\/td>\n<td>Steel Mesh Documents<\/td>\n<\/tr>\n<tr>\n<td>Top \/ Bottom Overlay<\/td>\n<td>Screen-printed layer<\/td>\n<td>\u4e1d\u5370 Gerber<\/td>\n<\/tr>\n<tr>\n<td>Drill Drawing \/ NC Drill<\/td>\n<td>\u94bb\u5b54\u4f4d\u7f6e\u4e0e\u5c3a\u5bf8<\/td>\n<td>Drilling Documentation<\/td>\n<\/tr>\n<tr>\n<td>Mechanical \/ Keep-Out<\/td>\n<td>\u677f\u6846\u4e0e\u7981\u5e03\u533a<\/td>\n<td>\u5916\u5f62 Gerber<\/td>\n<\/tr>\n<tr>\n<td>Multi-Layer<\/td>\n<td>\u8d2f\u7a7f\u5404\u5c42\u7684\u710a\u76d8<\/td>\n<td>\u4f53\u73b0\u5728\u5404\u5c42<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>\u8f93\u51fa Gerber \u65f6\u6700\u5e38\u89c1\u7684\u9519\u8bef\u662f<strong>\u6f0f\u5c42\u6216\u5c42\u7c7b\u578b\u9009\u9519<\/strong>\uff0c\u5c24\u5176\u662f\u963b\u710a\u5c42\u4e0e\u94a2\u7f51\u5c42\u5bb9\u6613\u6df7\u6dc6\uff1a\u963b\u710a\u5c42\u51b3\u5b9a\u54ea\u91cc\u4e0d\u76d6\u6cb9\uff0c\u94a2\u7f51\u5c42\u51b3\u5b9a\u54ea\u91cc\u4e0a\u9521\u818f\uff0c\u4e24\u8005\u7528\u9014\u5b8c\u5168\u4e0d\u540c\uff0c\u5f04\u53cd\u4f1a\u76f4\u63a5\u5bfc\u81f4\u710a\u63a5\u95ee\u9898\u3002<\/p>\n<ul>\n<li><strong>\u8f93\u51fa\u540e\u8981\u7528 Gerber \u67e5\u770b\u5668\u9010\u5c42\u6838\u5bf9<\/strong>\uff1a\u786e\u8ba4\u5c42\u6570\u3001\u6781\u6027\u4e0e\u5b54\u5f84\u8868\u5b8c\u6574\uff1b<\/li>\n<li><strong>\u94bb\u5b54\u6587\u4ef6\u8981\u5355\u72ec\u786e\u8ba4<\/strong>\uff1a\u533a\u5206\u9540\u901a\u5b54\u4e0e\u975e\u9540\u901a\u5b54\uff1b<\/li>\n<li><strong>\u7279\u6b8a\u8981\u6c42\u8981\u5199\u5728\u5de5\u827a\u8bf4\u660e\u91cc<\/strong>\uff1a\u5982\u963b\u6297\u3001\u585e\u5b54\u3001\u91d1\u624b\u6307\u659c\u8fb9\u3002<\/li>\n<\/ul>\n<ol>\n<li>\u6309\u4e0a\u8868\u9010\u5c42\u5bfc\u51fa\u5e76\u68c0\u67e5\uff1b<\/li>\n<li>\u7528\u67e5\u770b\u5668\u6a21\u62df\u53e0\u5c42\uff0c\u786e\u8ba4\u5bf9\u4f4d\u4e00\u81f4\uff1b<\/li>\n<li>\u9644\u4e0a\u5de5\u827a\u8981\u6c42\u6587\u6863\u4e00\u8d77\u63d0\u4ea4\u3002<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"350\" class=\"alignnone size-large wp-image-9520\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/specification-and-requirements-for-screen-printing-layer-of-pcb-board.jpg\" alt=\"Specifications and Requirements for the Screen-Printed Layer of PCBs\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/specification-and-requirements-for-screen-printing-layer-of-pcb-board.jpg 600w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/specification-and-requirements-for-screen-printing-layer-of-pcb-board-300x175.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/p>\n<p>See Halogen-Free Process<a href=\"\/en\/blog\/production-process-of-halogen-free-pcb\/\">Manufacturing Process for Halogen-Free PCBs<\/a>\uff1b\u8d34\u88c5\u5934\u89c1<a href=\"\/en\/blog\/smt-mounting-head\/\">Components and Functions of an SMT Placement Head<\/a>\u3002<\/p>\n<h2>\u72ec\u5bb6FAQ<\/h2>\n<h3>\u4ec0\u4e48\u662fPCB\u7ebf\u8def\u677f\uff1f<\/h3>\n<p>PCB\u7ebf\u8def\u677f\u662f\u5370\u5236\u7535\u8def\u677f\u7684\u7b80\u79f0\uff0c\u7528\u4e8e\u8fde\u63a5\u548c\u652f\u6301\u7535\u5b50\u5143\u4ef6\uff0c\u5b9e\u73b0\u7535\u5b50\u8bbe\u5907\u7684\u529f\u80fd\u3002<\/p>\n<h3>PCB\u7ebf\u8def\u677f\u7684\u4e3b\u8981\u7ec4\u6210\u90e8\u5206\u662f\u4ec0\u4e48\uff1f<\/h3>\n<p>PCB\u7ebf\u8def\u677f\u5305\u62ec\u710a\u76d8\u3001\u8fc7\u5b54\u3001\u5b89\u88c5\u5b54\u3001\u5bfc\u7ebf\u3001\u5143\u5668\u4ef6\u3001\u63a5\u63d2\u4ef6\u3001\u586b\u5145\u3001\u7535\u6c14\u8fb9\u754c\u7b49\u591a\u4e2a\u7ec4\u6210\u90e8\u5206\u3002<\/p>\n<h3>PCB\u7ebf\u8def\u677f\u6709\u54ea\u4e9b\u4e0d\u540c\u7684\u7ed3\u6784\uff1f<\/h3>\n<p>PCB\u7ebf\u8def\u677f\u7684\u7ed3\u6784\u6709\u5355\u5c42\u677f\u3001\u53cc\u5c42\u677f\u548c\u591a\u5c42\u677f\u4e09\u79cd\u3002<\/p>\n<h3>\u591a\u5c42\u677f\u4e2d\u7684\u5de5\u4f5c\u5c42\u9762\u6709\u4ec0\u4e48\u4f5c\u7528\uff1f<\/h3>\n<p>\u591a\u5c42\u677f\u4e2d\u7684\u5de5\u4f5c\u5c42\u9762\u5305\u62ec\u4fe1\u53f7\u5c42\u3001\u9632\u62a4\u5c42\u3001\u4e1d\u5370\u5c42\u3001\u5185\u90e8\u5c42\u7b49\uff0c\u5404\u81ea\u5177\u6709\u4e0d\u540c\u7684\u529f\u80fd\uff0c\u7528\u4e8e\u652f\u6301\u7535\u8def\u677f\u7684\u6b63\u5e38\u8fd0\u884c\u3002<\/p>\n<h3>\u4ec0\u4e48\u662f\u586b\u5145\u533a\uff08\u6577\u94dc\uff09\uff1f\u5b83\u6709\u4ec0\u4e48\u4f5c\u7528\uff1f<\/h3>\n<p>\u586b\u5145\u533a\u662f\u5728\u677f\u9762\u7a7a\u767d\u533a\u57df\u94fa\u6ee1\u94dc\u7b94\u7684\u533a\u57df\uff0c\u901a\u5e38\u8fde\u63a5\u5230\u5730\u7f51\u7edc\u3002\u5b83\u7684\u4f5c\u7528\u6709\u4e09\u4e2a\uff1a\u4e3a\u4fe1\u53f7\u63d0\u4f9b\u4f4e\u963b\u6297\u56de\u6d41\u8def\u5f84\u3001\u964d\u4f4e\u5730\u963b\u6297\u5e76\u6539\u5584\u5c4f\u853d\u6548\u679c\u3001\u4ee5\u53ca\u5747\u8861\u5404\u5c42\u7684\u94dc\u5206\u5e03\u4ee5\u907f\u514d\u8680\u523b\u4e0d\u5747\u4e0e\u677f\u9762\u76b1\u6298\u3002\u94fa\u94dc\u540e\u9700\u8981\u6253\u8db3\u591f\u7684\u5730\u8fc7\u5b54\uff0c\u5426\u5219\u53ef\u80fd\u53d8\u6210\u6d6e\u52a8\u5bfc\u4f53\u53cd\u800c\u6210\u4e3a\u5e72\u6270\u6e90\u3002<\/p>\n<h3>\u710a\u76d8\u548c\u8fc7\u5b54\u53ef\u4ee5\u5408\u7528\u5417\uff1f<\/h3>\n<p>\u53ef\u4ee5\uff0c\u4f46\u8981\u770b\u60c5\u51b5\u3002\u5728\u5bc6\u5ea6\u6781\u9ad8\u7684\u8bbe\u8ba1\u4e2d\uff0c\u6709\u65f6\u4f1a\u628a\u8fc7\u5b54\u76f4\u63a5\u505a\u5728\u710a\u76d8\u4e0a\uff08Via-in-Pad\uff09\uff0c\u524d\u63d0\u662f\u5fc5\u987b\u505a\u6811\u8102\u585e\u5b54\u52a0\u7535\u9540\u76d6\u5e3d\uff0c\u5426\u5219\u56de\u6d41\u65f6\u9521\u818f\u4f1a\u88ab\u5438\u5165\u5b54\u5185\u9020\u6210\u5c11\u9521\u3002\u8fd9\u79cd\u505a\u6cd5\u6210\u672c\u8f83\u9ad8\uff0c\u4e00\u822c\u53ea\u5728 BGA \u95f4\u8ddd\u6781\u5c0f\u65f6\u624d\u91c7\u7528\u3002<\/p>\n<h3>\u7535\u6c14\u8fb9\u754c\u548c\u677f\u6846\u6709\u4ec0\u4e48\u533a\u522b\uff1f<\/h3>\n<p>\u7535\u6c14\u8fb9\u754c\uff08Keep-Out\uff09\u5b9a\u4e49\u7684\u662f\u5141\u8bb8\u5e03\u7ebf\u4e0e\u653e\u7f6e\u5143\u4ef6\u7684\u8303\u56f4\uff0c\u677f\u6846\uff08Board Outline\uff09\u5b9a\u4e49\u7684\u662f\u677f\u5b50\u7684\u5b9e\u9645\u5916\u5f62\u3002\u4e24\u8005\u901a\u5e38\u76f8\u8fd1\u4f46\u4e0d\u91cd\u5408\uff1a\u5e03\u7ebf\u9700\u8981\u8ddd\u677f\u8fb9\u7559\u51fa\u4e00\u5b9a\u4f59\u91cf\uff0c\u56e0\u6b64\u7535\u6c14\u8fb9\u754c\u4e00\u822c\u6bd4\u677f\u6846\u5185\u7f29 1 mm \u5de6\u53f3\uff0c\u4ee5\u907f\u514d\u5206\u677f\u65f6\u5207\u5230\u8d70\u7ebf\u3002<\/p>\n<h3>\u4e1d\u5370\u5c42\u4f1a\u5f71\u54cd\u7535\u6c14\u6027\u80fd\u5417\uff1f<\/h3>\n<p>\u6b63\u5e38\u60c5\u51b5\u4e0b\u4e0d\u4f1a\uff0c\u4e1d\u5370\u662f\u975e\u5bfc\u7535\u7684\u6cb9\u58a8\u5c42\u3002\u4f46\u82e5\u4e1d\u5370\u8986\u76d6\u5230\u710a\u76d8\u4e0a\uff0c\u4f1a\u963b\u788d\u710a\u63a5\u5bfc\u81f4\u4e0a\u9521\u4e0d\u826f\uff1b\u82e5\u4e1d\u5370\u538b\u5728\u8fc7\u5b54\u4e0a\uff0c\u4e5f\u53ef\u80fd\u5f71\u54cd\u6d4b\u8bd5\u70b9\u7684\u63a5\u89e6\u3002\u56e0\u6b64\u8bbe\u8ba1\u89c4\u8303\u8981\u6c42\u4e1d\u5370\u907f\u5f00\u710a\u76d8\u4e0e\u6d4b\u8bd5\u70b9\uff0c\u8fd9\u4e5f\u662f\u5de5\u5382\u5728\u6295\u677f\u524d\u4f1a\u68c0\u67e5\u7684\u9879\u76ee\u4e4b\u4e00\u3002<\/p>\n<h3>\u963b\u710a\u5c42\u548c\u94a2\u7f51\u5c42\u4e3a\u4ec0\u4e48\u4f1a\u5f04\u6df7\uff1f<\/h3>\n<p>\u56e0\u4e3a\u4e24\u8005\u5728 EDA \u91cc\u90fd\u8868\u73b0\u4e3a\u300c\u5f00\u53e3\u300d\u56fe\u5f62\uff0c\u89c6\u89c9\u4e0a\u76f8\u4f3c\u3002\u533a\u522b\u5728\u4e8e\u963b\u710a\u5c42\uff08Solder Mask\uff09\u7684\u5f00\u53e3\u8868\u793a\u6b64\u5904\u4e0d\u76d6\u963b\u710a\u6cb9\u58a8\u3001\u9732\u51fa\u94dc\uff1b\u94a2\u7f51\u5c42\uff08Paste Mask\uff09\u7684\u5f00\u53e3\u8868\u793a\u6b64\u5904\u8981\u5370\u5237\u9521\u818f\u3002\u963b\u710a\u5c42\u7528\u4e8e\u7535\u8def\u677f\u5236\u9020\uff0c\u94a2\u7f51\u5c42\u7528\u4e8e\u5236\u4f5c SMT \u94a2\u7f51\uff0c\u7528\u9014\u5b8c\u5168\u4e0d\u540c\u3002<\/p>\n<h3>\u591a\u5c42\u677f\u7684\u4e2d\u95f4\u5c42\u4e00\u5b9a\u662f\u5e03\u7ebf\u5c42\u5417\uff1f<\/h3>\n<p>\u4e0d\u4e00\u5b9a\u3002\u4e2d\u95f4\u5c42\u53ef\u4ee5\u7528\u4f5c\u4fe1\u53f7\u5e03\u7ebf\u5c42\uff0c\u4e5f\u53ef\u4ee5\u4f5c\u4e3a\u7535\u6e90\u5c42\u6216\u5730\u5c42\uff08\u901a\u5e38\u4e3a\u5927\u9762\u79ef\u94dc\u7b94\uff09\u3002\u5728\u9ad8\u901f\u8bbe\u8ba1\u4e2d\uff0c\u901a\u5e38\u4f18\u5148\u628a\u4e2d\u95f4\u5c42\u5b89\u6392\u4e3a\u5e73\u9762\u5c42\uff0c\u4e3a\u76f8\u90bb\u7684\u4fe1\u53f7\u5c42\u63d0\u4f9b\u53c2\u8003\u5e73\u9762\u4e0e\u56de\u6d41\u8def\u5f84\uff0c\u8fd9\u5bf9\u4fe1\u53f7\u5b8c\u6574\u6027\u7684\u5e2e\u52a9\u8fdc\u5927\u4e8e\u591a\u4e00\u4e2a\u5e03\u7ebf\u5c42\u3002<\/p>\n<h3>\u4e3a\u4ec0\u4e48\u5b89\u88c5\u5b54\u5468\u56f4\u8981\u8bbe\u7981\u5e03\u533a\uff1f<\/h3>\n<p>\u56e0\u4e3a\u7d27\u56fa\u4ef6\u6709\u5b9e\u9645\u5916\u5f84\uff0c\u57ab\u5708\u4e0e\u62e7\u7d27\u5de5\u5177\u4e5f\u9700\u8981\u64cd\u4f5c\u7a7a\u95f4\u3002\u82e5\u5143\u4ef6\u6216\u8d70\u7ebf\u79bb\u5b54\u592a\u8fd1\uff0c\u88c5\u914d\u65f6\u4f1a\u53d1\u751f\u5e72\u6d89\uff0c\u87ba\u9489\u5934\u90e8\u8fd8\u53ef\u80fd\u538b\u5230\u5143\u4ef6\u9020\u6210\u635f\u574f\u3002\u539f\u6587\u4e4b\u5916\u8865\u5145\u4e00\u70b9\uff1a\u91d1\u5c5e\u87ba\u9489\u4e0e\u8d70\u7ebf\u4e4b\u95f4\u8fd8\u9700\u8003\u8651\u7535\u6c14\u95f4\u9699\uff0c\u9ad8\u538b\u4ea7\u54c1\u8981\u6309\u8010\u538b\u8981\u6c42\u5355\u72ec\u6838\u7b97\u3002<\/p>\n<h3>\u4e00\u5757\u677f\u4e0a\u53ef\u4ee5\u540c\u65f6\u6709\u5355\u9762\u548c\u53cc\u9762\u8d34\u88c5\u5417\uff1f<\/h3>\n<p>\u53ef\u4ee5\uff0c\u8fd9\u5c31\u662f\u53cc\u9762\u8d34\u88c5\u3002\u9700\u8981\u6ce8\u610f\u7b2c\u4e8c\u6b21\u56de\u6d41\u65f6\u7b2c\u4e00\u6b21\u710a\u597d\u7684\u5143\u4ef6\u4f1a\u518d\u6b21\u7ecf\u5386\u9ad8\u6e29\uff0c\u91cd\u5143\u4ef6\u53ef\u80fd\u6389\u843d\uff0c\u56e0\u6b64\u901a\u5e38\u628a\u91cd\u5143\u4ef6\u5b89\u6392\u5728\u540e\u710a\u63a5\u7684\u4e00\u9762\u3002\u53cc\u9762\u8d34\u88c5\u80fd\u663e\u8457\u63d0\u9ad8\u5bc6\u5ea6\uff0c\u4ee3\u4ef7\u662f\u5de5\u5e8f\u589e\u52a0\u3001\u6210\u672c\u4e0a\u5347\uff0c\u4e14\u5e95\u9762\u5143\u4ef6\u9700\u907f\u5f00\u6ce2\u5cf0\u710a\u63a5\u89e6\u533a\u3002<\/p>\n<p><strong>Further Reading<\/strong>\uff1a<a href=\"\/en\/blog\/smt-mounting-head\/\">Components and Functions of an SMT Placement Head<\/a> \u00b7 <a href=\"\/en\/blog\/production-process-of-halogen-free-pcb\/\">Manufacturing Process for Halogen-Free PCBs<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>PCB\uff08Printed Circuit Board\uff0c\u5370\u5236\u7535\u8def\u677f\uff09\u4f5c\u4e3a\u73b0\u4ee3\u7535\u5b50\u8bbe\u5907\u4e2d\u7684\u6838\u5fc3\u7ec4\u4ef6\uff0c\u5176\u4e0d\u540c\u5c42\u6b21\u548c\u7ed3\u6784 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":8475,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"What components make up a PCB? The roles of pads, vias, and filled areas","description":"What are the components of a printed circuit board? Explain the primary functions of pads, vias, mounting holes, traces, and connectors. 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