{"id":2388,"date":"2026-10-26T09:00:00","date_gmt":"2026-10-26T01:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2388"},"modified":"2026-10-08T20:15:34","modified_gmt":"2026-10-08T12:15:34","slug":"copper-pour-advantages-disadvantages","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/copper-pour-advantages-disadvantages\/","title":{"rendered":"An Overview of the Pros and Cons of Copper Cladding in PCB Manufacturing"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<p>In PCB (Printed Circuit Board) design, copper plating technology plays a crucial role. Whether using the domestically developed Qingyuefeng PCB design software or well-known international software such as Protel and PowerPCB, all of them offer powerful copper plating capabilities. This article will provide a detailed introduction to copper plating technology and explain how to apply it correctly to improve circuit design.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1110\" height=\"624\" class=\"alignnone size-large wp-image-9350\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/01\/8-issues-for-pcb-copper-clad-coating.jpg\" alt=\"8 Things to Keep in Mind When Applying Copper to a PCB\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/01\/8-issues-for-pcb-copper-clad-coating.jpg 1110w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/01\/8-issues-for-pcb-copper-clad-coating-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/01\/8-issues-for-pcb-copper-clad-coating-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/01\/8-issues-for-pcb-copper-clad-coating-768x432.jpg 768w\" sizes=\"auto, (max-width: 1110px) 100vw, 1110px\" \/><\/p>\n<h2>1. What is copper-clad laminate?<\/h2>\n<p>Copper fill, as the name suggests, involves filling unused space on a PCB with copper to create a reference plane. These copper areas are also referred to as copper fills. The primary purposes of copper fill are multifaceted and include reducing ground impedance, improving immunity to interference, minimizing voltage drops, enhancing power supply efficiency, and connecting to the ground plane to reduce loop area.<\/p>\n<p>In addition, copper cladding helps reduce board warpage during the PCB soldering process. Therefore, most PCB manufacturers typically require PCB designers to fill unused areas with solid copper or a copper mesh ground plane.<\/p>\n<h2>Advanced: How to Choose Among the Four Types of Copper-Clad Laminates<\/h2>\n<p>Copper plating isn\u2019t limited to just \u201cfull coverage\u201d; it can be divided into four categories based on its form, and the applications for each vary greatly:<\/p>\n<ul>\n<li><strong>Solid Copper-Clad (Solid)<\/strong>: Solid-fill provides the lowest impedance and best shielding. However, large areas of copper are prone to bubbling and warping during wave soldering, and they can also cause components\u2019 pads to lose heat too quickly;<\/li>\n<li><strong>Copper-Clad Grid (Hatched)<\/strong>: Filled with grid lines, it is lightweight, has low thermal stress, and performs better in wave soldering. The trade-off is reduced shielding effectiveness at high frequencies, and improper grid dimensions may also result in resonant structures;<\/li>\n<li><strong>Polygon Pour<\/strong>: Automatic routing and filling based on predefined rules is the mainstream approach in modern EDA; connection types to the network can be configured;<\/li>\n<li><strong>Dynamic Copper-Clad Laminate<\/strong>: It automatically recalculates as the wiring changes, making it highly efficient; however, remember to reapply the material after each change to avoid leaving behind any old copper foil.<\/li>\n<\/ul>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Morphology<\/th>\n<th>Shielding Effect<\/th>\n<th>Thermal Stress<\/th>\n<th>Suitable for high-frequency applications<\/th>\n<th>Typical Applications<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Solid<\/td>\n<td>Best<\/td>\n<td>\u5927<\/td>\n<td>Suitable for use as a reference plane<\/td>\n<td>Power Supply \/ Ground Plane, Low-Frequency Board<\/td>\n<\/tr>\n<tr>\n<td>Grid<\/td>\n<td>Generally<\/td>\n<td>\u5c0f<\/td>\n<td>Proceed with caution<\/td>\n<td>Wave Soldering Boards, Low-Frequency Shielding<\/td>\n<\/tr>\n<tr>\n<td>Automatic Polygon Avoidance<\/td>\n<td>\u597d<\/td>\n<td>\u4e2d<\/td>\n<td>\u597d<\/td>\n<td>General-Purpose Digital Circuits<\/td>\n<\/tr>\n<tr>\n<td>Dynamic Copper-Clad Laminate<\/td>\n<td>Same as solid<\/td>\n<td>\u4e2d<\/td>\n<td>\u597d<\/td>\n<td>Design Iteration Phase<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>A practical tip:<strong>When carrying solder flux or serving as a reference plane, solid structures are preferred; when simply filling gaps and the component will undergo wave soldering, consider using a mesh or slotted design.<\/strong>\u3002<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-8635\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/copper-foil-pcb.jpg\" alt=\"Copper Foil: The Lifeline of PCBs\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/copper-foil-pcb.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/copper-foil-pcb-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/copper-foil-pcb-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/copper-foil-pcb-768x432.jpg 768w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>The thickness and type of the copper foil itself also affect current-carrying capacity and etching precision; for related trade-offs, see<a href=\"\/en\/capabilities\/pcb-materials\/\">PCB Materials<\/a>Section 1.<\/p>\n<h2>2. Advantages and Disadvantages of Copper-Clad Laminates<\/h2>\n<p>The use of copper-clad technology offers many advantages, but it also requires careful handling to avoid potential problems. The following are the advantages and disadvantages of copper-clad technology:<\/p>\n<h3>Advantages:<\/h3>\n<h4>a. Immunity to interference<\/h4>\n<p>Copper cladding can effectively reduce the likelihood of external noise interfering with the circuit. Because the copper-clad areas are closely connected, external noise is coupled to both sides of the copper cladding almost simultaneously. Since the receiving end is only concerned with the difference between the two signals, external common-mode noise can be canceled out.<\/p>\n<h4>b. Electromagnetic Interference Suppression<\/h4>\n<p>Due to the presence of the copper-clad area, the electromagnetic fields radiated by the circuit board are significantly reduced. This helps suppress electromagnetic interference (EMI) and improves circuit performance.<\/p>\n<h4>c. Timing Performance<\/h4>\n<p>Copper-clad layers help reduce timing errors and are particularly suitable for circuits with low-amplitude signals. They reduce the return path area of signal lines and improve timing performance.<\/p>\n<h3>Disadvantages:<\/h3>\n<h4>a. Wave Soldering Issues<\/h4>\n<p>Large areas of copper-clad laminate in<a href=\"\/en\/pcba-capabilities\/\">Wave Soldering<\/a>This process may cause the PCB to warp or develop bubbles. To mitigate this issue, it is usually necessary to cut several grooves in the copper-clad areas to reduce bubbling of the copper foil.<\/p>\n<h4>b. Limitations on Copper-Clad Lattice<\/h4>\n<p>Copper-clad mesh is primarily used for electromagnetic shielding, but its effectiveness may not be evident in high-frequency circuits. Furthermore, when the electrical length of the mesh lines matches the operating frequency, it may cause circuit malfunctions.<\/p>\n<h2>Advanced: The Real Reason Behind Copper-Clad Interference Suppression<\/h2>\n<p>The reason copper-clad laminates are resistant to interference does not lie primarily in the fact that they have \u201can extra layer of copper,\u201d but rather in<strong>Provides an adjacent return path for the signal<\/strong>\uff1a<\/p>\n<ul>\n<li><strong>Return current always follows the path of least impedance.<\/strong>: At high frequencies, it flows close to the reference plane directly below the signal line; the smaller the return area, the smaller the loop inductance;<\/li>\n<li><strong>Common-mode noise is canceled out<\/strong>: External noise is coupled to both sides of the copper-clad layer almost simultaneously, but since the receiving end is interested in the difference between the two signals, the common-mode component is thus canceled out;<\/li>\n<li><strong>Clocks and high-speed signals benefit the most<\/strong>: If the return path is discontinuous (across a split or a slot), the consequences are worse than having no copper plating, resulting in severe radiation and crosstalk.<\/li>\n<\/ul>\n<p>So there\u2019s a rule that\u2019s even more important than \u201cwhether or not to use copper-clad laminate\u201d:<strong>Do not block the return flow path<\/strong>. If the copper-clad area is grooved or divided, the signal lines that once crossed it will instead become sources of radiation. This is why, in high-speed design, ensuring a \u201ccomplete reference plane\u201d is generally a higher priority than simply \u201cadding more copper.\u201d<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"800\" height=\"450\" class=\"alignnone size-large wp-image-6548\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/anti-interference-measures-for-flexible-circuit-boards.jpg\" alt=\"Measures to Prevent Interference in Flexible Printed Circuits\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/anti-interference-measures-for-flexible-circuit-boards.jpg 800w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/anti-interference-measures-for-flexible-circuit-boards-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/anti-interference-measures-for-flexible-circuit-boards-768x432.jpg 768w\" sizes=\"auto, (max-width: 800px) 100vw, 800px\" \/><\/p>\n<p>For additional measures to prevent interference, please refer to<a href=\"\/en\/blog\/anti-interference-measures-for-flexible-circuit-boards\/\">Measures to Prevent Interference in Flexible Printed Circuits<\/a>, The principle is the same as that of a rigid plate.<\/p>\n<h2>3. How should copper-clad technology be properly applied?<\/h2>\n<p>To ensure that the copper-clad technology delivers the expected results, here are the key considerations for PCB design:<\/p>\n<ol>\n<li><strong>Connections to Multiple Locations<\/strong>: Depending on their location on the PCB, separate copper-clad areas\u2014such as SGND, AGND, and GND\u2014are defined. Before applying the copper cladding, thicken the corresponding power lines (such as 5.0V and 3.3V) to form multiple irregularly shaped structures.<\/li>\n<li><strong>Single-Point Connection<\/strong>: For connections between different grounds, you can use a 0-ohm resistor, a ferrite bead, or an inductor.<\/li>\n<li><strong>Copper cladding near the crystal oscillator<\/strong>: Cover the crystal oscillator with copper to reduce electromagnetic interference.<\/li>\n<li><strong>Handling Isolated Islands (Dead Zones)<\/strong>: If the isolated island poses a significant problem, you can add vias in appropriate locations.<\/li>\n<li><strong>Proper Wiring<\/strong>: When routing traces, treat ground lines equally; do not rely on adding vias over copper-clad areas to resolve connection issues.<\/li>\n<li><strong>Avoid Sharp Corners<\/strong>: Avoid designing sharp corners on PCBs, as they can become sources of electromagnetic radiation.<\/li>\n<li><strong>Open Areas on Multilayer Boards<\/strong>: Avoid applying copper to empty areas in the routing of the intermediate layers of multilayer boards, as it is difficult to achieve effective grounding.<\/li>\n<li><strong>Grounding of Metal Parts<\/strong>: Metal components inside the equipment, such as heat sinks and metal reinforcement strips, must be properly grounded.<\/li>\n<li><strong>Grounding Near the Three-Terminal Voltage Regulator and Crystal Oscillator<\/strong>: These areas require special attention to ensure proper grounding.<\/li>\n<\/ol>\n<h2>Advanced: Four Types of Risks Associated with Copper Cladding and How to Avoid Them<\/h2>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Risks<\/th>\n<th>Causes<\/th>\n<th>Ways to Avoid It<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Bubbles and Warping in Wave Soldering<\/td>\n<td>Large areas of copper expand when heated<\/td>\n<td>Slotted venting, switching to a mesh, and controlling the copper thickness<\/td>\n<\/tr>\n<tr>\n<td>Thermal imbalance causes cold solder joints<\/td>\n<td>Heat dissipates too quickly from the copper surface of the solder pads<\/td>\n<td>Connection Using Heat Pads (Patterned Pads)<\/td>\n<\/tr>\n<tr>\n<td>Island (Dead Zone)<\/td>\n<td>Tongpi has no internet connection<\/td>\n<td>Remove isolated segments, or connect them to the network via ground vias<\/td>\n<\/tr>\n<tr>\n<td>High-Frequency Resonance<\/td>\n<td>Matching the Grating Size to the Operating Wavelength<\/td>\n<td>Switch to solid, or adjust the grid size<\/td>\n<\/tr>\n<tr>\n<td>Uneven Etching<\/td>\n<td>Excessive Variation in Copper Distribution<\/td>\n<td>Add balanced copper and ensure even pattern distribution<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>There are three techniques you must master:<\/p>\n<ul>\n<li><strong>Thermal Relief<\/strong>: Only a few thin connections are left between the pads and the large copper area, which does not significantly affect electrical conductivity and prevents heat from being rapidly dissipated by the copper surface during soldering;<\/li>\n<li><strong>Isolated islands must be addressed<\/strong>: Isolated copper foil without an electrical connection is not only useless, but may also act as an antenna and introduce interference;<\/li>\n<li><strong>Crystal Oscillators and Sensitive Components<\/strong>: A copper-clad layer beneath it that is properly grounded can provide shielding, but you should avoid routing high-speed signal lines beneath the same area.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-6068\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thick-copper-board-pcb.jpg\" alt=\"Thick Copper Board\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thick-copper-board-pcb.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thick-copper-board-pcb-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thick-copper-board-pcb-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thick-copper-board-pcb-768x432.jpg 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thick-copper-board-pcb-400x225.jpg 400w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>For an approach to troubleshooting welding defects, see<a href=\"\/en\/blog\/pcb-soldering-defects-analysis-solutions\/\">Analysis of Causes and Solutions for PCB Soldering Defects<\/a>; For spacing rules, see<a href=\"\/en\/blog\/pcb-spacing\/\">Electrical Safety Clearances<\/a>\u3002<\/p>\n<p>In summary, when applied appropriately, copper cladding on PCBs offers far more benefits than drawbacks. It reduces the loop area of signal lines and improves the circuit\u2019s immunity to interference, making it a crucial component of modern circuit design. Proper application of copper cladding will help enhance product performance and stability.<\/p>\n<h2>Advanced: Copper Cladding Strategies for Different Scenarios<\/h2>\n<ol>\n<li><strong>Low-Frequency Analog Circuits<\/strong>: Use single-point grounding as the primary method; the primary purpose of copper cladding is for shielding and reducing ground impedance; be sure to distinguish between analog ground and digital ground;<\/li>\n<li><strong>Digital and High-Speed Circuits<\/strong>: Prioritize ensuring a complete ground plane; the copper overlay should serve as a return path, not be used to fill in gaps;<\/li>\n<li><strong>RF and Microwave Circuits<\/strong>: Create a reference plane according to the requirements for micro-strips or striplines; the copper-clad area must be continuous, and a large number of ground vias must be provided;<\/li>\n<li><strong>Power Supply and Power Board<\/strong>: Use a large copper-clad area for current-carrying and heat dissipation, while calculating the copper thickness and temperature rise;<\/li>\n<li><strong>PCBs to be processed through the wave soldering line<\/strong>: Consider using copper-clad mesh or slotted designs to reduce the risk of bubbling.<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"545\" height=\"307\" class=\"alignnone size-large wp-image-8462\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-copper-strip-detachment.jpg\" alt=\"Three Causes of Copper Strip Delamination on PCBs\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-copper-strip-detachment.jpg 545w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-copper-strip-detachment-300x169.jpg 300w\" sizes=\"auto, (max-width: 545px) 100vw, 545px\" \/><\/p>\n<p>For information on the relationship between impedance and loss, see<a href=\"\/en\/blog\/impedance-and-loss-of-pcb\/\">PCB Impedance and Loss<\/a>; For key points on high-frequency wiring, see<a href=\"\/en\/blog\/12-high-frequency-pcb-design-tips\/\">12 Key Tips for High-Frequency PCB Design and Routing<\/a>\u3002<\/p>\n<h2>Conclusion<\/h2>\n<p>Copper cladding technology serves as a powerful shield in PCB design, offering multiple advantages such as noise immunity, electromagnetic interference (EMI) suppression, and timing performance. However, when applying this technology, it is important to be aware of its drawbacks, such as issues with wave soldering and the limitations of grid copper cladding. When applied correctly, copper cladding technology will help you optimize your circuit design and improve product quality and performance.<\/p>\n<h2>Advanced: Six Checks to Perform After Copper Cladding Is Complete<\/h2>\n<ol>\n<li><strong>Check for Isolated Areas<\/strong>: Remove isolated copper traces that are not connected to the network;<\/li>\n<li><strong>Check the connection<\/strong>: Verify that the ground copper layer has sufficient vias connecting to the main ground;<\/li>\n<li><strong>Inspect the hot pads<\/strong>: Verify that the pads to be soldered are not directly surrounded by a large area of copper;<\/li>\n<li><strong>Inspect the Grooves<\/strong>: Verify that no high-speed signals cross any unnecessary slots or partitions;<\/li>\n<li><strong>Inspection Interval<\/strong>: Maintain sufficient spacing between the copper cladding and the signal lines and pads to avoid affecting the impedance;<\/li>\n<li><strong>Reinfusion<\/strong>: After each panel replacement, the board must be re-poured and inspected.<\/li>\n<\/ol>\n<p>The placement of test points is also related to the copper cladding; please refer to<a href=\"\/en\/blog\/why-do-pcbs-need-test-points\/\">Why Do PCBs Need Test Points?<\/a>\u3002<\/p>\n<h2>Frequently Asked Questions<\/h2>\n<h3>1. What is copper-clad technology?<\/h3>\n<p>Copper plating is a technique that fills unused space on a PCB with copper to improve the ground\u2019s immunity to interference, reduce voltage drops, increase power supply efficiency, and minimize electromagnetic interference.<\/p>\n<h3>2. Why does copper cladding suppress electromagnetic interference?<\/h3>\n<p>Copper-clad areas can reduce the electromagnetic fields radiated by the circuit board, thereby suppressing electromagnetic interference.<\/p>\n<h3>3. What are wave soldering issues?<\/h3>\n<p>Extensive copper plating may cause PCBs to warp or bubble during the wave soldering process and requires appropriate handling.<\/p>\n<h3>4. What is copper-clad mesh?<\/h3>\n<p>Copper-clad mesh is a copper-cladding technique used for electromagnetic shielding, but its effectiveness may be limited in high-frequency circuits.<\/p>\n<h3>5. How should copper-clad technology be properly applied?<\/h3>\n<p>To properly apply copper-clad technology, it is important to pay attention to key issues such as multi-point connections, single-point connections, copper cladding near crystal oscillators, and the handling of isolated islands. When selecting a copper-clad method, decisions should be made based on circuit requirements.<\/p>\n<h3>6. Is more copper plating always better?<\/h3>\n<p>No. The purpose of copper plating is to provide a low-impedance return path and shielding, not to fill in empty spaces. Blindly filling the board can lead to problems such as bubbling during wave soldering, thermal imbalance, and uneven etching, and can sometimes actually reduce yield.<\/p>\n<h3>7. How do you select the dimensions for copper-clad mesh?<\/h3>\n<p>Avoid resonance points related to the operating frequency. The basic principle is to ensure that the grid spacing is much smaller than one-quarter of the wavelength corresponding to the highest frequency of concern; when in doubt, it is safer to use solid copper-clad laminate.<\/p>\n<h3>8. If the ground plane is split, can it still be plated with copper?<\/h3>\n<p>Yes, but you need to be especially careful with signal lines that span partition lines. The key rule is<strong>Do not allow high-speed signals to cross the median strip.<\/strong>; If crossing is unavoidable, place a coupling capacitor near the crossing point or adjust the routing path.<\/p>\n<h3>9. Are \"copper cladding\" and \"copper plating\" the same thing?<\/h3>\n<p>In engineering, these terms generally refer to the same process: filling a blank area with copper foil. The subtle difference lies in the terminology: \u201ccopper plating\u201d emphasizes \u201ccovering,\u201d while \u201ccopper laying\u201d emphasizes \u201cspreading out to fill\u201d; the actual process is the same.<\/p>\n<h3>10. Does copper cladding affect impedance?<\/h3>\n<p>Yes. The distance between the copper pour and the signal lines, as well as whether the copper pour is continuous, both affect the equivalent impedance of the trace. Therefore, when controlling impedance, the spacing of the copper pour must be specified in the stack-up requirements along with the reference plane; it cannot be adjusted arbitrarily afterward.<\/p>\n<p><strong>Related Recommendations<\/strong>\uff1a<a href=\"\/en\/blog\/design-of-through-hole-multilayer-pcb-board\/\">The Importance of Via Holes in Multilayer PCB Design<\/a> \u00b7 <a href=\"\/en\/blog\/application-of-0-ohm-resistor-in-circuit-design\/\">Applications of 0-Ohm Resistors in Circuit Design<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>\u5728PCB\uff08Printed Circuit Board\uff0c\u5370\u5237\u7535\u8def\u677f\uff09\u8bbe\u8ba1\u4e2d\uff0c\u8986\u94dc\u6280\u672f\u626e\u6f14\u7740\u81f3\u5173\u91cd\u8981\u7684\u89d2\u8272\u3002\u4e0d\u8bba\u662f [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":9350,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"An Introduction to the Pros and Cons of Copper Cladding at PCB Factories - Jingpeng Electronics","description":"What are the pros and cons of copper-clad laminates? This article explains the advantages\u2014such as interference resistance, EMI suppression, and improved timing performance\u2014as well as the potential drawbacks to be aware of. When prototyping is required, you can use the key points in this article to confirm the board manufacturer\u2019s process capabilities."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[405,26],"tags":[],"class_list":["post-2388","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pcb-design","category-blog"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2388","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=2388"}],"version-history":[{"count":4,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2388\/revisions"}],"predecessor-version":[{"id":19955,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2388\/revisions\/19955"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media\/9350"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=2388"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=2388"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=2388"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}