{"id":2406,"date":"2026-11-03T09:00:00","date_gmt":"2026-11-03T01:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2406"},"modified":"2026-10-08T20:16:01","modified_gmt":"2026-10-08T12:16:01","slug":"what-is-dot-void","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/what-is-dot-void\/","title":{"rendered":"What Is Spotty Hole Breakage? Causes and Prevention Methods for Inadequate Resin Slag Removal"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<p>In the PCB manufacturing process, a \"hole break\" is a phenomenon characterized by a localized break rather than a complete circuit break around the entire hole; it is sometimes referred to as a \"wedge-shaped hole break.\" This issue typically stems from improper handling during the resin removal process. This article will explore in depth the causes of hole breaks and how to prevent them to ensure PCB quality.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"700\" height=\"500\" class=\"alignnone size-large wp-image-5806\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive.webp\" alt=\"Automotive Electronics PCBs\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive.webp 700w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-300x214.webp 300w\" sizes=\"auto, (max-width: 700px) 100vw, 700px\" \/><\/p>\n<h2>Advanced: The Complete Process of Via Metallization and Via Break Locations<\/h2>\n<p>To understand hole breakdown, we must first understand the process of through-hole metallization. After drilling, the hole walls consist of insulating resin and glass fiber, which must undergo a series of treatments to become conductive:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Process Steps<\/th>\n<th>Function<\/th>\n<th>Behavior When Problems Arise<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Drilling<\/td>\n<td>Pore Formation<\/td>\n<td>Rough bore walls, resin smear, nail head<\/td>\n<\/tr>\n<tr>\n<td>Desmear<\/td>\n<td>Removes drilling debris and creates a microscopically rough surface<\/td>\n<td>Holes, Poor Bond Strength<\/td>\n<\/tr>\n<tr>\n<td>Activation (Palladium Colloid)<\/td>\n<td>Catalytic core adsorbed on the pore wall<\/td>\n<td>No copper precipitation in this area<\/td>\n<\/tr>\n<tr>\n<td>Chemical Copper<\/td>\n<td>Deposition of a Conductive Thin Layer<\/td>\n<td>Incomplete coverage, holes or tears<\/td>\n<\/tr>\n<tr>\n<td>Electroplated Copper<\/td>\n<td>Thicken to the required thickness<\/td>\n<td>Uneven thickness, dog-bone-shaped distribution<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>Based on their morphology, pore breaks can be classified into several categories, each with different causes:<\/p>\n<ul>\n<li><strong>Punctate Perforation<\/strong>: The absence of copper in localized areas, appearing as scattered spots, is typically caused by residual oxidizing agents remaining after the removal of the gel residue, which disrupts localized activation;<\/li>\n<li><strong>Wedge-shaped Hole Break<\/strong>: This phenomenon occurs most often in the middle of the pores and is related to poor exchange with the solution and the trapping of air bubbles;<\/li>\n<li><strong>A complete circuit break<\/strong>: This is often related to incomplete removal of drilling contaminants or failed activation, and constitutes a more serious systemic defect.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"962\" height=\"540\" class=\"alignnone size-large wp-image-7138\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-via-hole.jpg\" alt=\"VIA Vias\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-via-hole.jpg 962w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-via-hole-300x168.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-via-hole-768x431.jpg 768w\" sizes=\"auto, (max-width: 962px) 100vw, 962px\" \/><\/p>\n<p>For basic information on conductive holes, see<a href=\"\/en\/blog\/pcb-drilling-quality-issues\/\">Quality Issues in the PCB Drilling Process<\/a>; For the copper plating process, see<a href=\"\/en\/blog\/pcb-copper-plating-process\/\">Common Issues and Solutions in the Copper Plating Process<\/a>\u3002<\/p>\n<h2>Common Causes of Pore Breakage<\/h2>\n<p>Holes in components typically occur during the manufacturing process of automotive circuit boards and other products, and one of the common causes is an issue with the adhesive residue removal process. This process typically includes the following steps:<\/p>\n<ol>\n<li><strong>Leavening Agent Treatment:<\/strong> The circuit boards are first treated with a leavening agent to prepare them for subsequent processes.<\/li>\n<li><strong>Permanganate Erosion:<\/strong> Next, the circuit board undergoes etching with a strong oxidizing agent\u2014potassium permanganate\u2014to remove the resin residue and create a microporous structure. This process typically removes the resin residue and forms tiny pores on the walls of the holes.<\/li>\n<\/ol>\n<p>However, the problem is that after the cleaning process, residual oxidizing agents may remain on the borehole walls. These residual oxidizing agents must be removed using a reducing agent. However, operators sometimes neglect to monitor the reducing acid solution, which can result in oxidizing agents remaining on the borehole walls.<\/p>\n<ol start=\"3\">\n<li><strong><a href=\"\/en\/pcb-factory\/\">Chemical Copper<\/a>Process:<\/strong> The circuit board then enters the chemical copper plating process. Under the action of the hole-cleaning agent, the circuit board undergoes micro-etching. At this point, the oxidizing agent remaining on the hole walls is once again exposed to the acid bath, causing the resin in the areas where the oxidizing agent remains to peel off. At the same time, the hole-cleaning agent is also broken down.<\/li>\n<\/ol>\n<p>As a result, the damaged pore walls will not react during subsequent treatment with colloidal palladium and chemical copper. These areas will show no copper precipitation, ultimately leading to pore failure.<\/p>\n<h2>Advanced: Key Control Points for the Three-Step Resin Slag Removal Process<\/h2>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Steps<\/th>\n<th>Medications<\/th>\n<th>Control Parameters<\/th>\n<th>Consequences of Losing Control<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Sweller<\/td>\n<td>Organic Solvent-Based Leavening Agents<\/td>\n<td>Temperature, Concentration, Time<\/td>\n<td>If the foaming is insufficient, the resin cannot penetrate the slag; if it is excessive, the resin structure becomes too porous.<\/td>\n<\/tr>\n<tr>\n<td>Etching<\/td>\n<td>Permanganate<\/td>\n<td>Concentration, Temperature, Time, Byproducts<\/td>\n<td>Residual oxidizing agents are the direct cause of pinholes.<\/td>\n<\/tr>\n<tr>\n<td>Reduction (Neutralizer)<\/td>\n<td>Reducing Acid Solution<\/td>\n<td>Concentration, Temperature, Freshness<\/td>\n<td>If reduction is incomplete, residual oxidizing agents will carry over into subsequent processes.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>Of the three steps,<strong>The reduction process is the one most often overlooked<\/strong>. The effects of leavening and oxidation can be directly observed by inspecting the material against the light, whereas there is no visual indicator to determine whether the reduction process is complete; it can only be managed based on the concentration of the chemical solution and the replacement cycle. This is precisely why pore-breakage issues often occur in batches and are difficult to pinpoint immediately.<\/p>\n<ul>\n<li><strong>The permanganate bath solution must be analyzed regularly.<\/strong>: The accumulation of byproducts can reduce oxidation efficiency and increase the risk of residues;<\/li>\n<li><strong>The reducing solution should be replaced based on production volume rather than on a calendar schedule.<\/strong>: Setting the replacement cycle based on processing area or the number of plates provides greater accuracy;<\/li>\n<li><strong>Be sure to rinse thoroughly.<\/strong>: Insufficient rinsing between process steps can cause chemicals to carry over into the next tank.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"962\" height=\"540\" class=\"alignnone size-large wp-image-7157\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/09\/pcb-via-hole.jpg\" alt=\"VIA Vias\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/09\/pcb-via-hole.jpg 962w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/09\/pcb-via-hole-300x168.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/09\/pcb-via-hole-768x431.jpg 768w\" sizes=\"auto, (max-width: 962px) 100vw, 962px\" \/><\/p>\n<p>For the micro-section examination method, see<a href=\"\/en\/blog\/19-pcb-reliability-and-microsection-points\/\">Key Points on the Reliability of 19 Printed Circuit Boards and Microsectioning Techniques<\/a>; For reliability design, see<a href=\"\/en\/blog\/design-for-reliability\/\">PCB Reliability Design: DfR Principles and Applications<\/a>\u3002<\/p>\n<h2>How to Avoid a Hole-Break Condition<\/h2>\n<p>The key to preventing hole breakage lies in meticulous process management and monitoring. Here are some recommendations:<\/p>\n<ol>\n<li><strong>Monitoring the Acid Solution:<\/strong> Operators should regularly monitor the concentration and effectiveness of the reducing acid solution to ensure that any residual oxidizing agents are thoroughly removed.<\/li>\n<li><strong>Meticulous process control:<\/strong> Every step in the process must be carefully controlled to ensure that each part is carried out correctly.<\/li>\n<li><strong>Regular Equipment Maintenance:<\/strong> Conduct regular inspections and maintenance of the equipment used in the manufacturing process to ensure it operates properly.<\/li>\n<li><strong>Training Operators:<\/strong> Train operators so they understand the importance of each step in the process and how to perform them correctly.<\/li>\n<\/ol>\n<h2>Advanced: How Was Kong Po Caught?<\/h2>\n<ol>\n<li><strong>Backlight Inspection<\/strong>: After sectioning, the coverage of the chemical copper layer is examined under a transmission microscope and graded; this is the most common method for detecting pores;<\/li>\n<li><strong>Microsection<\/strong>: Direct observation of the continuity and thickness of the copper layer on the hole wall can determine the exact location of the hole break;<\/li>\n<li><strong>Electrical Testing<\/strong>: A complete break in the circuit can be detected by electrical testing, but small, localized breaks often still allow current to flow; therefore, electrical testing cannot replace cross-sectional analysis;<\/li>\n<li><strong>Thermal Stress Testing<\/strong>: After tin plating, when the sample is cut into slices, the areas where the holes have broken are often where cracks first appear;<\/li>\n<li><strong>High-Magnification Visual Inspection<\/strong>: In some cases of severe hole breakage, abnormalities are visible at the hole opening.<\/li>\n<\/ol>\n<p>Here\u2019s a key point to keep in mind:<strong>Punctate holes are likely to pass the factory electrical testing.<\/strong>. This is because the lack of copper is limited to a localized area on the wall of the hole, and the electrical connection through the entire hole remains intact. The real danger is that such defects will gradually propagate under subsequent thermal cycling and electrical stress, ultimately manifesting as intermittent failures during operation\u2014which is why industries such as automotive electronics place such a high priority on hole fractures.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"840\" height=\"210\" class=\"alignnone size-large wp-image-4773\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/What_is_a_microvia_hole.png.webp\" alt=\"PCB Microvia\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/What_is_a_microvia_hole.png.webp 840w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/What_is_a_microvia_hole.png-300x75.webp 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/What_is_a_microvia_hole.png-768x192.webp 768w\" sizes=\"auto, (max-width: 840px) 100vw, 840px\" \/><\/p>\n<p>See the requirements for automotive circuit boards<a href=\"\/en\/blog\/automotive-circuit-board-vs-conventional-circuit-board\/\">Automotive Circuit Boards vs. Conventional Circuit Boards<\/a>; For printed circuit board standards, see<a href=\"\/en\/blog\/34-commonly-used-ipc-standards-for-printed-circuit-boards\/\">34 Common IPC Standards for Printed Circuit Boards<\/a>\u3002<\/p>\n<h2>Conclusion<\/h2>\n<p>Holes in the circuit board may lead to quality issues; therefore, special attention should be paid to the adhesive residue removal process during manufacturing. Through careful management, monitoring, and training, such problems can be prevented, ensuring the production of high-quality circuit boards.<\/p>\n<hr \/>\n<h2>Advanced: Six Management Strategies to Keep Leaks Under Control<\/h2>\n<ul>\n<li><strong>Create a Record of Solution Analysis<\/strong>: Record the concentration and temperature of the solution in each tank for each shift; make adjustments immediately if any abnormalities are detected, rather than recording them retroactively;<\/li>\n<li><strong>Set the replacement interval based on production volume<\/strong>: Based on the area processed or the number of panels, rather than by day;<\/li>\n<li><strong>Perform backlight inspections on each batch<\/strong>: Make backlight level a mandatory criterion for process release;<\/li>\n<li><strong>Conduct periodic random sampling<\/strong>: It's not just about the thickness of the copper plating on the holes; you also need to check the continuity of the plating;<\/li>\n<li><strong>Equipment Maintenance Must Be Thorough<\/strong>: The status of the heating, circulation, filtration, and shaking systems directly affects the uniformity of the process;<\/li>\n<li><strong>Explain the Principles Clearly During Staff Training<\/strong>: Only by letting operators know \u201cwhy\u201d can they proactively correct deviations when they occur.<\/li>\n<\/ul>\n<p>The sixth point is often dismissed as mere formalism, but it is actually crucial. Anomalies in wet processes\u2014such as those involving rubber residue\u2014are often gradual,<strong>Only those who understand the principles can detect the problem as soon as the parameters begin to drift.<\/strong>...rather than waiting until defects start appearing in droves before taking corrective action.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-6105\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/PCB-via.jpg\" alt=\"PCB Through-Holes\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/PCB-via.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/PCB-via-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/PCB-via-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/PCB-via-768x432.jpg 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/PCB-via-400x225.jpg 400w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<h2>Advanced: Several Types of Defects That Are Easily Confused with Pores and Cracks<\/h2>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Defects<\/th>\n<th>Performance<\/th>\n<th>Differences from Kong Po<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Pore-Wall Separation<\/td>\n<td>The copper layer has detached from the hole wall<\/td>\n<td>The copper layer is continuous but has delaminated; this is often related to thermal stress.<\/td>\n<\/tr>\n<tr>\n<td>Holes in the Bore<\/td>\n<td>There are voids inside the coating<\/td>\n<td>A copper layer is present but is not dense; this is often related to electroplating parameters.<\/td>\n<\/tr>\n<tr>\n<td>Nodular and Rough<\/td>\n<td>The copper surface of the bore wall is uneven<\/td>\n<td>It's a problem with the quality of the coating, not a missing section of coverage.<\/td>\n<\/tr>\n<tr>\n<td>Hole Break<\/td>\n<td>No copper precipitation in this area<\/td>\n<td>There is absolutely no copper layer; the root cause lies in the activation and removal of resin residue.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>It is important to distinguish between these types of defects because the approaches to improvement are entirely different: for pore wall separation, the focus should be on adhesion strength and thermal stress; for voids, the plating parameters need to be adjusted; and for pore rupture, the process must be revisited at the stages of sludge removal and surface activation.<strong>When evaluating cross-sections, first identify the type of defect, then discuss corrective actions.<\/strong>, otherwise you're likely to keep making adjustments in the wrong direction.<\/p>\n<p>For information on copper-plated holes and copper-plated parts, see<a href=\"\/en\/blog\/5g-pcb-copper-plating-process-problems-solutions\/\">Common Issues and Solutions for the 5G PCB Copper Plating Process<\/a>; For via plating, see<a href=\"\/en\/blog\/what-is-through-hole-cover-oil\/\">What Is Via Filling?<\/a>\u3002<\/p>\n<h2>Frequently Asked Questions<\/h2>\n<h3>1. How does a hole break affect a circuit board?<\/h3>\n<p>Pores may prevent certain areas of the circuit board from conducting electricity properly, thereby affecting the board's performance and reliability.<\/p>\n<h3>2. Why is the slag removal process so important?<\/h3>\n<p>The adhesive residue removal process removes adhesive residue from circuit boards, creating favorable conditions for subsequent processes; therefore, the quality of this process is critical.<\/p>\n<h3>3. What is the repair method for a punctured tire?<\/h3>\n<p>Repairing a hole-break condition typically requires replacing the affected section of the circuit board or performing a localized repair, depending on the extent of the damage.<\/p>\n<h3>4. How can we ensure the stability of the chemical process?<\/h3>\n<p>To ensure the stability of chemical processes, it is necessary to perform regular inspections and maintenance of equipment, monitor the concentration of chemicals, and train operators to carry out process steps correctly.<\/p>\n<h3>5. Can a hole-rupture condition be prevented?<\/h3>\n<p>Yes, through careful process management and monitoring, it is possible to prevent the occurrence of hole breakage, thereby improving the quality of the circuit board.<\/p>\n<h3>6. Is a hole only a concern on car panels?<\/h3>\n<p>No, it\u2019s just that sectors requiring long service life and high reliability\u2014such as the automotive industry\u2014have a lower tolerance for this issue. Any product designed for long-term, stable operation should pay close attention to pore rupture, as it falls under the category of hidden defects that \u201ccannot be detected during factory testing but will deteriorate during use.\u201d For consumer products with a short expected lifespan and a mild operating environment, the risk is relatively manageable.<\/p>\n<h3>7. What problems can arise from excessive removal of slag?<\/h3>\n<p>Over-processing can cause excessive etching of the resin on the hole walls, causing the glass fibers to protrude, which results in rough hole walls and reduced bond strength, and may also lead to the formation of voids during subsequent electroplating. The goal of deburring is to remove drilling debris and create an appropriate level of micro-roughness\u2014not to go as deep as possible\u2014so the extent of processing must be determined based on the material.<\/p>\n<h3>8. Are the parameters for removing adhesive residue the same for different substrates?<\/h3>\n<p>They are different\u2014the differences are significant. FR-4 differs from resin systems such as high-Tg materials, halogen-free materials, and PTFE materials in terms of chemical resistance, so the processing parameters must be set individually. When introducing new materials, it is standard practice to conduct resin residue removal rate tests to determine the parameter window; simply carrying over old parameters is a common mistake.<\/p>\n<h3>9. How should the backlight inspection grades be interpreted?<\/h3>\n<p>Backlight inspection evaluates the integrity of the chemical copper layer by shining light through the back of the section and observing the light transmission; the results are typically classified into several grades. A higher grade indicates more complete coverage. When interpreting the results, pay attention to the sampling location\u2014problems are more likely to occur in the middle of a via than at its opening, so the section should be cut to the center of the via.<\/p>\n<h3>10. Can a hole be repaired?<\/h3>\n<p>Generally, no. Localized copper deficiencies on the inner surface of the holes cannot be repaired through external replating, and the reliability of such repairs is difficult to verify. Therefore, the only effective response to hole defects is prevention: upon discovering batch-wide hole defects, one should trace back the chemical solution records and equipment status and conduct a risk assessment on products from the same batch, rather than repairing each board individually.<\/p>\n<h3>11. Does the quality of the drilling affect the removal of resin residue?<\/h3>\n<p>Yes, and it\u2019s a fundamental factor. The resin smear produced during drilling and the roughness of the borehole walls determine how difficult it is to remove resin residue: the heavier the drilling residue, the more aggressive the treatment required, and the risks of residue buildup and over-treatment increase accordingly. Therefore, controlling drilling parameters and replacing drill bits promptly are the first line of defense in reducing the risk of borehole failure.<\/p>\n<p><strong>Further Reading<\/strong>\uff1a<a href=\"\/en\/blog\/automotive-circuit-board-vs-conventional-circuit-board\/\">Automotive Circuit Boards vs. Conventional Circuit Boards<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>\u5728\u7535\u8def\u677f\u5236\u9020\u8fc7\u7a0b\u4e2d\uff0c\u5b54\u7834\u72b6\u6001\u662f\u4e00\u79cd\u70b9\u72b6\u5206\u5e03\u800c\u975e\u6574\u5708\u65ad\u8def\u7684\u73b0\u8c61\uff0c\u6709\u65f6\u4e5f\u79f0\u4e3a\u6954\u578b\u5b54\u7834\u3002\u8fd9\u79cd\u95ee\u9898\u901a\u5e38\u6e90\u81ea\u9664\u80f6\u6e23\u5236\u7a0b\u7684 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":5806,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"What Is Spotty Hole Breakage? Causes and Prevention Methods for Inadequate Resin Slag Removal","description":"What Is Pinhole Failure? This article explains the common causes of pinhole failure and how to prevent it, as well as the importance of the resin residue removal process for reliability. It serves as a useful reference for hardware engineers and procurement professionals during the product selection phase."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[26,411],"tags":[],"class_list":["post-2406","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-industry-applications"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2406","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=2406"}],"version-history":[{"count":5,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2406\/revisions"}],"predecessor-version":[{"id":19979,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2406\/revisions\/19979"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media\/5806"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=2406"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=2406"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=2406"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}