Before starting production, make sure to confirm the following four things:<\/strong>Operating frequency bands and performance targets; specific materials and finished laminates; manufacturing constraints for critical paths and vias; and test methods and acceptance criteria. Even if material part numbers are the same, this does not necessarily mean that the RF performance of different batches or different manufacturing processes will be identical.<\/p>\n<\/blockquote>\n High-frequency design cannot be evaluated based on a single frequency threshold alone. Actual risks are also related to trace length, allowable loss, phase error, and structural dimensions; in high-speed digital circuits, signal edges and their spectra must also be taken into account. Short-distance RF interconnects and millimeter-wave array feedlines\u2014even though both are referred to as high-frequency PCBs\u2014require different design considerations.<\/p>\n The drawings should distinguish between bare-board testing and system testing after assembly. Passing the bare-board electrical continuity test does not directly prove that the module meets requirements for gain, noise, matching, or antenna efficiency. For the product scope, please refer toHigh-Frequency PCB Manufacturing Page<\/a>\u3002<\/p>\n The dielectric constant (Dk) affects impedance and electrical length, while the loss factor (Df) is one of the parameters used to evaluate dielectric loss. When comparing materials, verify the test frequency, method, direction, and conditions; do not directly rank values obtained from different test systems. For materials that specify a \u201cDesign Dk,\u201d the design value should be selected based on the manufacturer\u2019s specifications and the actual transmission line model, rather than arbitrarily substituting values from the data sheet. SeeRogers' Explanation of Dk and Design Dk<\/a>\u3002<\/p>\n High-frequency materials are not the same as PTFE. The processing windows for thermosetting high-frequency materials differ from those of PTFE-based materials. When selecting a material, considerPCB Board Guide<\/a>\u548cRogers Sheet Material Page<\/a>Please note: Brand names cannot be used in place of specific model numbers.<\/p>\n Impedance evaluation should be based on the finished dielectric thickness, finished copper thickness, trace width, trace spacing, and reference plane. The models for microstrip lines, striplines, and ground-coupled coplanar waveguides differ; for coplanar structures, the gap between the signal line and the ground copper on both sides must also be controlled. After the factory performs etching compensation, it should be verified whether the critical RF dimensions still meet the original design intent.<\/p>\n![\"A](\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2024\/05\/PCB-manufacture.jpg\")
<\/figure>\n1. First, define the acceptance criteria for high-frequency boards<\/h2>\n
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2. Material Selection: Don\u2019t just compare a single Dk value<\/h2>\n
Clearly specify the test conditions and design parameters.<\/h3>\n
Material Information to Be Locked for the Order<\/h3>\n
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3. Layering and Routing: Controlling the final product's structure, not just designing line widths<\/h2>\n