{"id":1918,"date":"2026-10-08T10:00:00","date_gmt":"2026-10-08T02:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=1918"},"modified":"2026-10-09T15:30:40","modified_gmt":"2026-10-09T07:30:40","slug":"hand-drawn-pcb-layout-rules","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/hand-drawn-pcb-layout-rules\/","title":{"rendered":"What principles should be followed when manually designing a PCB? Placement of components as close as possible, manufacturing considerations, and thermal management"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}<br \/>\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}<br \/>\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}<br \/>\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}<br \/>\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}<br \/>\n.jp-tw tbody tr:hover{background:#f1f5fa;}<br \/>\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}<br \/>\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}<br \/>\n<\/style>\n<p>In the field of modern electronics, PCB (Printed Circuit Board) design plays a crucial role. Designers often use manual layout techniques to create these circuit boards, a method that offers numerous advantages and follows specific principles. This article will summarize some key principles of manual layout, which we hope will be helpful to designers.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-6445\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/what-is-pcb-layout.jpg\" alt=\"What Is PCB Layout?\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/what-is-pcb-layout.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/what-is-pcb-layout-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/what-is-pcb-layout-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/what-is-pcb-layout-768x432.jpg 768w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<h2>1. Basic Rules of Layout<\/h2>\n<h3>1.1. Place Components Close Together<\/h3>\n<p>Once the external connections on the PCB have been determined, the relevant circuit sections should be placed as close together as possible to avoid unnecessary routing. Particular care should be taken to avoid crisscrossing between different circuit units. Each circuit unit should be laid out with its core component at the center.<\/p>\n<h3>1.2. Aesthetics and Neatness<\/h3>\n<p>While ensuring the functionality and performance of the circuit, components should be arranged evenly, neatly, and compactly, with an appropriate balance between dense and sparse placement. The spacing between identical components should be consistent, and they should be aligned parallel to one another to achieve a layout that is \u201ccompact without being crowded, neat without being disorganized, and balanced without being top-heavy or bottom-heavy.\u201d<\/p>\n<h3>1.3. Considerations Regarding the Process<\/h3>\n<p>The design must take into account requirements related to manufacturing, testing, and maintenance. This includes<a href=\"\/en\/components-sourcing\/\">Components<\/a>The order and orientation of the components, as well as the spacing between lines and between lines and pins.<\/p>\n<h3>1.4. Heat Dissipation Considerations<\/h3>\n<p>Heat-generating components should be positioned to facilitate heat dissipation. Heat-generating components should not be mounted directly against the board; they should be equipped with heat sinks. Thermosensitive components should be kept away from heat-generating components to prevent interference.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1407\" height=\"791\" class=\"alignnone size-large wp-image-8931\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-layout-design-specification.jpg\" alt=\"PCB Layout Design Specifications\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-layout-design-specification.jpg 1407w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-layout-design-specification-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-layout-design-specification-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-layout-design-specification-768x432.jpg 768w\" sizes=\"auto, (max-width: 1407px) 100vw, 1407px\" \/><\/p>\n<h2>2. Handling Special Components<\/h2>\n<h3>2.1. Installing Brackets or Fasteners<\/h3>\n<p>For larger or heavier components, additional brackets or fasteners should be added rather than welding them directly to the PCB.<\/p>\n<h3>2.2. Consider the Layout of Adjustable Components<\/h3>\n<p>When designing the layout, take into account the placement of adjustable components to allow for future adjustments.<\/p>\n<h3>2.3. Keep in a fixed location<\/h3>\n<p>For circuit boards that need to be secured, provide spaces for fasteners and take ease of installation into account.<\/p>\n<h2>3. Placement of Key Components<\/h2>\n<h3>3.1. Location of Input and Output Devices<\/h3>\n<p>Input and output devices should be placed along the edges of the board for ease of use.<\/p>\n<h3>3.2. Button Locations<\/h3>\n<p>The button should be placed at the bottom of the board, and there should be no components around it that are higher than the button.<\/p>\n<h3>3.3. Location of the Core Processing Chip<\/h3>\n<p>The core processing chip should be placed in the center of the board to ensure circuit stability.<\/p>\n<h3>3.4. Placement of Display Components<\/h3>\n<p>Display components can be placed in the center of the board or directly above it for easy viewing.<\/p>\n<h3>3.5. Input and Output Layout<\/h3>\n<p>When there are inputs and outputs, the layout should follow the \"left-in, right-out\" principle.<\/p>\n<h2>4. Board Size and Arrangement Order<\/h2>\n<h3>4.1. Planning the Board Size<\/h3>\n<p>The size of the board should be determined based on principles such as cost-effectiveness, a reasonable and aesthetically pleasing component layout, ease of fabrication, and clean, orderly routing. Generally, a rectangular shape is the preferred choice.<\/p>\n<h3>4.2. Order of Arrangement<\/h3>\n<p>When arranging components, start with the larger ones to prevent them from taking up too much space. After placing the integrated circuits, arrange the other discrete components around them, giving priority to the main circuit components.<\/p>\n<p>In practice, following the steps below in this order yields the best results:<\/p>\n<ol>\n<li><strong>Define the interface first<\/strong>: Components subject to structural constraints\u2014such as connectors, switches, and indicator lights\u2014should be positioned in their fixed locations first.<\/li>\n<li><strong>Finalize the large components<\/strong>: Placeholder components such as transformers, large capacitors, and heat sinks.<\/li>\n<li><strong>Place the core IC<\/strong>: Determine the locations of the main control, memory, and power supply chips based on the signal flow.<\/li>\n<li><strong>Fill in some standing components<\/strong>: Place decoupling capacitors, resistors, and ferrites around the IC; decoupling capacitors must be placed close to the corresponding power supply pins.<\/li>\n<li><strong>Final touches on the details<\/strong>: Adjust the screen printing, the orientation of part numbers, and the distance between the no-print zones and the board edges.<\/li>\n<\/ol>\n<h2>5. Basic Wiring Standards<\/h2>\n<h3>5.1. Use 45\u00b0 routing<\/h3>\n<p>When routing cables, avoid sharp angles and right angles; routing cables at a 45\u00b0 angle helps reduce signal interference.<\/p>\n<h3>5.2. Pay Attention to the Power Cord and Ground Wire<\/h3>\n<p>Power and ground wires should be as short as possible and of sufficient gauge; additionally, the ground and power supplies for the analog and digital sections must be isolated from each other to improve performance.<\/p>\n<h3>5.3. Processing of Differential Signals<\/h3>\n<p>For differential signals that appear in pairs, the traces should be routed in parallel, and the use of vias should be minimized to ensure impedance matching.<\/p>\n<h2>6. Is Manual Layout Still Necessary? The Limits of EDA Automatic Layout<\/h2>\n<p>Today\u2019s EDA tools all include automatic placement and routing features, but what truly determines whether a board is user-friendly is precisely what automated tools cannot handle. Understanding the division of labor between the two will help you avoid wasting time on the wrong things:<\/p>\n<ul>\n<li><strong>What the tool excels at<\/strong>: Batch fanout according to rules, length tuning, DRC checks for spacing and line width, copper fill, and copper trimming.<\/li>\n<li><strong>Requires manual decision-making<\/strong>: Circuit module partitioning; methods for separating analog and digital ground planes; power paths and the placement of decoupling capacitors; the relative positioning of heat-generating components and thermosensitive components; and the coordination between connectors and the circuit layout.<\/li>\n<li><strong>The Most Effort-Saving Workflow<\/strong>: First, manually place and lock (fix) the key components and partitions; then let the tool handle the remaining routine tasks; finally, manually review the DRC and DFM checklists.<\/li>\n<\/ul>\n<p>In other words, automatic routing ensures \u201cconnectivity,\u201d while manual layout ensures \u201cusability, ease of implementation, and ease of maintenance.\u201d In high-speed and RF design, the latter is virtually the deciding factor between success and failure. See<a href=\"\/en\/blog\/pcb-layout-routing-design-rules\/\">Basic Rules for PCB Routing: Design Guidelines and Best Practices<\/a>\u3002<\/p>\n<h2>7. Key Design Parameters: Line Width, Spacing, Pads, and Vias<\/h2>\n<p>Once the layout is finalized, the following set of parameters determines whether this board can be manufactured using standard processes and whether the resulting board will be stable. The first table provides reference values for current-carrying capacity under conditions of 1 oz (35 \u03bcm) copper thickness, outer layers, and a temperature rise of 10 \u00b0C:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Wire Width<\/th>\n<th>Cross-sectional Area (1 oz)<\/th>\n<th>Reference Current-Carrying Capacity (10 \u00b0C Temperature Rise)<\/th>\n<th>Typical Applications<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>6 mil \/ 0.15 mm<\/td>\n<td>Approximately 0.005 mm\u00b2<\/td>\n<td>Approximately 0.35 A<\/td>\n<td>Signal Lines (Fine-Pitch)<\/td>\n<\/tr>\n<tr>\n<td>10 mil \/ 0.25 mm<\/td>\n<td>Approximately 0.009 mm\u00b2<\/td>\n<td>Approximately 0.55 A<\/td>\n<td>Standard Signal Cables<\/td>\n<\/tr>\n<tr>\n<td>15 mil \/ 0.38 mm<\/td>\n<td>Approximately 0.013 mm\u00b2<\/td>\n<td>Approx. 0.80 A<\/td>\n<td>Standard Signals and Low-Current Power Supplies<\/td>\n<\/tr>\n<tr>\n<td>20 mil \/ 0.50 mm<\/td>\n<td>Approximately 0.018 mm\u00b2<\/td>\n<td>Approximately 1.05 A<\/td>\n<td>Power Distribution Line<\/td>\n<\/tr>\n<tr>\n<td>50 mil \/ 1.27 mm<\/td>\n<td>Approximately 0.044 mm\u00b2<\/td>\n<td>Approx. 2.30 A<\/td>\n<td>Main Power Line<\/td>\n<\/tr>\n<tr>\n<td>100 mil \/ 2.54 mm<\/td>\n<td>Approximately 0.089 mm\u00b2<\/td>\n<td>Approx. 4.00 A<\/td>\n<td>High-current paths (recommended to be supplemented with copper plating)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The second table lists the minimum parameters that can be used directly under standard manufacturing processes; confirmation of capability with the PCB manufacturer is required only when these limits are exceeded:<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Project<\/th>\n<th>General Skills<\/th>\n<th>Note<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Minimum Line Width \/ Line Spacing<\/td>\n<td>6 mil \/ 6 mil (0.15 mm)<\/td>\n<td>Values below this require precision manufacturing, which increases costs.<\/td>\n<\/tr>\n<tr>\n<td>Recommended Line Width \/ Line Spacing<\/td>\n<td>8\u201310 mil<\/td>\n<td>Balancing Yield and Cost<\/td>\n<\/tr>\n<tr>\n<td>Minimum Annular Ring<\/td>\n<td>4 mil (0.10 mm)<\/td>\n<td>The smaller the size, the more prone it is to hole breakage; BGAs must be tested to confirm this.<\/td>\n<\/tr>\n<tr>\n<td>Minimum Hole Diameter for Mechanical Drilling<\/td>\n<td>0.20 mm (8 mil)<\/td>\n<td>Recommended pore-to-plate-thickness ratio: \u2265 1:8<\/td>\n<\/tr>\n<tr>\n<td>Minimum Hole Diameter for Laser Drilling<\/td>\n<td>0.075\u20130.10 mm<\/td>\n<td>HDI blind vias; see the Process Capabilities page<\/td>\n<\/tr>\n<tr>\n<td>Minimum Clearance from the Edge of the Panel<\/td>\n<td>\u2265 0.30 mm<\/td>\n<td>V-CUT and Allowances for Edge Milling<\/td>\n<\/tr>\n<tr>\n<td>Screen-Printed Text Height<\/td>\n<td>\u2265 0.80 mm<\/td>\n<td>If the value is lower than this, the print will be unclear.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-8865\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/basic-rules-for-pcb-layout-and-wiring.jpg\" alt=\"Basic Rules for PCB Layout and Routing\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/basic-rules-for-pcb-layout-and-wiring.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/basic-rules-for-pcb-layout-and-wiring-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/basic-rules-for-pcb-layout-and-wiring-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/basic-rules-for-pcb-layout-and-wiring-768x432.jpg 768w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>For vias, standard through-holes (PTH) should preferably be 0.30\/0.60 mm (hole\/board) or 0.25\/0.50 mm; Hole diameters below 0.20 mm place higher demands on drilling and plating capabilities and should only be used when board density leaves no other choice; the thickness-to-diameter ratio must be confirmed with the board manufacturer in advance. For more capability limits, see<a href=\"\/en\/capabilities\/\">Process Capabilities<\/a>\u3002<\/p>\n<h2>8. Challenges and Solutions for Single-Sided Boards<\/h2>\n<h3>8.1. Route the traces around obstacles whenever possible<\/h3>\n<p>In single-sided PCB design, it is common for traces to encounter situations where they cannot be routed through. One solution is to route the traces around the obstruction as much as possible, unless high-frequency signal transmission is involved.<\/p>\n<h3>8.2. Reducing Pad Width<\/h3>\n<p>In some cases, it is actually possible to route at least one narrow trace between adjacent pads, which requires appropriately reducing the width of the pads.<\/p>\n<h3>8.3. Adjusting the Wiring Order of Component Pins<\/h3>\n<p>Sometimes, you can adapt the layout by adjusting the order in which the connections between the various pins of a component are routed.<\/p>\n<h3>8.4. Connecting with a 0-\u03a9 Resistor<\/h3>\n<p>If necessary, a 0\u03a9 resistor can be used to bridge the connection, and multiple wires can be connected below. This method is both aesthetically pleasing and practical, and is a recommended solution.<\/p>\n<p>These four methods should be considered in order of priority; we recommend trying them in the sequence listed below, as the earlier methods involve lower costs:<\/p>\n<ol>\n<li><strong>Go around first<\/strong>: Adjusting the route incurs no cost, so this should be the first option to try.<\/li>\n<li><strong>Adjust the pin order again<\/strong>: Provided that the circuit design allows it, swap pins of the same type (such as resistor arrays and logic gates); this can be resolved by modifying the schematic.<\/li>\n<li><strong>Rear-mounted pad<\/strong>: Slightly reduce the width of non-critical pads to create space; ensure that soldering yield is not affected.<\/li>\n<li><strong>Finally, add the jumper<\/strong>: Connecting the components with a 0\u03a9 resistor and adding an extra surface-mount process for the material is a fallback solution.<\/li>\n<\/ol>\n<h2>9. Basic Requirements for Wiring<\/h2>\n<h3>9.1. Wire Width<\/h3>\n<p>The minimum trace width should be 10 mil (0.254 mm). Generally, trace widths range from 15 to 25 mil (0.381 to 0.635 mm).<\/p>\n<h3>9.2. Distance Between Wires<\/h3>\n<p>The minimum spacing between traces is 8 mil (0.2032 mm). In denser layouts, the spacing between traces can be as small as 8 mil; however, in general, a spacing of at least 10 mil (0.3048 mm) is recommended.<\/p>\n<h3>9.3. Outer Diameter of the Pad<\/h3>\n<p>The pads should be as large as possible and preferably oval in shape. The pad apertures should be small enough to ensure better alignment during the board fabrication and drilling stages.<\/p>\n<p>The following are the most common mistakes made during the routing phase\u2014and the ones most easily overlooked in DRC checks:<\/p>\n<ul>\n<li><strong>Using Pads as Traces<\/strong>: Treating the copper foil or pad as part of the wire causes heat to dissipate too quickly during soldering, resulting in cold solder joints.<\/li>\n<li><strong>Line Width Sudden Change<\/strong>: When a cable in the same circuit suddenly transitions from a thick section to a thin section, the voltage drop is concentrated in the thin section, resulting in significant heat generation under high current conditions.<\/li>\n<li><strong>The horizon is split<\/strong>: When a long slot is cut into the ground plane to route a single signal line, the return path is forced to take a detour, causing EMI to increase.<\/li>\n<li><strong>Screen-Printed Solder Pads<\/strong>\uff1a\u4e1d\u5370\u6cb9\u58a8\u843d\u5728\u710a\u76d8\u4e0a\u4f1a\u5f71\u54cd\u53ef\u710a\u6027\uff0c\u6295\u677f\u524d\u9700\u7edf\u4e00\u68c0\u67e5\u5e76\u5173\u95ed\u8be5\u9879\u8f93\u51fa\u3002<\/li>\n<\/ul>\n<h2>10. \u6563\u70ed\u4e0e\u8f7d\u6d41\uff1a\u94dc\u539a\u3001\u94fa\u94dc\u4e0e\u8fc7\u5b54\u9635\u5217<\/h2>\n<p>\u53d1\u70ed\u4e0e\u538b\u964d\u662f\u786c\u4ef6\u8fd4\u5de5\u7684\u4e24\u5927\u6765\u6e90\uff0c\u5e03\u5c40\u9636\u6bb5\u5c31\u80fd\u63d0\u524d\u5316\u89e3\u5927\u534a\uff1a<\/p>\n<ul>\n<li><strong>\u94dc\u539a\u9009\u62e9<\/strong>\uff1a\u5e38\u89c4 1 oz\uff0835 \u03bcm\uff09\uff1b\u7535\u6e90\u677f\u3001\u7535\u673a\u9a71\u52a8\u3001LED \u5e38\u7528 2 oz\uff0870 \u03bcm\uff09\uff1b3 oz \u53ca\u4ee5\u4e0a\u5c5e\u4e8e\u539a\u94dc\u5de5\u827a\uff0c\u8680\u523b\u540e\u7684\u7ebf\u5bbd\u8865\u507f\u9700\u5355\u72ec\u786e\u8ba4\u3002<\/li>\n<li><strong>\u94fa\u94dc\u4e0e\u6563\u70ed\u710a\u76d8<\/strong>\uff1a\u53d1\u70ed\u5668\u4ef6\u5e95\u90e8\u5f00\u7a97\u9732\u94dc\u5e76\u52a0\u6563\u70ed\u8fc7\u5b54\u9635\u5217\uff0c\u5b54\u5f84 0.30 mm\u3001\u95f4\u8ddd 1.0\u20131.2 mm\uff0c\u628a\u70ed\u91cf\u5bfc\u5230\u5185\u5c42\u6216\u80cc\u9762\u94dc\u76ae\u3002<\/li>\n<li><strong>\u8fc7\u5b54\u6570\u91cf\u4f30\u7b97<\/strong>\uff1a\u5927\u7535\u6d41\u6362\u5c42\u65f6\uff0c\u5355\u4e2a 0.30 mm \u8fc7\u5b54\u6309\u7ea6 0.5\u20131 A \u4fdd\u5b88\u53d6\u503c\uff0c\u5b81\u53ef\u591a\u6253\u51e0\u4e2a\u4e5f\u4e0d\u8981\u8d4c\u5355\u70b9\u3002<\/li>\n<li><strong>\u5668\u4ef6\u95f4\u8ddd<\/strong>\uff1a\u7535\u89e3\u7535\u5bb9\u3001\u7535\u611f\u7b49\u70ed\u654f\u4ef6\u4e0e\u53d1\u70ed\u6e90\u4fdd\u6301 3 mm \u4ee5\u4e0a\uff0c\u5fc5\u8981\u65f6\u5f00\u9694\u70ed\u69fd\u3002<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1448\" height=\"815\" class=\"alignnone size-large wp-image-8871\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thermal-analysis-and-modeling-in-pcb-design.jpg\" alt=\"The Importance of Thermal Analysis and Modeling in PCB Design\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thermal-analysis-and-modeling-in-pcb-design.jpg 1448w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thermal-analysis-and-modeling-in-pcb-design-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thermal-analysis-and-modeling-in-pcb-design-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/thermal-analysis-and-modeling-in-pcb-design-768x432.jpg 768w\" sizes=\"auto, (max-width: 1448px) 100vw, 1448px\" \/><\/p>\n<p>\u7535\u6e90\u4e0e\u5730\u7684\u5904\u7406\u8fd8\u8981\u914d\u5408\u677f\u6750\u7684\u8010\u538b\u4e0e\u8010\u70ed\u7b49\u7ea7\u4e00\u8d77\u8003\u8651\uff0c\u9009\u6750\u903b\u8f91\u53ef\u53c2\u8003<a href=\"\/en\/blog\/pcb-circuit-board-materials\/\">PCB Material Properties to Consider in Circuit Board Design<\/a>\u3002<\/p>\n<h2>11. \u6295\u677f\u524d\u7684\u81ea\u68c0\u6e05\u5355<\/h2>\n<p>\u628a\u4e0b\u9762\u516b\u9879\u5728\u53d1\u677f\u524d\u8fc7\u4e00\u904d\uff0c\u80fd\u6321\u6389\u5927\u90e8\u5206\u56e0\u4e3a\u300c\u8bbe\u8ba1\u80fd\u753b\u51fa\u6765\u4f46\u505a\u4e0d\u51fa\u6765\u300d\u5bfc\u81f4\u7684\u8fd4\u5de5\uff1a<\/p>\n<ol>\n<li>DRC \u5168\u9879\u6e05\u96f6\uff0c\u4e14\u89c4\u5219\u5df2\u6309\u76ee\u6807\u677f\u5382\u7684\u5de5\u827a\u80fd\u529b\u8bbe\u7f6e\uff08\u4e0d\u662f\u8f6f\u4ef6\u9ed8\u8ba4\u503c\uff09\u3002<\/li>\n<li>\u6240\u6709\u5668\u4ef6\u5c01\u88c5\u4e0e\u5b9e\u7269\u6838\u5bf9\u8fc7\uff0c\u7279\u522b\u662f\u6781\u6027\u3001\u5f15\u811a 1 \u6807\u8bc6\u4e0e\u710a\u76d8\u5c3a\u5bf8\u3002<\/li>\n<li>\u5c42\u53e0\u7ed3\u6784\u3001\u677f\u539a\u3001\u963b\u6297\u8981\u6c42\u4e0e\u677f\u6750\u578b\u53f7\u5df2\u5199\u5165\u5236\u677f\u8bf4\u660e\u3002<\/li>\n<li>\u7535\u6e90\u4e0e\u5730\u8def\u5f84\u7684\u8f7d\u6d41\u6838\u7b97\u5b8c\u6210\uff0c\u5927\u7535\u6d41\u8def\u5f84\u5df2\u94fa\u94dc\u6216\u52a0\u539a\u3002<\/li>\n<li>\u53bb\u8026\u7535\u5bb9\u7d27\u8d34\u7535\u6e90\u5f15\u811a\uff0c\u56de\u6d41\u8def\u5f84\u8fde\u7eed\u3001\u672a\u88ab\u5206\u5272\u5730\u5207\u65ad\u3002<\/li>\n<li>\u4e1d\u5370\u4f4d\u53f7\u4e0d\u88ab\u710a\u76d8\u906e\u6321\uff0c\u677f\u8fb9\u7981\u5e03\u533a\u4e0e\u5b89\u88c5\u5b54\u95f4\u8ddd\u6ee1\u8db3\u8981\u6c42\u3002<\/li>\n<li>Gerber \u4e0e\u94bb\u5b54\u6587\u4ef6\u9f50\u5168\uff0c\u5c42\u522b\u547d\u540d\u6b63\u786e\uff0c\u542b\u677f\u5916\u5f62\u5c42\u3002<\/li>\n<li>\u62fc\u677f\u65b9\u5f0f\u3001\u5de5\u827a\u8fb9\u3001V-CUT \u6216\u90ae\u7968\u5b54\u5df2\u4e0e\u677f\u5382\u786e\u8ba4\u3002<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1080\" height=\"608\" class=\"alignnone size-large wp-image-8721\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/high-speed-pcb-design-via.jpg\" alt=\"Considerations for Via Design in High-Speed PCB Design\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/high-speed-pcb-design-via.jpg 1080w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/high-speed-pcb-design-via-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/high-speed-pcb-design-via-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/high-speed-pcb-design-via-768x432.jpg 768w\" sizes=\"auto, (max-width: 1080px) 100vw, 1080px\" \/><\/p>\n<h2>12. Conclusion<\/h2>\n<p>\u6210\u529f\u7684PCB\u8bbe\u8ba1\u6e90\u4e8e\u827a\u672f\u4e0e\u79d1\u5b66\u7684\u5b8c\u7f8e\u7ed3\u5408\u3002\u9075\u5faa\u8fd9\u4e9b\u57fa\u672c\u539f\u5219\uff0c\u5c06\u6709\u52a9\u4e8e\u521b\u5efa\u51fa\u529f\u80fd\u5f3a\u5927\u3001\u6027\u80fd\u5353\u8d8a\u7684\u7535\u8def\u677f\uff0c\u63d0\u9ad8\u5236\u4f5c\u7684\u53ef\u884c\u6027\uff0c\u51cf\u5c11\u4e0d\u5fc5\u8981\u7684\u9ebb\u70e6\u3002\u6700\u7ec8\uff0c\u4e00\u4e2a\u7cbe\u5fc3\u8bbe\u8ba1\u7684PCB\u5c06\u4e3a\u7535\u5b50\u9879\u76ee\u7684\u6210\u529f\u63d0\u4f9b\u575a\u5b9e\u7684\u57fa\u7840\u3002<\/p>\n<h2>13. \u5e38\u89c1\u95ee\u9898\u89e3\u7b54<\/h2>\n<h3>1. PCB\u8bbe\u8ba1\u4e2d\u6700\u5e38\u89c1\u7684\u95ee\u9898\u662f\u4ec0\u4e48\uff1f<\/h3>\n<p>\u6700\u5e38\u89c1\u7684\u95ee\u9898\u4e4b\u4e00\u662f\u5bfc\u7ebf\u65e0\u6cd5\u8d70\u901a\uff0c\u7279\u522b\u662f\u5728\u5355\u9762\u677f\u8bbe\u8ba1\u4e2d\u3002<\/p>\n<h3>2. \u5982\u4f55\u89e3\u51b3\u5bfc\u7ebf\u65e0\u6cd5\u8d70\u901a\u7684\u95ee\u9898\uff1f<\/h3>\n<p>\u53ef\u4ee5\u5c1d\u8bd5\u7ed5\u884c\u65e0\u6cd5\u8d70\u901a\u7684\u5bfc\u7ebf\uff0c\u51cf\u5c0f\u710a\u76d8\u5bbd\u5ea6\uff0c\u8c03\u6574\u5143\u5668\u4ef6\u7ba1\u811a\u8fde\u7ebf\u987a\u5e8f\uff0c\u6216\u8005\u4f7f\u75280\u03a9\u7535\u963b\u8de8\u63a5\u3002<\/p>\n<h3>3. PCB\u8bbe\u8ba1\u4e2d\u662f\u5426\u9700\u8981\u8003\u8651\u963b\u6297\u5339\u914d\uff1f<\/h3>\n<p>\u662f\u7684\uff0c\u5bf9\u4e8e\u6210\u5bf9\u51fa\u73b0\u7684\u5dee\u5206\u4fe1\u53f7\uff0c\u5e94\u7279\u522b\u6ce8\u610f\u963b\u6297\u5339\u914d\u3002<\/p>\n<h3>4. \u4e3a\u4ec0\u4e48\u8981\u5c06\u710a\u76d8\u5f62\u72b6\u8bbe\u8ba1\u6210\u692d\u5706\u5f62\uff1f<\/h3>\n<p>\u692d\u5706\u5f62\u710a\u76d8\u5177\u6709\u66f4\u597d\u7684\u5236\u677f\u548c\u94bb\u5b54\u5bf9\u51c6\u6027\uff0c\u6709\u52a9\u4e8e\u63d0\u9ad8\u5236\u4f5c\u8d28\u91cf\u3002<\/p>\n<h3>5. \u6709\u6ca1\u6709\u63a8\u8350\u7684\u5bfc\u7ebf\u5bbd\u5ea6\u548c\u7ebf\u95f4\u8ddd\uff1f<\/h3>\n<p>\u5bfc\u7ebf\u5bbd\u5ea6\u6700\u5c0f\u5e94\u4e3a10mil\uff080.254mm\uff09\uff0c\u7ebf\u95f4\u8ddd\u6700\u5c0f\u5e94\u4e3a8mil\uff080.2032mm\uff09\uff0c\u4f46\u5728\u4e00\u822c\u60c5\u51b5\u4e0b\u5efa\u8bae\u66f4\u5927\u4e00\u4e9b\u3002<\/p>\n<h3>6. \u5bfc\u7ebf\u5bbd\u5ea6\u6309\u4ec0\u4e48\u6807\u51c6\u53d6\uff1f\u53ea\u770b\u8f7d\u6d41\u591f\u4e0d\u591f\uff1f<\/h3>\n<p>\u4e0d\u591f\u3002\u5bfc\u7ebf\u5bbd\u5ea6\u8981\u540c\u65f6\u6ee1\u8db3\u4e09\u4e2a\u6761\u4ef6\uff1a\u8f7d\u6d41\u80fd\u529b\uff08\u6309\u94dc\u539a\u4e0e\u5141\u8bb8\u6e29\u5347\u6838\u7b97\uff09\u3001\u5de5\u827a\u80fd\u529b\uff08\u4e0d\u4f4e\u4e8e\u677f\u5382\u6700\u5c0f\u7ebf\u5bbd\uff09\u548c\u963b\u6297\u8981\u6c42\uff08\u9ad8\u901f\u4fe1\u53f7\u6309\u53e0\u6784\u53cd\u7b97\u7ebf\u5bbd\uff09\u3002\u4e09\u6761\u91cc\u53d6\u6700\u4e25\u683c\u7684\u4e00\u4e2a\u3002\u5e38\u89c4\u4fe1\u53f7\u7ebf\u6309 8\u201310 mil \u8d77\u6b65\u57fa\u672c\u4e0d\u4f1a\u51fa\u9519\uff0c\u7535\u6e90\u4e0e\u5730\u5219\u5fc5\u987b\u5355\u72ec\u6838\u7b97\u7535\u6d41\u3002<\/p>\n<h3>7. \u4e3a\u4ec0\u4e48\u7981\u6b62\u76f4\u89d2\u8d70\u7ebf\uff1f<\/h3>\n<p>\u76f4\u89d2\u5904\u7ebf\u5bbd\u5b9e\u9645\u53d8\u5bbd\uff0c\u963b\u6297\u51fa\u73b0\u4e0d\u8fde\u7eed\uff0c\u9ad8\u901f\u4fe1\u53f7\u4f1a\u4ea7\u751f\u53cd\u5c04\uff1b\u540c\u65f6\u76f4\u89d2\u5916\u4fa7\u5728\u8680\u523b\u65f6\u5bb9\u6613\u5f62\u6210\u9510\u89d2\u6b8b\u7559\uff0c\u957f\u671f\u53ef\u9760\u6027\u8f83\u5dee\u3002\u6539\u7528 45\u00b0 \u6216\u5706\u5f27\u8d70\u7ebf\u540e\uff0c\u963b\u6297\u8fc7\u6e21\u5e73\u7f13\uff0c\u4fe1\u53f7\u5b8c\u6574\u6027\u4e0e\u53ef\u5236\u9020\u6027\u90fd\u66f4\u597d\u3002GHz \u7ea7\u4fe1\u53f7\u5efa\u8bae\u76f4\u63a5\u7528\u5706\u5f27\u3002<\/p>\n<h3>8. \u5355\u9762\u677f\u8d70\u4e0d\u901a\u65f6\uff0c\u6539\u7528\u53cc\u9762\u677f\u7684\u6210\u672c\u4f1a\u589e\u52a0\u591a\u5c11\uff1f<\/h3>\n<p>\u540c\u7b49\u5c3a\u5bf8\u4e0e\u5de5\u827a\u4e0b\uff0c\u53cc\u9762\u677f\u4ef7\u683c\u901a\u5e38\u6bd4\u5355\u9762\u677f\u9ad8\u51fa 30%\u201360%\uff0c\u56e0\u4e3a\u591a\u4e86\u538b\u5408\u3001\u6c89\u94dc\u4e0e\u56fe\u5f62\u7535\u9540\u5de5\u5e8f\u3002\u4f46\u5982\u679c\u5355\u9762\u677f\u9700\u8981\u5927\u91cf\u8df3\u7ebf\uff080\u03a9 \u7535\u963b\u6216\u98de\u7ebf\uff09\u624d\u80fd\u5e03\u901a\uff0c\u7efc\u5408\u7b97\u4e0a\u7269\u6599\u3001\u88c5\u914d\u4e0e\u6545\u969c\u7387\uff0c\u53cc\u9762\u677f\u53cd\u800c\u66f4\u5212\u7b97\u3002\u8d70\u7ebf\u5bc6\u5ea6\u8d85\u8fc7\u5355\u9762\u53ef\u5bb9\u7eb3\u7684\u516b\u6210\u65f6\uff0c\u5c31\u8be5\u8003\u8651\u6539\u53cc\u9762\u677f\u3002<\/p>\n<p><strong>Related Recommendations<\/strong>\uff1a<a href=\"\/en\/blog\/pcb-circuit-board-materials\/\">PCB Material Properties to Consider in Circuit Board Design<\/a> \u00b7 <a href=\"\/en\/blog\/basic-rules-for-pcb-layout-and-wiring\/\">Basic Rules for PCB Layout and Routing<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>\u5728\u73b0\u4ee3\u7535\u5b50\u9886\u57df\uff0cPCB\uff08Printed Circuit Board\uff0c\u5370\u5237\u7535\u8def\u677f\uff09\u7684\u8bbe\u8ba1\u626e\u6f14\u7740\u81f3\u5173\u91cd\u8981\u7684\u89d2\u8272\u3002\u8bbe [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":6445,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"What principles should be followed when manually designing a PCB? Placement of components as close as possible, manufacturing considerations, and thermal management","description":"What are the principles of hand-drawn PCB layout? Explain the basic layout rules, such as placing components as close as possible, ensuring a neat and organized appearance, taking manufacturing processes into account, considering heat dissipation, and handling special components. Checking your work against the checklist in this article can help you avoid rework on your first prototype."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[405,26],"tags":[],"class_list":["post-1918","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pcb-design","category-blog"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/1918","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=1918"}],"version-history":[{"count":6,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/1918\/revisions"}],"predecessor-version":[{"id":20089,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/1918\/revisions\/20089"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media\/6445"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=1918"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=1918"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=1918"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}