{"id":2186,"date":"2026-11-06T11:00:00","date_gmt":"2026-11-06T03:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2186"},"modified":"2026-10-08T20:16:16","modified_gmt":"2026-10-08T12:16:16","slug":"auto-comm-pcb-new-trends","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/auto-comm-pcb-new-trends\/","title":{"rendered":"What Are the New Trends in Automotive PCB Development? The Application of HDI, Thick Copper, and Eco-Friendly Materials"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<p>The automotive manufacturing industry is undergoing an unprecedented technological revolution, with the rise of new energy vehicles at the heart of this revolution. Behind these new energy vehicles lies a complex and sophisticated network of electronic systems, at the core of which are high-energy\/high-voltage automotive circuit boards. This article will take an in-depth look at the key roles these circuit boards play and their applications in new energy vehicles.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"285\" height=\"300\" class=\"alignnone size-large wp-image-444\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2022\/11\/7.png\" alt=\"Thick-Copper Printed Circuit Boards\" \/><\/p>\n<h2><strong>1. High Energy: Challenges and Opportunities<\/strong><\/h2>\n<ol>\n<li><strong>Automotive Communication Module Circuit Board<\/strong>: New energy vehicles require highly intelligent communication systems, which rely on precision circuit boards to ensure the accuracy and speed of data transmission.<\/li>\n<li><strong>Drive Circuits and Drive Modules for Electric Vehicles<\/strong>: The core of an electric vehicle lies in its motor and drive system. Power IGBT (Insulated-Gate Field-Effect Transistor combined with a bipolar transistor) modules play a crucial role here, but they also generate up to 2,000 W of heat, requiring an efficient heat dissipation design.<\/li>\n<li><strong>New Types of PCB Materials<\/strong>: To meet the demand for new energy vehicles, new types of laminates\u2014such as ceramic-clad copper laminates and aluminum-silicon carbide substrate materials\u2014are widely used. They offer excellent thermal conductivity and insulation properties, making them suitable for high-power applications.<\/li>\n<\/ol>\n<h2>Advanced: What Are the Four Key Requirements That New Energy Vehicles Place on Circuit Boards?<\/h2>\n<p>The original text provides an overview from four perspectives: high-energy, eco-friendly, HDI and thick copper, and flexible and high-speed materials. Viewed from a different angle, these technological choices reflect four critical requirements that new energy vehicles place on PCBs, which often conflict with one another:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Requirements<\/th>\n<th>Quantitative Metrics<\/th>\n<th>Design Constraints Resulting From...<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>High Current Carrying Capacity<\/td>\n<td>Drive modules can handle hundreds of amperes<\/td>\n<td>Thick copper, windowed and tinned, metal substrate<\/td>\n<\/tr>\n<tr>\n<td>High-Efficiency Heat Dissipation<\/td>\n<td>IGBT modules can dissipate up to 2,000 W of heat<\/td>\n<td>Ceramic Copper-Clad Laminates, Silicon Carbide Aluminum, Heat-Dissipating Vias<\/td>\n<\/tr>\n<tr>\n<td>High Reliability<\/td>\n<td>Automotive-grade requirement: service life of 15 years or more<\/td>\n<td>High-Tg Materials, Rigorous Reliability Validation<\/td>\n<\/tr>\n<tr>\n<td>High Integration<\/td>\n<td>Centralization of Computing Power on Domain Controllers<\/td>\n<td>HDI, Blind and Buried Vias, High-Speed Materials<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The point of contention is:<strong>Thick copper facilitates current carrying and heat dissipation, but comes at the expense of routing density.<\/strong>\uff1b<strong>HDI enhances integration, but blind and buried vias can reduce thermal cycling reliability.<\/strong>. Therefore, the design process for automotive circuit boards is essentially a series of trade-offs, rather than simply a collection of advanced manufacturing processes.<\/p>\n<ul>\n<li><strong>Power Range<\/strong>: Prioritize current-carrying capacity and heat dissipation by using thick copper or metal substrates, and increase the spacing between traces accordingly;<\/li>\n<li><strong>Control Zone<\/strong>: Prioritize integration density by using HDI and high-speed materials, but keep the board away from high-temperature areas;<\/li>\n<li><strong>Transition Zone<\/strong>: Ensure sufficient spacing and thermal isolation between the two types of areas.<\/li>\n<\/ul>\n<ol>\n<li>First, divide the panel into a power zone and a control zone based on power levels;<\/li>\n<li>Determine the process routes and materials for each of the two zones;<\/li>\n<li>Once again, verify the stacking configuration, plate thickness, and manufacturability.<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-6080\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcb.webp\" alt=\"Automotive Electronic Circuit Boards\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcb.webp 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcb-300x169.webp 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcb-1024x576.webp 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcb-768x432.webp 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcb-400x225.webp 400w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>For the cooling solution, see<a href=\"\/en\/metal-substrate\/\">Metal Substrate<\/a>Capability Description; see the materials system in<a href=\"\/en\/capabilities\/pcb-materials\/\">PCB Sheets<\/a>\u3002<\/p>\n<h2><strong>2. Eco-Friendly Materials and Green Design<\/strong><\/h2>\n<ol>\n<li><strong>Implementing Green Design and Green Manufacturing<\/strong>: The manufacturing of new energy vehicles must comply with green design and manufacturing standards, including environmental protection requirements such as the RoHS Directive. This ensures that automotive circuit boards are free of hazardous substances and are environmentally friendly.<\/li>\n<li><strong>Lead-Free Manufacturing Process<\/strong>: To meet environmental protection requirements, the circuit board manufacturing process uses a lead-free reflow soldering process to ensure that no harmful lead compounds are released at high temperatures.<\/li>\n<li><strong>Halogen-free requirements<\/strong>: Complies with halogen-free requirements (i.e., RoHS environmental standards) and does not use halogen-containing materials, further reducing its environmental impact.<\/li>\n<\/ol>\n<h2>Advanced: Why HDI and Thick Copper Are Difficult to Combine<\/h2>\n<p>The third section of the original text compares HDI and thick copper; in actual engineering practice, it is difficult to fully implement both of these processes on the same board at the same time because their process requirements are contradictory:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Dimension<\/th>\n<th>HDI Direction<\/th>\n<th>Thick Copper Direction<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Copper Thickness<\/td>\n<td>Thin copper (0.5 oz grade) is suitable for fine circuit patterns<\/td>\n<td>Thick copper (2\u20136 oz) facilitates current flow<\/td>\n<\/tr>\n<tr>\n<td>Line Width and Spacing<\/td>\n<td>The thinner, the better; it can be as thin as 3 mil<\/td>\n<td>Must be loosened; starting at 2 oz, approximately 8 mil<\/td>\n<\/tr>\n<tr>\n<td>Die Profile<\/td>\n<td>Laser-drilled micropores<\/td>\n<td>Machined through-hole with an oversized diameter<\/td>\n<\/tr>\n<tr>\n<td>Number of Pressing Cycles<\/td>\n<td>Several times<\/td>\n<td>As little as possible<\/td>\n<\/tr>\n<tr>\n<td>Media Thickness<\/td>\n<td>Thin medium<\/td>\n<td>Sufficient filling thickness is required<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>When a circuit board truly requires both high density and high current, the industry standard practice is to<strong>Partition-by-Partition Processing<\/strong>: Use thick copper-core boards in the power section and HDI sub-boards in the control section, then assemble them by lamination or soldering. Another approach is<strong>Hybrid-Pressure Structure<\/strong>, using different copper thicknesses and materials on different layers.<\/p>\n<ul>\n<li><strong>Copper Block Embedding Method<\/strong>: Embed solid copper blocks into the board to separate high-current paths from fine-line traces;<\/li>\n<li><strong>Thick Copper + Selective Thinning<\/strong>: Reduce the copper thickness in specific areas to create fine traces, while retaining the thick copper elsewhere;<\/li>\n<li><strong>Layered Support<\/strong>: Use a dedicated power plane for high currents, and use standard copper thickness for signal planes.<\/li>\n<\/ul>\n<ol>\n<li>List all high-current networks on the board and their current-carrying requirements;<\/li>\n<li>Determine whether these networks can be consolidated into a small number of layers;<\/li>\n<li>The remaining layers are designed to meet HDI and high-speed signal requirements.<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"176\" height=\"175\" class=\"alignnone size-large wp-image-6505\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/HDI-PCBs.webp\" alt=\"High-Density Interconnect PCBs\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/HDI-PCBs.webp 176w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/HDI-PCBs-150x150.webp 150w\" sizes=\"auto, (max-width: 176px) 100vw, 176px\" \/><\/p>\n<p>See HDI Process Capabilities<a href=\"\/en\/hdi-pcb\/\">HDI (High-Density Interconnect) Boards<\/a>; For thick copper specifications, see<a href=\"\/en\/blog\/8-issues-for-pcb-copper-clad-coating\/\">8 Things to Keep in Mind When Applying Copper to a PCB<\/a>\u3002<\/p>\n<h2><strong>3. Challenges of High-Density Interconnect (HDI) and Thick Copper<\/strong><\/h2>\n<ol>\n<li><strong>Automotive Circuit Boards<a href=\"\/en\/hdi-pcb\/\">High-Density Interconnect<\/a>(HDI)<\/strong>: To meet the demands for smaller, high-performance vehicles, HDI technology has become essential. It enables a greater number of layers in a smaller footprint, reduces the risk of tin-bridge short circuits, and provides highly precise thermal vias.<\/li>\n<li><strong>Thick Copper Technology<\/strong>: In some high-power applications, thick copper plate technology is required to ensure adequate electrical conductivity and heat dissipation. This involves selecting and processing copper foil to meet the specific requirements of the application.<\/li>\n<\/ol>\n<h2><strong>4. Semi-flexible automotive printed circuit boards and high-speed copper-clad printed circuit boards<\/strong><\/h2>\n<ol>\n<li><strong>Insulating Substrates for Flexible Circuit Boards<\/strong>: Certain automotive components require the use of flexible printed circuit boards, so the selection of insulating film is critical. This requires a comprehensive evaluation of the film\u2019s various performance metrics, including heat resistance, conformability, thickness, and mechanical and electrical properties.<\/li>\n<li><strong>Copper Foil for Flexible Circuits<\/strong>: To meet the requirements of flexible circuit boards, selecting the right copper foil is crucial. Compared to traditional electrolytic copper foil, cold-rolled copper foil offers better ductility and bend resistance.<\/li>\n<li><strong>New High-Speed Materials<\/strong>: To meet the demands of high-speed signal transmission, some applications use new high-speed materials, such as ISOLAFR408 copper-clad laminate, to reduce signal loss.<\/li>\n<\/ol>\n<h2>Advanced: How Do Automotive-Grade Reliability Requirements Differ from Those of Conventional Consumer Electronics?<\/h2>\n<p>The biggest difference between automotive circuit boards and consumer electronics circuit boards lies not in performance, but in<strong>The Stringency of Reliability Validation<\/strong>. The same circuit board might only require standard functional testing when used in a cell phone, but when used in a car, it must undergo a series of environmental and endurance tests:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Verification Items<\/th>\n<th>Typical Conditions<\/th>\n<th>Subjects of the Study<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Thermal Cycling<\/td>\n<td>-40 \u00b0C \u2194 125 \u00b0C, hundreds to thousands of cycles<\/td>\n<td>Pitting and Interlayer Bonding<\/td>\n<\/tr>\n<tr>\n<td>High Temperature and High Humidity<\/td>\n<td>85 \u00b0C \/ 85% RH, 1,000 hours<\/td>\n<td>Insulation degradation, electrochemical migration<\/td>\n<\/tr>\n<tr>\n<td>Thermal Shock<\/td>\n<td>Rapid Temperature Change<\/td>\n<td>Cracking at Material Interfaces<\/td>\n<\/tr>\n<tr>\n<td>Vibration and Mechanical Shock<\/td>\n<td>Random Vibration + Shock<\/td>\n<td>Solder Joint Fatigue, Component Detachment<\/td>\n<\/tr>\n<tr>\n<td>CAF Test<\/td>\n<td>High Temperature, High Humidity, and Bias Voltage<\/td>\n<td>Substrate Resistance to Ion Migration<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>Among them<strong>Thermal cycling is the most direct test for perforated copper<\/strong>. The coefficient of thermal expansion along the Z-axis of a PCB is much greater than that of copper; when temperatures fluctuate repeatedly, the wall of the via is repeatedly stretched, eventually leading to fatigue cracking in the middle of the via or at the corners. This is also why automotive-grade boards have stricter requirements for via copper thickness\u2014while standard boards typically require 20\u201325 \u03bcm, automotive-grade boards often require 25 \u03bcm or more.<\/p>\n<ul>\n<li><strong>Material Selection<\/strong>: Substrates with high Tg (\u2265 170 \u00b0C), low Z-axis CTE, and CAF resistance;<\/li>\n<li><strong>Pore Structure Design<\/strong>: Avoid using holes that are too small; keep the diameter-to-wall-thickness ratio within 8:1;<\/li>\n<li><strong>Solder Joint Reliability<\/strong>: For high-power components, consider bottom-fill or mechanical reinforcement;<\/li>\n<li><strong>Consistency Control<\/strong>: Automotive projects typically require end-to-end traceability.<\/li>\n<\/ul>\n<ol>\n<li>Define service life and environmental classification requirements during the project initiation phase;<\/li>\n<li>Select materials and processes based on grade;<\/li>\n<li>Build a prototype board and conduct reliability testing;<\/li>\n<li>Mass production begins only after the tests are passed.<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"700\" height=\"500\" class=\"alignnone size-large wp-image-5806\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive.webp\" alt=\"Automotive Electronics PCBs\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive.webp 700w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-300x214.webp 300w\" sizes=\"auto, (max-width: 700px) 100vw, 700px\" \/><\/p>\n<p>For key points on reliability and slicing, see<a href=\"\/en\/blog\/19-pcb-reliability-and-microsection-points\/\">Key Points on the Reliability of 19 Printed Circuit Boards and Microsectioning Techniques<\/a>; For information on the stability of multilayer boards, see<a href=\"\/en\/blog\/pcb-multilayer-board-tg\/\">Stability and Reliability of Multilayer PCBs<\/a>\u3002<\/p>\n<h2><strong>Conclusion<\/strong><\/h2>\n<p>High-energy\/high-current automotive circuit boards play an indispensable role in new energy vehicles. They support electric vehicles\u2019 drive systems, communication technologies, high-power applications, and environmentally friendly manufacturing. As the new energy vehicle industry continues to develop, circuit board technology will continue to evolve to meet increasingly complex demands, which will also drive the automotive manufacturing industry toward greater intelligence, efficiency, and environmental sustainability.<\/p>\n<p>&nbsp;<\/p>\n<hr \/>\n<h2>Advanced: Quick Reference Guide to Automotive Board Materials<\/h2>\n<p>Summarize the material and process selections discussed earlier into a quick-reference chart to help quickly identify the right direction during the design phase:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Use Cases<\/th>\n<th>Recommended Solutions<\/th>\n<th>Key Parameters<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Electric Motor Drive, OBC<\/td>\n<td>Thick Copper + Metal Substrate<\/td>\n<td>2\u20136 oz, thermal conductivity \u2265 1 W\/m\u00b7K<\/td>\n<\/tr>\n<tr>\n<td>IGBT \/ SiC Power Modules<\/td>\n<td>Ceramic Copper-Clad Laminate (DBC\/AMB)<\/td>\n<td>High thermal conductivity, high electrical insulation, CTE matching<\/td>\n<\/tr>\n<tr>\n<td>Domain Controller, Cockpit<\/td>\n<td>HDI+ High-Speed Materials<\/td>\n<td>Order, Dk\/Df, Impedance Tolerance<\/td>\n<\/tr>\n<tr>\n<td>In-Vehicle Communication (T-Box)<\/td>\n<td>High-Frequency Sheets<\/td>\n<td>Dk: Stable, low loss<\/td>\n<\/tr>\n<tr>\n<td>Sensors, Cameras<\/td>\n<td>Standard FR-4, High Tg<\/td>\n<td>Tg \u2265 170 \u00b0C<\/td>\n<\/tr>\n<tr>\n<td>Flexible Joints<\/td>\n<td>Flexible Board + Laminated Copper Foil<\/td>\n<td>Flexible, temperature-resistant<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>It is important to note that the quick reference table is intended solely for<strong>Narrow Down the List of Candidates<\/strong>...Ultimately, material selection must still be based on actual thermal simulations, reliability testing, and cost assessments. Especially in high-value applications such as power modules, any change in materials requires a complete revalidation process.<\/p>\n<ul>\n<li><strong>Let's take a look at the trending topics first<\/strong>: Power density determines the thermal management solution; this is the most stringent constraint;<\/li>\n<li><strong>Check the signal again<\/strong>: The rate and density determine the HDI order and the board grade;<\/li>\n<li><strong>Finally, let's look at the cost<\/strong>: Select the option with the best value for money from among those that meet the first two criteria.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-6068\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thick-copper-board-pcb.jpg\" alt=\"Thick Copper Board\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thick-copper-board-pcb.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thick-copper-board-pcb-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thick-copper-board-pcb-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thick-copper-board-pcb-768x432.jpg 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thick-copper-board-pcb-400x225.jpg 400w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>See Halogen-Free Process<a href=\"\/en\/blog\/production-process-of-halogen-free-pcb\/\">Manufacturing Process for Halogen-Free PCBs<\/a>; For heat dissipation from aluminum substrates, see<a href=\"\/en\/blog\/efficient-heat-dissipation-solution-for-aluminum-substrates\/\">High-Efficiency Heat Dissipation Solutions for Aluminum Substrates<\/a>\u3002<\/p>\n<h2>Frequently Asked Questions<\/h2>\n<h3>Q1: What is HDI technology?<\/h3>\n<p> HDI stands for High-Density Interconnect technology, which enables a greater number of layers and higher connection density on small circuit boards; it is typically used in high-performance applications.<\/p>\n<h3>Q2: Why do new energy vehicles need high-energy\/high-current automotive circuit boards?<\/h3>\n<p> The electric systems and communication technologies in new energy vehicles require high-power, high-density circuit boards to support their performance and functionality.<\/p>\n<h3>Q3: Why are eco-friendly materials so important in the manufacture of automotive circuit boards?<\/h3>\n<p> Environmentally friendly materials ensure that automotive circuit boards are free of harmful substances, comply with environmental standards, and help reduce negative impacts on the environment.<\/p>\n<h3>Q4: What is a lead-free manufacturing process?<\/h3>\n<p> Lead-free manufacturing is a printed circuit board manufacturing process that uses lead-free solder to reduce environmental and health impacts.<\/p>\n<h3>Q5: Why is the choice of insulating substrate for flexible circuit boards so important?<\/h3>\n<p> The choice of insulating substrate for flexible circuit boards affects their performance and reliability; therefore, multiple factors must be taken into account to make an appropriate selection.<\/p>\n<h3>Q6: Why is CAF resistance particularly emphasized in automotive circuit boards?<\/h3>\n<p>CAF (Conductive Anode Fibre) is a phenomenon in which copper ions within the substrate migrate along the gaps between glass fibers under the combined influence of an electric field and moisture, ultimately forming a conductive path between two conductors. Automotive operating environments, characterized by high temperatures, high humidity, and continuous power supply, are scenarios where CAF frequently occurs. CAF-resistant substrates, which suppress migration through improvements to the resin system and glass fiber treatment, are a standard requirement for high-reliability automotive-grade circuit boards.<\/p>\n<h3>Q7: How do you choose between cold-rolled copper foil and electrolytic copper foil?<\/h3>\n<p>Rolled copper foil is produced by rolling copper ingots; its grains are arranged in a layered structure, providing better ductility and resistance to bending, making it suitable for flexible boards and areas requiring frequent bending; Electrolytic copper foil is formed through electroplating, with a columnar grain structure; it is less expensive but has poorer bend resistance. Rigid boards generally use electrolytic copper foil, while flexible boards use rolled copper foil.<\/p>\n<h3>Q8: What changes will halogen-free materials bring to the manufacturing process?<\/h3>\n<p>Resin systems for halogen-free substrates differ from those for halogen-containing substrates; they typically exhibit a slightly higher Tg, slightly lower toughness, and faster tool wear during drilling and edge milling. From a process perspective, drilling parameters and milling cutter life management must be adjusted accordingly, and lamination parameters may also need to be re-optimized. Halogen-free composition does not affect electrical performance on its own, but it does affect the processing window.<\/p>\n<h3>Q9: What is the maximum copper thickness for thick copper boards?<\/h3>\n<p>Standard mass production capabilities generally reach up to 6 oz (approximately 210 \u03bcm); a few manufacturers can achieve over 10 oz, but this requires significantly widening the line widths and line spacings, as well as a special review. The thicker the copper, the more severe the etching side-etch becomes, making it increasingly difficult to fabricate fine circuits. Once a certain thickness is exceeded, it is often more cost-effective to switch to copper-embedded blocks or metal substrates.<\/p>\n<h3>Q10: Why are lead times for automotive circuit boards generally longer?<\/h3>\n<p>This is primarily due to three factors: materials (high Tg, halogen-free, and high-speed materials with long procurement cycles); manufacturing processes (multi-stage lamination for HDI and multi-step processes for thick copper); and validation (reliability testing and lengthy PPAP documentation cycles). Among these, the validation phase often accounts for the largest portion of the time and is difficult to shorten.<\/p>\n<p><strong>Further Reading<\/strong>\uff1a<a href=\"\/en\/blog\/pcb-multilayer-board-tg\/\">Stability and Reliability of Multilayer PCBs<\/a> \u00b7 <a href=\"\/en\/blog\/efficient-heat-dissipation-solution-for-aluminum-substrates\/\">Aluminum Substrate<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>\u6c7d\u8f66\u5236\u9020\u4e1a\u6b63\u7ecf\u5386\u7740\u524d\u6240\u672a\u6709\u7684\u6280\u672f\u9769\u547d\uff0c\u65b0\u80fd\u6e90\u6c7d\u8f66\u7684\u5174\u8d77\u6210\u4e3a\u4e86\u8fd9\u4e00\u9769\u547d\u7684\u4e2d\u5fc3\u3002\u5728\u65b0\u80fd\u6e90\u6c7d\u8f66\u7684\u80cc\u540e\uff0c\u6709\u4e00\u4e2a\u590d\u6742\u800c\u7cbe [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":444,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"What Are the New Trends in Automotive PCB Development? The Application of HDI, Thick Copper, and Eco-Friendly Materials","description":"What are the new features of automotive communication module circuit boards? Explain the challenges posed by high energy density, the use of eco-friendly materials and green design, and trends in HDI and thick copper processes. 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