{"id":1828,"date":"2026-10-05T14:00:00","date_gmt":"2026-10-05T06:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=1828"},"modified":"2026-10-11T23:59:27","modified_gmt":"2026-10-11T15:59:27","slug":"cam350-layer-editing","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/cam350-layer-editing\/","title":{"rendered":"Introduction to Layer Editing in the CAM350 PCB Design Tool"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<p>With the widespread use of small, lightweight, thin, and high-performance components in electronic products, assembly technology has become crucial. At the same time, the relationship between assembly materials and environmental protection has grown increasingly close. This article will explore<a href=\"\/en\/pcba-capabilities\/\">Electronics Assembly<\/a>Some key issues in this field involve material selection, environmental challenges, and the development of new technologies.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"350\" class=\"alignnone size-large wp-image-9520\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/specification-and-requirements-for-screen-printing-layer-of-pcb-board.jpg\" alt=\"Specifications and Requirements for the Screen-Printed Layer of PCBs\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/specification-and-requirements-for-screen-printing-layer-of-pcb-board.jpg 600w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/specification-and-requirements-for-screen-printing-layer-of-pcb-board-300x175.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><\/p>\n<h2>Three Main Areas of Environmental Regulations for Electronic Assembly<\/h2>\n<h2>The Importance of Material Selection<\/h2>\n<p>Since 1995, certain cleaning agents used to clean substrate materials during assembly\u2014such as Freon and trichloroethane\u2014have been explicitly banned by the international community because they damage the Earth\u2019s ozone layer. In addition, materials used in some assembly processes\u2014such as lead (Pb), volatile organic compounds (VOCs), and resin-based circuit boards\u2014also pose environmental challenges. When it comes to material selection, environmental considerations have become a factor that cannot be ignored.<\/p>\n<p>Assembly technologies based on Sn-Pb soldering, such as fine-pitch QFP (Quad Flat Package), have made significant progress in single-pass reflow technology. However, transitioning to lead-free soldering now requires a comprehensive reassessment of various aspects, including the composition of solder materials, manufacturing processes, and reliability\u2014a daunting task.<\/p>\n<h2>Advanced: How Environmental Requirements Influence Material Selection<\/h2>\n<p>The original text points out that since 1995, cleaning agents such as Freon and trichloroethane have been explicitly banned by the international community; materials such as lead, volatile organic compounds, and resin-based circuit boards also pose environmental challenges, making environmental considerations an indispensable factor in material selection. This shift has expanded the evaluation of materials beyond mere performance and cost to include the dimension of compliance.<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Controlled Materials<\/th>\n<th>Environmental issues highlighted in the original text<\/th>\n<th>Corresponding alternative directions<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Freon Cleaner<\/td>\n<td>Depletion of the ozone layer<\/td>\n<td>Switch to alternatives such as HCFCs, HFCs, PFCs, and IPA<\/td>\n<\/tr>\n<tr>\n<td>Trichloroethane<\/td>\n<td>Both are classified as prohibited cleaning agents<\/td>\n<td>To be phased out along with Freon<\/td>\n<\/tr>\n<tr>\n<td>Lead (Pb)<\/td>\n<td>Heavy Metal Pollution<\/td>\n<td>The Shift to Lead-Free Soldering and Sn-Based Alloys<\/td>\n<\/tr>\n<tr>\n<td>VOC<\/td>\n<td>Emissions Harm the Environment and Human Health<\/td>\n<td>Switch to a closed-loop recycling system and water-soluble materials<\/td>\n<\/tr>\n<tr>\n<td>Resin Series Wiring Boards<\/td>\n<td>Facing similar environmental challenges<\/td>\n<td>Recyclability and degradability must be evaluated.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The most important thing to keep in mind is<strong>\"Substitutes themselves may also give rise to new environmental problems.\"<\/strong>. The original text explicitly states that alternatives such as HCFCs, HFCs, PFCs, and IPA still pose environmental concerns, which is why research and development of third-generation CFCs is still ongoing. This indicates that switching to environmentally friendly alternatives is often not a one-time transition, but rather an ongoing process of iteration; therefore, when selecting alternatives, it is important to allow for the possibility of future adjustments.<\/p>\n<ul>\n<li><strong>First, check the exclusion list<\/strong>: Re-evaluate each material currently in use;<\/li>\n<li><strong>Substitutes Must Undergo Environmental Review<\/strong>: The original text points out that they also have problems;<\/li>\n<li><strong>The Reliability of the Transition to Lead-Free Must Be Re-evaluated<\/strong>: The original text refers to it as a daunting task;<\/li>\n<li><strong>Compliance and performance must both be met<\/strong>: It is not enough to satisfy just one of them.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"800\" height=\"450\" class=\"alignnone size-large wp-image-8797\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/difficulties-and-key-process-control-in-manufacturing-high-rise-pcb.jpg\" alt=\"Challenges in the Manufacturing of High-Layer-Count Printed Circuit Boards and Key Control Points for Production Processes\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/difficulties-and-key-process-control-in-manufacturing-high-rise-pcb.jpg 800w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/difficulties-and-key-process-control-in-manufacturing-high-rise-pcb-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/difficulties-and-key-process-control-in-manufacturing-high-rise-pcb-768x432.jpg 768w\" sizes=\"auto, (max-width: 800px) 100vw, 800px\" \/><\/p>\n<p>See \"Lead-Free Process\"<a href=\"\/en\/blog\/lead-free-process-pcb-manufacturing\/\">The Application of Lead-Free Processes in PCB Manufacturing<\/a>; For lead-free reliability analysis, see<a href=\"\/en\/blog\/hdi-lead-free-digital-product-reliability-analysis\/\">Reliability Analysis and Solutions for Lead-Free HDI Digital Products<\/a>\u3002<\/p>\n<h2>Challenges and Solutions for Lead-Free Soldering<\/h2>\n<p>The challenges associated with lead-free soldering include:<\/p>\n<ol>\n<li><strong>Development of Alternative Welding Fluxes:<\/strong> Finding solder alternatives to lead is a critical task. These solders must meet multiple requirements, including low cost, a melting point close to that of Sn-Pb, superior electrical, mechanical, and chemical properties, compatibility with existing processes and equipment, and suitability for fine patterns.<\/li>\n<li><strong>New Assembly Techniques:<\/strong> Lead-free soldering requires new assembly techniques and equipment. This means reevaluating existing joining techniques and developing new methods.<\/li>\n<\/ol>\n<h2>Advanced: Why Lead-Free Soldering Is a Challenging Task<\/h2>\n<p>The original text categorizes the challenges of lead-free soldering into two types: the development of alternative fluxes, and new assembly technologies and equipment. The former requires low cost, a melting point close to that of Sn-Pb, superior electromechanical and chemical properties, compatibility with existing process equipment, and suitability for fine patterns; the latter implies a reassessment of existing joining technologies.<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Evaluation Dimensions<\/th>\n<th>Requirements in the original text<\/th>\n<th>The Cost of Switching<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Cost<\/td>\n<td>Low-cost<\/td>\n<td>Alloy Formulations and the Supply Chain Need to Be Rebuilt<\/td>\n<\/tr>\n<tr>\n<td>Melting Point<\/td>\n<td>Close to Sn-Pb<\/td>\n<td>A high melting point will increase the welding temperature.<\/td>\n<\/tr>\n<tr>\n<td>Electrical Properties<\/td>\n<td>Superior<\/td>\n<td>Continuity and reliability testing must be repeated.<\/td>\n<\/tr>\n<tr>\n<td>Mechanical Properties<\/td>\n<td>Superior<\/td>\n<td>The strength and fatigue life of the welds must be retested.<\/td>\n<\/tr>\n<tr>\n<td>Process Compatibility<\/td>\n<td>Compatible with existing equipment<\/td>\n<td>The furnace temperature curve and the flux must be adjusted simultaneously.<\/td>\n<\/tr>\n<tr>\n<td>Detailed Graphics<\/td>\n<td>Suitable for detailed graphics<\/td>\n<td>Risks Associated with Fine-Pitch QFPs and Other Devices Are on the Rise<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The real challenge lies in<strong>\"The Ripple Effects of Melting Point Shift\"<\/strong>. The original text mentions that significant progress has been made in one-pass reflow technology for fine-pitch QFPs based on Sn-Pb soldering; however, after switching to lead-free solder, the composition of the solder, the process, and reliability must all be reevaluated. An increase in melting point will simultaneously affect the oven temperature profile, the device\u2019s thermal margin, and the appearance of the solder joints\u2014this cannot be resolved simply by changing the alloy.<\/p>\n<ul>\n<li><strong>First, evaluate the device's thermal margin.<\/strong>: An increase in melting point will reduce the allowance;<\/li>\n<li><strong>Adjust the furnace temperature profile again<\/strong>: Compatible with the alloy's properties;<\/li>\n<li><strong>The reliability of the solder joints must be retested.<\/strong>: Emphasis in the original text;<\/li>\n<li><strong>Fine-pitch devices pose the highest risk<\/strong>: Requires thorough verification.<\/li>\n<\/ul>\n<ol>\n<li>Determine the melting point and process window of the alternative alloy;<\/li>\n<li>Verify the maximum temperature rating of the components on the board;<\/li>\n<li>Adjust the reflow profile and perform a first-article verification;<\/li>\n<li>Re-test the strength and appearance of the solder joints;<\/li>\n<li>Mass production will begin after the reliability tests are completed.<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"716\" height=\"550\" class=\"alignnone size-large wp-image-5377\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/pcba.webp\" alt=\"pcba\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/pcba.webp 716w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/pcba-300x230.webp 300w\" sizes=\"auto, (max-width: 716px) 100vw, 716px\" \/><\/p>\n<p>For an analysis of welding defects, see<a href=\"\/en\/blog\/smt-soldering-defects-solutions\/\">Analysis of SMT Soldering Defects and Solutions<\/a>; For information on distinguishing between leaded and lead-free solder joints, see<a href=\"\/en\/blog\/distinguish-whether-the-solder-joints-on-the-pcba-board-are-lead-or-lead-free\/\">How to Determine Whether Solder Joints on a PCBA Board Are Leaded or Lead-Free<\/a>\u3002<\/p>\n<h2>Developments in New Assembly Materials and Technologies<\/h2>\n<h3>1. Completely phase out the use of Freon<\/h3>\n<p>Freon is a cleaning agent used for circuit boards in assembly, but it damages the Earth\u2019s ozone layer and contributes to global warming. The international community has restricted its use and banned Freon. It has been replaced by alternatives such as HCFCs (transitional compounds), HFCs (hydrofluorocarbons), PFCs (perfluorometaborane), IPA (isopropyl alcohol), propanol, and hexyl acetate. However, these alternatives also pose environmental concerns, so research and development of third-generation CFCs is actively underway.<\/p>\n<h3>2. Lead-Free Soldering Is on the Agenda<\/h3>\n<p>Due to the heavy metal contamination\u2014including lead\u2014caused by Sn-Pb soldering, the development of lead-free soldering technologies has become urgent. Researchers are actively developing Sn-based alloys, such as Sn-Ag alloys, to replace traditional Sn-Pb soldering. These alloys have already begun to be used in electronic products, where they maintain good soldering quality while improving environmental sustainability.<\/p>\n<h3>3. Development of Solderless Connection Technology<\/h3>\n<p>As electronic components continue to shrink in size and pin pitches become increasingly narrow, traditional soldering techniques can no longer meet the demands. Consequently, solder-free bonding technologies have begun to attract attention. These technologies include methods such as ultrasonic bonding and hot-press bonding, which allow IC chips to be bonded directly to substrate electrodes without the use of solder. This not only simplifies the process but also reduces the number of cleaning steps.<\/p>\n<h3>4. Control the Use and Emissions of VOCs<\/h3>\n<p>Controlling the use and emissions of volatile organic compounds (VOCs) is also an important aspect of environmental protection. This includes restricting the use of VOCs to enclosed or recoverable systems and developing new materials, such as water-soluble fluxes and flux-free resins, to reduce VOC usage. However, research on VOC control is still ongoing, as these compounds are diverse and exhibit varying properties.<\/p>\n<h2>Advanced: Why Is Detergent Replacement an Ongoing Process?<\/h2>\n<p>The original text explains that Freon, when used as a cleaning agent for wiring boards during assembly, damages the ozone layer and contributes to global warming, and the international community has restricted and banned its use, replacing it with alternatives such as HCFCs, HFCs, PFCs, IPA, propanol, and ethyl acetate. However, these alternatives also pose environmental concerns, so research and development of third-generation CFCs is currently underway.<\/p>\n<ul>\n<li><strong>First-generation CFCs have been completely banned.<\/strong>: The original text explicitly states that the timeframe begins in 1995;<\/li>\n<li><strong>Second-generation alternatives still pose an environmental burden<\/strong>: This should not be considered a final solution;<\/li>\n<li><strong>The third generation is still under development.<\/strong>: It is necessary to continuously monitor changes in regulations;<\/li>\n<li><strong>The no-wash process is another viable option<\/strong>: This can reduce the amount of detergent used.<\/li>\n<\/ul>\n<p>The practical conclusion that follows from this is<strong>\"Reducing the need for cleaning is a more fundamental solution than changing the cleaning agent.\"<\/strong>. The original text, in discussing flux-free joining technology, noted that it simplifies the process and reduces the number of cleaning steps. When the joining process itself no longer produces residues that require cleaning, reliance on cleaning agents naturally decreases\u2014a more sustainable approach than constantly searching for more environmentally friendly solvents.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-6554\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-cleaning.jpg\" alt=\"PCB Cleaning\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-cleaning.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-cleaning-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-cleaning-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-cleaning-768x432.jpg 768w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>For cleaning instructions, see<a href=\"\/en\/blog\/how-to-pcb-cleaning\/\">PCB Cleaning Methods<\/a>; For the cleaning process, see<a href=\"\/en\/blog\/pcb-cleaning\/\">PCB Cleaning<\/a>; For selective soldering, see<a href=\"\/en\/blog\/selective-soldering\/\">Selective Soldering<\/a>\u3002<\/p>\n<h2>Conclusion<\/h2>\n<p>Driven by environmental pressures, the electronics assembly industry is actively seeking more environmentally friendly materials and technologies. Lead-free soldering, flux-free joining technologies, and the control of VOC use and emissions are all key issues at present. In the future, we can expect more environmentally friendly innovations to ensure the sustainability and environmental responsibility of electronic products.<\/p>\n<h2>Advanced: What Makes VOC Control So Challenging?<\/h2>\n<p>The original text identifies the control of the use and emissions of volatile organic compounds (VOCs) as a key aspect of environmental protection. Specific measures include restricting the use of VOCs to enclosed or recovery systems and developing new materials\u2014such as water-soluble fluxes and flux-free resins\u2014to reduce their consumption. The text also notes that research in this area is ongoing, given the wide variety of such compounds and their differing properties.<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Control Path<\/th>\n<th>Original Method<\/th>\n<th>Implementation Challenges<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>System Shutdown<\/td>\n<td>Restricted to use in closed or recoverable systems<\/td>\n<td>Equipment upgrades require a significant investment.<\/td>\n<\/tr>\n<tr>\n<td>Material Substitution<\/td>\n<td>Development of Water-Soluble Flux<\/td>\n<td>Welding performance must be revalidated.<\/td>\n<\/tr>\n<tr>\n<td>Material Substitution<\/td>\n<td>Development of Solvent-Free Resins<\/td>\n<td>Limited range of applicable processes<\/td>\n<\/tr>\n<tr>\n<td>Reduction at the Source<\/td>\n<td>Reduce VOC usage<\/td>\n<td>Emissions must be calculated for each process step.<\/td>\n<\/tr>\n<tr>\n<td>Ongoing Research<\/td>\n<td>The original text notes that the research is still ongoing.<\/td>\n<td>There is a wide variety of compounds, and their properties vary greatly.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>The root cause of the problem is<strong>\"VOCs are not a single substance but a broad class of compounds.\"<\/strong>. The original text clearly states that there are many different types with varying properties, which means it is impossible to address emissions issues across all processes with a single, universal substitute; instead, solutions must be sought separately for each process. For this reason, related research is still ongoing.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-6076\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-surface-finishing.webp\" alt=\"Surface Treatment\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-surface-finishing.webp 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-surface-finishing-300x169.webp 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-surface-finishing-1024x576.webp 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-surface-finishing-768x432.webp 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/pcb-surface-finishing-400x225.webp 400w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>For electrical reliability, see<a href=\"\/en\/blog\/pcba-electrical-reliability\/\">Ensuring Electrical Reliability in PCBA Product Design<\/a>; For information on solderability optimization, see<a href=\"\/en\/blog\/pcb-hole-solderability-welding-quality\/\">The Impact of PCB Via Solderability on Soldering Quality and Optimization Methods<\/a>\u3002<\/p>\n<h2>Advanced: Limits of Application for Solderless Connection Technology<\/h2>\n<p>The original text explains that as components become smaller and pitch distances decrease, traditional soldering techniques can no longer meet the demands. As a result, solderless bonding technologies\u2014including ultrasonic bonding and hot-press bonding\u2014have garnered attention. These methods allow IC chips to be bonded directly to substrate electrodes without the need for solder, thereby simplifying the process and reducing the number of cleaning steps.<\/p>\n<ul>\n<li><strong>Suitable for applications with extremely tight spacing<\/strong>: The driving factors identified in the original text;<\/li>\n<li><strong>No flux is required, which reduces the need for cleaning<\/strong>: Consistent with environmental goals;<\/li>\n<li><strong>Ultrasonic bonding and hot-press welding are the most common methods<\/strong>: The original text is listed below;<\/li>\n<li><strong>High barriers to entry in terms of equipment and processes<\/strong>: The feasibility of mass production needs to be evaluated.<\/li>\n<\/ul>\n<ol>\n<li>Verify whether the device spacing exceeds the capabilities of conventional soldering;<\/li>\n<li>\u8bc4\u4f30\u8d85\u58f0\u952e\u5408\u6216\u70ed\u538b\u710a\u7684\u9002\u7528\u6027\uff1b<\/li>\n<li>\u6838\u5bf9\u57fa\u677f\u7535\u6781\u7684\u53ef\u8fde\u63a5\u6027\uff1b<\/li>\n<li>\u9a8c\u8bc1\u8fde\u63a5\u53ef\u9760\u6027\u4e0e\u8fd4\u4fee\u53ef\u884c\u6027\uff1b<\/li>\n<li>\u786e\u8ba4\u6279\u91cf\u751f\u4ea7\u7684\u8bbe\u5907\u4e0e\u8282\u62cd\u3002<\/li>\n<\/ol>\n<p>\u9700\u8981\u6743\u8861\u7684\u662f<strong>\u300c\u5de5\u827a\u7b80\u5316\u4e0e\u8bbe\u5907\u6295\u5165\u4e4b\u95f4\u7684\u53d6\u820d\u300d<\/strong>\u3002\u65e0\u710a\u5242\u8fde\u63a5\u7701\u6389\u4e86\u710a\u5242\u4e0e\u6e05\u6d17\u4e24\u6b65\uff0c\u4f46\u5f15\u5165\u4e86\u5bf9\u8bbe\u5907\u7cbe\u5ea6\u548c\u57fa\u677f\u7535\u6781\u72b6\u6001\u7684\u66f4\u9ad8\u8981\u6c42\u3002\u5bf9\u4ea7\u91cf\u5927\u3001\u95f4\u8ddd\u6781\u5c0f\u7684\u4ea7\u54c1\uff0c\u8fd9\u7b14\u6295\u5165\u901a\u5e38\u503c\u5f97\uff1b\u5bf9\u5e38\u89c4\u95f4\u8ddd\u7684\u4ea7\u54c1\uff0c\u4f20\u7edf\u710a\u63a5\u4ecd\u662f\u66f4\u7ecf\u6d4e\u7684\u9009\u62e9\u3002<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"2160\" height=\"1025\" class=\"alignnone size-large wp-image-9020\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/05\/PCB-manufacture.jpg\" alt=\"PCB Manufacturers\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/05\/PCB-manufacture.jpg 2160w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/05\/PCB-manufacture-300x142.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/05\/PCB-manufacture-1024x486.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/05\/PCB-manufacture-768x364.jpg 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/05\/PCB-manufacture-1536x729.jpg 1536w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/05\/PCB-manufacture-2048x972.jpg 2048w\" sizes=\"auto, (max-width: 2160px) 100vw, 2160px\" \/><\/p>\n<p>\u9ad8\u53ef\u9760PCB\u7279\u5f81\u89c1<a href=\"\/en\/blog\/10-characteristics-of-highly-reliable-pcb\/\">10 Characteristics of Highly Reliable PCBs<\/a>; For assembly and testing, see<a href=\"\/en\/blog\/pcb-assembly-testing\/\">Why Is PCB Assembly and Testing Necessary?<\/a>\u3002<\/p>\n<h2>Frequently Asked Questions<\/h2>\n<h3>1. \u65e0\u94c5\u710a\u63a5\u662f\u5426\u4f1a\u5f71\u54cd\u7535\u5b50\u4ea7\u54c1\u7684\u6027\u80fd\uff1f<\/h3>\n<p>\u65e0\u94c5\u710a\u63a5\u5df2\u7ecf\u53d6\u5f97\u4e86\u663e\u8457\u8fdb\u5c55\uff0c\u53ef\u4ee5\u63d0\u4f9b\u4e0e\u4f20\u7edf\u710a\u63a5\u76f8\u5ab2\u7f8e\u7684\u6027\u80fd\u3002\u56e0\u6b64\uff0c\u5b83\u4e0d\u4f1a\u663e\u8457\u5f71\u54cd\u7535\u5b50\u4ea7\u54c1\u7684\u6027\u80fd\u3002<\/p>\n<h3>2. \u4e3a\u4ec0\u4e48\u8981\u5e9f\u9664\u4f7f\u7528\u6c1f\u91cc\u6602\uff1f<\/h3>\n<p>\u6c1f\u91cc\u6602\u4f1a\u7834\u574f\u5730\u7403\u7684\u81ed\u6c27\u5c42\uff0c\u5bfc\u81f4\u5730\u7403\u53d8\u6696\u3002\u56e0\u6b64\uff0c\u56fd\u9645\u793e\u4f1a\u91c7\u53d6\u4e86\u7981\u6b62\u4f7f\u7528\u6c1f\u91cc\u6602\u7684\u63aa\u65bd\u3002<\/p>\n<h3>3. \u65e0\u710a\u5242\u8fde\u63a5\u6280\u672f\u662f\u5426\u5b89\u5168\uff1f<\/h3>\n<p>\u65e0\u710a\u5242\u8fde\u63a5\u6280\u672f\u662f\u5b89\u5168\u7684\uff0c\u5e76\u4e14\u5728\u4e00\u4e9b\u7535\u5b50\u4ea7\u54c1\u7684\u5236\u9020\u4e2d\u5df2\u7ecf\u5f97\u5230\u5e94\u7528\u3002\u5b83\u4e0d\u6d89\u53ca\u6709\u5bb3\u7684\u710a\u5242\uff0c\u6709\u52a9\u4e8e\u51cf\u5c11\u73af\u5883\u6c61\u67d3\u3002<\/p>\n<h3>4. \u4e3a\u4ec0\u4e48\u8981\u63a7\u5236VOC\u7684\u4f7f\u7528\u4e0e\u6392\u653e\uff1f<\/h3>\n<p>VOC\u662f\u6709\u5bb3\u7684\u6325\u53d1\u6027\u6709\u673a\u5316\u5408\u7269\uff0c\u5bf9\u73af\u5883\u548c\u4eba\u7c7b\u5065\u5eb7\u6709\u5bb3\u3002\u56e0\u6b64\uff0c\u63a7\u5236\u5176\u4f7f\u7528\u4e0e\u6392\u653e\u5bf9\u73af\u4fdd\u81f3\u5173\u91cd\u8981\u3002<\/p>\n<h3>5. \u672a\u6765\u7684\u7535\u5b50\u7ec4\u88c5\u8d8b\u52bf\u662f\u4ec0\u4e48\uff1f<\/h3>\n<p>\u672a\u6765\u7684\u7535\u5b50\u7ec4\u88c5\u8d8b\u52bf\u5305\u62ec\u66f4\u73af\u4fdd\u7684\u6750\u6599\u548c\u6280\u672f\u7684\u53d1\u5c55\uff0c\u4ee5\u53ca\u5bf9\u7535\u5b50\u4ea7\u54c1\u7684\u53ef\u6301\u7eed\u6027\u7684\u5173\u6ce8\u3002\u73af\u4fdd\u5c06\u7ee7\u7eed\u63a8\u52a8\u521b\u65b0\u548c\u6539\u8fdb\u3002<\/p>\n<p>\u5728\u9762\u5bf9\u7535\u5b50\u7ec4\u88c5\u7684\u73af\u4fdd\u6311\u6218\u65f6\uff0c\u6211\u4eec\u9700\u8981\u4e0d\u65ad\u52aa\u529b\uff0c\u4ee5\u786e\u4fdd\u7535\u5b50\u4ea7\u54c1\u7684\u5236\u9020\u66f4\u52a0\u73af\u4fdd\u548c\u53ef\u6301\u7eed\u3002\u540c\u65f6\uff0c\u65b0\u7684\u6750\u6599\u548c\u6280\u672f\u7684\u53d1\u5c55\u4e5f\u5c06\u63a8\u52a8\u7535\u5b50\u7ec4\u88c5\u9886\u57df\u8fc8\u5411\u66f4\u52a0\u53ef\u6301\u7eed\u7684\u672a\u6765\u3002\u8ba9\u6211\u4eec\u5171\u540c\u5173\u6ce8\u73af\u4fdd\uff0c\u4e3a\u5730\u7403\u7684\u672a\u6765\u51fa\u4e00\u4efd\u529b\u3002<\/p>\n<h3>6. \u65e0\u94c5\u710a\u63a5\u5207\u6362\u65f6\u9700\u8981\u91cd\u65b0\u8bc4\u4f30\u54ea\u4e9b\u5185\u5bb9\uff1f<\/h3>\n<p>\u539f\u6587\u6307\u51fa\u4eceSn-Pb\u710a\u63a5\u6539\u4e3a\u65e0\u94c5\u710a\u63a5\uff0c\u9700\u8981\u91cd\u65b0\u8bc4\u4f30\u710a\u63a5\u6750\u6599\u7684\u7ec4\u6210\u3001\u5de5\u827a\u548c\u53ef\u9760\u6027\u7b49\u591a\u4e2a\u65b9\u9762\u3002\u5177\u4f53\u6765\u8bf4\u5305\u62ec\u66ff\u4ee3\u5408\u91d1\u7684\u7194\u70b9\u4e0e\u5de5\u827a\u7a97\u53e3\u3001\u677f\u4e0a\u5668\u4ef6\u7684\u8010\u70ed\u4e0a\u9650\u3001\u56de\u6d41\u6e29\u5ea6\u66f2\u7ebf\uff0c\u4ee5\u53ca\u710a\u70b9\u7684\u673a\u68b0\u5f3a\u5ea6\u4e0e\u75b2\u52b3\u5bff\u547d\u3002<\/p>\n<h3>7. \u6c1f\u91cc\u6602\u7684\u66ff\u4ee3\u54c1\u662f\u5426\u5b8c\u5168\u73af\u4fdd\uff1f<\/h3>\n<p>\u5e76\u975e\u5b8c\u5168\u73af\u4fdd\u3002\u539f\u6587\u660e\u786e\u63d0\u5230HCFC\u3001HFC\u3001PFC\u3001IPA\u3001\u4e19\u9187\u548c\u4e59\u9178\u5df2\u8102\u7b49\u66ff\u4ee3\u54c1\u540c\u6837\u5b58\u5728\u73af\u5883\u95ee\u9898\uff0c\u56e0\u6b64\u7b2c\u4e09\u4ee3CFC\u7684\u7814\u53d1\u6b63\u5728\u79ef\u6781\u8fdb\u884c\u3002\u66ff\u4ee3\u662f\u4e00\u4e2a\u6301\u7eed\u8fed\u4ee3\u7684\u8fc7\u7a0b\uff0c\u800c\u4e0d\u662f\u4e00\u6b21\u5b8c\u6210\u7684\u5207\u6362\u3002<\/p>\n<h3>8. \u51cf\u5c11VOC\u7528\u91cf\u6709\u54ea\u4e9b\u53ef\u884c\u8def\u5f84\uff1f<\/h3>\n<p>\u539f\u6587\u7ed9\u51fa\u7684\u8def\u5f84\u5305\u62ec\u628aVOC\u7684\u4f7f\u7528\u9650\u5236\u5728\u5c01\u95ed\u6216\u53ef\u56de\u6536\u7684\u7cfb\u7edf\u4e2d\uff0c\u4ee5\u53ca\u5f00\u53d1\u6c34\u6eb6\u6027\u710a\u5242\u548c\u65e0\u7194\u5242\u6811\u8102\u7b49\u65b0\u6750\u6599\u6765\u51cf\u5c11\u7528\u91cf\u3002\u7531\u4e8e\u8fd9\u7c7b\u5316\u5408\u7269\u79cd\u7c7b\u7e41\u591a\u3001\u6027\u80fd\u5404\u5f02\uff0c\u901a\u5e38\u9700\u8981\u6309\u5de5\u5e8f\u5206\u522b\u5bfb\u627e\u65b9\u6848\u3002<\/p>\n<p><strong>Related Recommendations<\/strong>\uff1a<a href=\"\/en\/blog\/how-component-shortages-affect-electronic-product-design\/\">\u5143\u5668\u4ef6\u77ed\u7f3a\u5982\u4f55\u5f71\u54cd\u7535\u5b50\u4ea7\u54c1\u8bbe\u8ba1\u4ee5\u53ca\u907f\u514d<\/a> \u00b7 <a href=\"\/en\/blog\/ceramic-substrate-for-automotive-new-energy\/\">The Widespread Use of Ceramic Substrates in the New Energy Automotive Sector<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>\u968f\u7740\u7535\u5b50\u4ea7\u54c1\u4e2d\u5c0f\u578b\u3001\u8f7b\u578b\u3001\u8584\u578b\u548c\u9ad8\u6027\u80fd\u5143\u5668\u4ef6\u7684\u5e7f\u6cdb\u5e94\u7528\uff0c\u7ec4\u88c5\u6280\u672f\u53d8\u5f97\u81f3\u5173\u91cd\u8981\u3002\u540c\u65f6\uff0c\u7ec4\u88c5\u6750\u6599\u4e0e\u73af\u5883\u4fdd\u62a4\u4e4b\u95f4\u7684\u5173 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":9520,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"Introduction to Layer Editing in the CAM350 PCB Design Tool - Jingpeng Electronics","description":"What material challenges does lead-free soldering present? This article explains the requirements for soldering temperatures and assembly materials under lead-free conditions, as well as the future direction of related process technologies. It serves as a useful reference for hardware engineers and procurement professionals during the product selection phase."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[413,26],"tags":[],"class_list":["post-1828","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pcb-basics","category-blog"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/1828","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=1828"}],"version-history":[{"count":4,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/1828\/revisions"}],"predecessor-version":[{"id":20107,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/1828\/revisions\/20107"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media\/9520"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=1828"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=1828"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=1828"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}