{"id":2071,"date":"2026-10-23T11:00:00","date_gmt":"2026-10-23T03:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=2071"},"modified":"2026-10-10T00:08:06","modified_gmt":"2026-10-09T16:08:06","slug":"5g-antenna-pcb-materials","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/5g-antenna-pcb-materials\/","title":{"rendered":"What Materials Are Used for 5G Antenna PCBs? FPC Manufacturing Process and Loss Issues with PI Film"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<p>The rise of 5G is transforming the way we communicate, but it requires advanced technologies and materials to become a reality. This article will introduce a technology called<a href=\"\/en\/flexible-pcb\/\">FPC<\/a>Breakthrough innovations in the materials used for manufacturing 5G antenna PCBs, as well as related materials such as PI film (polyimide). We will also explore why PI film is not suitable for systems operating at frequencies above 10G and examine a new solution\u2014Micro-Nav Technology.<\/p>\n<h2>H1: FPC Processes and PI Films<\/h2>\n<p>In 5G communications, the quality and performance of PCBs (Printed Circuit Boards) are critical. In the manufacturing of 5G antennas, FPC (Flexible Printed Circuit) technology has garnered significant attention. However, traditional PI film may not be suitable in certain situations.<\/p>\n<h3>1. The Issue of Loss in PI Films<\/h3>\n<p>PI film, also known as polyimide film, is a common substrate material. However, PI film exhibits significant loss at frequencies above 10 GHz. This means that at high frequencies, PI film causes signal loss, which is unacceptable for 5G communications.<\/p>\n<h2>Advanced: How to Interpret the Loss Values for PI Films<\/h2>\n<p>When saying that \u201cPI film has high loss at high frequencies,\u201d this needs to be backed up with comparable figures. The key parameter for measuring dielectric loss is <strong>Df (tangent of the dielectric loss angle)<\/strong>, which is directly related to the material's polarity and the operating frequency:<\/p>\n<ul>\n<li><strong>Standard PI Membrane<\/strong>: Df is significantly higher around 10 GHz, and insertion loss rises rapidly in the millimeter-wave band;<\/li>\n<li><strong>Modified PI and LCP<\/strong>: Df can be one order of magnitude lower, making it a more common choice for high-frequency flexible antennas;<\/li>\n<li><strong>There are three sources of loss<\/strong>: Dielectric loss (determined by Df), conductor loss (determined by the roughness of the copper foil and the skin effect), radiation, and leakage;<\/li>\n<li><strong>The higher the frequency, the more sensitive it is.<\/strong>: The loss on the same trace is acceptable at Sub-6G, but at millimeter wave frequencies, it could consume half of the link margin.<\/li>\n<\/ul>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Materials<\/th>\n<th>Dk<\/th>\n<th>Df (on the order of 10 GHz)<\/th>\n<th>Applicable<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Standard PI Membrane<\/td>\n<td>3.2\u20133.5<\/td>\n<td>Slightly large (on the order of 10\u207b\u00b2)<\/td>\n<td>Low-Frequency Flexible Circuits<\/td>\n<\/tr>\n<tr>\n<td>Modified PI<\/td>\n<td>3.0\u20133.3<\/td>\n<td>Moderate (on the order of 10\u207b\u00b3)<\/td>\n<td>Mid-to-High-Frequency Flexible Boards<\/td>\n<\/tr>\n<tr>\n<td>LCP<\/td>\n<td>2.9\u20133.0<\/td>\n<td>Low (10\u207b\u00b3 or lower)<\/td>\n<td>Millimeter-wave antennas, high-frequency connectors<\/td>\n<\/tr>\n<tr>\n<td>PTFE System<\/td>\n<td>2.2\u20133.2<\/td>\n<td>Extremely low<\/td>\n<td>High-Frequency Rigid and Hybrid PCBs<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>Note: The table above shows typical values published by the industry. Specific grades should be determined based on the material supplier\u2019s actual test data, and Df varies depending on frequency and testing methods.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1000\" height=\"500\" class=\"alignnone size-large wp-image-4942\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/High-Frequency-PCBs.jpg\" alt=\"High-Frequency Circuit Boards\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/High-Frequency-PCBs.jpg 1000w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/High-Frequency-PCBs-300x150.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/High-Frequency-PCBs-768x384.jpg 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/High-Frequency-PCBs-400x200.jpg 400w\" sizes=\"auto, (max-width: 1000px) 100vw, 1000px\" \/><\/p>\n<p>For information on how to select high-frequency materials, see<a href=\"\/en\/faq\/high-frequency-circuit-board-materials\/\">How to Choose Materials for High-Frequency Printed Circuit Boards<\/a>\u3002<\/p>\n<h2>H2: Innovations in Micro-Aviation Technology<\/h2>\n<p>To address the issue of PI film degradation, Weihang has introduced a brand-new technology with the following features:<\/p>\n<h3>1. The substrate is only 6 micrometers thick<\/h3>\n<p>Micro-Aviation Technology employs a specialized additive manufacturing technique that deposits metal onto a thin film without the need for an adhesive layer. This allows the substrate to be only 6 micrometers thick, making it ideal for the manufacture of millimeter-wave antennas.<\/p>\n<h3>2. Rigid Substrate<\/h3>\n<p>In addition to flexible substrates, rigid printed circuit boards also play a critical role in certain applications. Rigid substrates are essential for systems that require 3D packaging and electronic component soldering, as well as for systems with low electromagnetic loss requirements in the millimeter-wave band.<\/p>\n<h2>Advanced: How Do the Three Layers of an FPC Antenna Structure Affect Each Other?<\/h2>\n<p>Flexible circuit boards used for antennas typically consist of three layers, and the material of each layer affects the final high-frequency performance:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>\u5c42<\/th>\n<th>Common Materials<\/th>\n<th>Impact on High Frequencies<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Substrate (Medium)<\/td>\n<td>PI \/ Modified PI \/ LCP<\/td>\n<td>Dk and Df are the primary sources of loss<\/td>\n<\/tr>\n<tr>\n<td>Copper foil<\/td>\n<td>Electrolytic Copper (ED) \/ Rolled Copper (RA)<\/td>\n<td>Surface roughness determines conductor loss; low-profile copper is commonly used in antennas.<\/td>\n<\/tr>\n<tr>\n<td>Coverlay<\/td>\n<td>PI Film + Adhesive \/ Adhesive-Free<\/td>\n<td>Covering the traces will alter the impedance, and the adhesive layer will cause greater loss.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>Three points in particular are most easily overlooked:<\/p>\n<ul>\n<li><strong>The covering film has a significant impact.<\/strong>: Windows are typically left uncovered in the antenna area to prevent the adhesive layer from introducing additional loss and impedance shifts;<\/li>\n<li><strong>Adhesive-free substrates are superior to those with adhesive.<\/strong>: The Df of the adhesive layer is typically higher than that of the substrate itself, and this difference is amplified at high frequencies;<\/li>\n<li><strong>The roughness of copper foil should not be overlooked<\/strong>: For antenna trace routing, it is recommended to specify low-profile or ultra-low-profile copper foil, as this will significantly reduce conductor loss.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"500\" height=\"300\" class=\"alignnone size-large wp-image-4906\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/fpc.jpg\" alt=\"Flexible Printed Circuit Boards\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/fpc.jpg 500w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/fpc-300x180.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/fpc-267x160.jpg 267w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/fpc-400x240.jpg 400w\" sizes=\"auto, (max-width: 500px) 100vw, 500px\" \/><\/p>\n<p>For more details on the FPC process, see<a href=\"\/en\/faq\/what-is-an-fpc-flexible-circuit-board\/\">What Is an FPC (Flexible Printed Circuit)?<\/a>\u4e0e<a href=\"\/en\/blog\/fpc-manufacturing-fccl\/\">Performance Requirements for FCCL in FPC Manufacturing<\/a>\u3002<\/p>\n<h2>H3: Challenges in Material Selection<\/h2>\n<p>When manufacturing 5G antennas, selecting the right materials is crucial. In this process, it is essential to take multiple factors into account:<\/p>\n<h3>\u2013 The millimeter-wave band requires low loss<\/h3>\n<p>In 5G systems, particularly in the millimeter-wave band, signal transmission and reception are highly sensitive. Therefore, it is necessary to select materials that ensure electromagnetic loss is kept as low as possible.<\/p>\n<h3>\u2013 3D Packaging and Soldering Requirements<\/h3>\n<p>In some 5G systems, both 3D packaging and the soldering of electronic components must be performed simultaneously. This poses additional challenges for material selection, as both the mechanical properties and electrical conductivity of the materials must be taken into account.<\/p>\n<h2>Advanced: Evaluating Antenna Materials Requires Consideration of Four Dimensions<\/h2>\n<p>When evaluating an antenna board material, you shouldn\u2019t focus solely on Df; the following four factors must be considered together:<\/p>\n<ul>\n<li><strong>Electrical<\/strong>: Dk, Df, and their stability as a function of frequency, temperature, and moisture absorption;<\/li>\n<li><strong>Mechanical Engineering<\/strong>: Number of bends, dimensional stability, and tear resistance\u2014these are particularly critical for flexible antennas;<\/li>\n<li><strong>Heat and Weather Resistance<\/strong>: Heat resistance of reflow soldering, and the retention rate of performance after damp-heat aging;<\/li>\n<li><strong>Machinability<\/strong>: Whether stable lamination, drilling, and etching are possible, and whether it is compatible with the cover film system.<\/li>\n<\/ul>\n<p>These four factors often influence one another: Materials with the lowest Df typically have the narrowest processing window and higher costs. The essence of material selection is<strong>Provided that the link budget is met, select the tier that offers the best balance of manufacturability and cost control.<\/strong>...rather than simply chasing the lowest power loss.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"768\" class=\"alignnone size-large wp-image-9562\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/11\/high-frequency-pcb.webp\" alt=\"High-Frequency Printed Circuit Boards\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/11\/high-frequency-pcb.webp 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/11\/high-frequency-pcb-300x225.webp 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/11\/high-frequency-pcb-768x576.webp 768w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<p>For background information on the applications of the millimeter-wave band, see<a href=\"\/en\/blog\/5g-high-frequency-board-millimeter-wave-communication\/\">Understanding 5G High-Frequency Boards, Millimeter Wave, and Their Impact on the Communications Industry<\/a>\u3002<\/p>\n<h2>Advanced: Five Technical Approaches to Reducing Losses<\/h2>\n<ol>\n<li><strong>Substrate Modification<\/strong>: Adjust the molecular structure to reduce polarity, lowering Df from the 10\u207b\u00b2 order of magnitude to the 10\u207b\u00b3 order of magnitude;<\/li>\n<li><strong>Material Replacement System<\/strong>: By switching to low-loss polymers such as LCP, both loss and moisture absorption are improved;<\/li>\n<li><strong>Thinning and Degumming<\/strong>: Thinner substrate and removal of the adhesive layer reduce the loss path and improve bend performance;<\/li>\n<li><strong>Low-profile copper foil<\/strong>: Use HVLP\/VLP copper foil to reduce conductor losses;<\/li>\n<li><strong>Structural Optimization<\/strong>: Open windows in the antenna area, optimize the feedline and reference ground, and reduce unnecessary dielectric coverage.<\/li>\n<\/ol>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Route<\/th>\n<th>Revenue<\/th>\n<th>Cost<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Substrate Modification<\/td>\n<td>Losses have decreased significantly, and process compatibility is good.<\/td>\n<td>Rising Material Costs<\/td>\n<\/tr>\n<tr>\n<td>Switch to the LCP system<\/td>\n<td>Simultaneous Improvement in Loss and Moisture Absorption<\/td>\n<td>Tight processing windows and high costs<\/td>\n<\/tr>\n<tr>\n<td>Thinning without gelation<\/td>\n<td>Lower power loss and improved bendability<\/td>\n<td>Decrease in mechanical strength<\/td>\n<\/tr>\n<tr>\n<td>Low-profile copper foil<\/td>\n<td>Reduction in Conductor Losses<\/td>\n<td>The adhesion of the copper foil needs to be re-verified.<\/td>\n<\/tr>\n<tr>\n<td>Opening in the Antenna Area<\/td>\n<td>Stable impedance, reduced loss<\/td>\n<td>Decreased protective performance<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-6195\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/FPC-1.jpg\" alt=\"FPC\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/FPC-1.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/FPC-1-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/FPC-1-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/FPC-1-768x432.jpg 768w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<h2>Advanced: A Five-Step Checklist for Selecting Antenna Boards<\/h2>\n<ol>\n<li><strong>Frequency Bands and Link Budget<\/strong>: First, calculate the allowable insertion loss;<\/li>\n<li><strong>Selecting a Material System<\/strong>: Select between PI, modified PI, and LCP based on budget and bending requirements;<\/li>\n<li><strong>Determining Copper Foil and Thickness<\/strong>: Low-profile copper foil, paired with the appropriate dielectric thickness;<\/li>\n<li><strong>Determining the Cover Film Solution<\/strong>: Whether to cut a window in the antenna area, and whether to use an adhesive-free protective film;<\/li>\n<li><strong>Conduct practical testing and validation<\/strong>: Use a vector network analyzer to measure actual insertion loss and standing wave ratio; don't rely solely on simulations.<\/li>\n<\/ol>\n<p>There's one more point that's easy to overlook:<strong>Moisture absorption alters Dk and loss<\/strong>...This is particularly true for flexible materials; they should be conditioned under the specified temperature and humidity conditions prior to testing; otherwise, the data will not be comparable.<\/p>\n<ul>\n<li><strong>Excessive Losses<\/strong>: The material Df was selected incorrectly, or its properties changed after absorbing moisture;<\/li>\n<li><strong>Impedance Shift<\/strong>: The cover film is pressed against the antenna area, or the deviation in dielectric thickness is too great;<\/li>\n<li><strong>Bending Fracture<\/strong>: Improper selection of copper foil or design of the bending radius;<\/li>\n<li><strong>Batch-to-batch variation<\/strong>: Material grades are inconsistent, and there is poor consistency in supply.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1000\" height=\"500\" class=\"alignnone size-large wp-image-10313\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/04\/telecom_5G-antennas_webb.jpg.webp\" alt=\"5G Antenna PCB\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/04\/telecom_5G-antennas_webb.jpg.webp 1000w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/04\/telecom_5G-antennas_webb.jpg-300x150.webp 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2025\/04\/telecom_5G-antennas_webb.jpg-768x384.webp 768w\" sizes=\"auto, (max-width: 1000px) 100vw, 1000px\" \/><\/p>\n<p>The storage of high-frequency circuit boards can also affect their performance; see the requirements in<a href=\"\/en\/blog\/storage-requirements-and-shelf-life-of-high-frequency-pcb\/\">Storage Requirements and Shelf Life of High-Frequency PCBs<\/a>; For wiring tips, see<a href=\"\/en\/blog\/12-high-frequency-pcb-design-tips\/\">12 Key Tips for High-Frequency PCB Design and Routing<\/a>\u3002<\/p>\n<h2>Conclusion<\/h2>\n<p>The development of 5G communications requires advanced technologies and materials. The issue of loss in PI film at high frequencies has posed a challenge, but the emergence of micro-fabrication technology has opened up new possibilities for addressing this problem. In the manufacturing of 5G antenna PCBs, selecting the right materials is a critical step in ensuring outstanding performance.<\/p>\n<h2>Frequently Asked Questions<\/h2>\n<h3>Q1: Why do PI films experience loss issues at high frequencies?<\/h3>\n<p><strong>A1:<\/strong> PI films exhibit significant loss at high frequencies due to their inherent properties, which results in signal loss.<\/p>\n<h3>Q2: How does Microflight Technology reduce material waste?<\/h3>\n<p><strong>A2:<\/strong> Micro-Aviation Technology employs a specialized manufacturing process using a substrate that is only 6 micrometers thick, which reduces the material's electromagnetic losses.<\/p>\n<h3>Q3: Why are rigid substrates also important in 5G systems?<\/h3>\n<p><strong>A3:<\/strong> Rigid substrates play a critical role in some systems that require 3D packaging and electronic component soldering, while placing lower demands on electromagnetic loss.<\/p>\n<h3>Q4: Why is choosing the right materials critical for 5G antenna manufacturing?<\/h3>\n<p><strong>A4:<\/strong> Selecting the right materials ensures the performance and reliability of 5G antennas, especially at high frequencies and under complex conditions.<\/p>\n<h3>Q5: Is Micro-Aviation Technology suitable for 4G base station antennas?<\/h3>\n<p><strong>A5:<\/strong> Yes, micro-aviation technology can be applied to 4G base station antennas, reducing material costs and improving performance.<\/p>\n<h3>Q6: Is LCP always better than PI?<\/h3>\n<p>In terms of electrical performance, LCP is superior (lower Df and lower moisture absorption), but it has a narrower processing window, is more expensive, and places stricter demands on the lamination and etching processes. Only in millimeter-wave applications or scenarios where loss is a critical concern do the advantages of LCP sufficiently offset these drawbacks.<\/p>\n<h3>Q7: Why should the antenna area be left uncovered without an adhesive film?<\/h3>\n<p>The adhesive layer (Df) of the cover film is typically higher than that of the substrate; when pressed against the antenna traces, it introduces additional loss and alters the equivalent permittivity around the traces, causing shifts in impedance and resonance frequency. Creating a window helps maintain a controlled electromagnetic environment in the antenna area.<\/p>\n<h3>Q8: How much does the roughness of the copper foil affect the antenna?<\/h3>\n<p>This has a significant impact, especially in the millimeter-wave band. At high frequencies, current is concentrated in a very thin layer on the surface of the copper; the rougher the copper surface, the longer the current path, and the greater the conductor loss. For antenna traces, it is recommended to specify low-profile or ultra-low-profile copper foil.<\/p>\n<h3>Q9: How many layers do flexible antenna boards typically have?<\/h3>\n<p>Single-layer and double-layer designs are the most common. The antenna itself requires a clean radiation environment; increasing the number of layers introduces more dielectric materials and reference planes, which actually makes it more difficult to control. Double-layer designs are used only when feed lines and control lines need to be routed.<\/p>\n<h3>Q10: How can I verify that the loss of the antenna board meets the specifications?<\/h3>\n<p>Measure insertion loss and standing wave ratio using a vector network analyzer, and perform testing after conditioning the device under specified temperature and humidity conditions. It is also recommended to measure a section of standard microstrip line as a control to isolate the effects of materials and manufacturing processes.<\/p>\n<p><strong>Further Reading<\/strong>\uff1a<a href=\"\/en\/blog\/what-material-is-aluminum-substrate-sheet\/\">What material is aluminum substrate sheet made of?<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>5G\u7684\u5d1b\u8d77\u6b63\u5728\u6539\u53d8\u6211\u4eec\u7684\u901a\u4fe1\u65b9\u5f0f\uff0c\u4f46\u5b83\u9700\u8981\u5148\u8fdb\u7684\u6280\u672f\u548c\u6750\u6599\u6765\u5b9e\u73b0\u3002\u672c\u6587\u5c06\u4ecb\u7ecd\u4e00\u79cd\u540d\u4e3aFPC\u5de5\u827a\u76845G\u5929\u7ebfPCB [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"What Materials Are Used for 5G Antenna PCBs? FPC Manufacturing Process and Loss Issues with PI Film","description":"What materials are used for 5G antenna PCBs? Explain the loss issues associated with FPC processes and PI films, innovations in ultra-thin substrates, and the challenges involved in material selection. Based on the actual process capabilities of the production line, explain how to determine the parameters."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[26,411],"tags":[],"class_list":["post-2071","post","type-post","status-publish","format-standard","hentry","category-blog","category-industry-applications"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2071","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=2071"}],"version-history":[{"count":5,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2071\/revisions"}],"predecessor-version":[{"id":20064,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/2071\/revisions\/20064"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=2071"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=2071"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=2071"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}