{"id":1608,"date":"2026-10-23T09:00:00","date_gmt":"2026-10-23T01:00:00","guid":{"rendered":"https:\/\/www.jingpengpcb.com\/?p=1608"},"modified":"2026-10-10T00:07:52","modified_gmt":"2026-10-09T16:07:52","slug":"automotive-pcb-layer-usage","status":"publish","type":"post","link":"https:\/\/www.jingpengpcb.com\/en\/blog\/automotive-pcb-layer-usage\/","title":{"rendered":"What exactly are the functions of each layer on an automotive circuit board?"},"content":{"rendered":"<style>\n.jp-tw{overflow-x:auto;margin:26px 0;-webkit-overflow-scrolling:touch;}\n.jp-tw table{border-collapse:collapse;width:100%;min-width:560px;font-size:15px;line-height:1.65;background:#fff;}\n.jp-tw th,.jp-tw td{border:1px solid #dde3ea;padding:11px 14px;text-align:left;vertical-align:top;}\n.jp-tw thead th{background:#eef2f7;color:#1b2733;font-weight:700;white-space:nowrap;border-bottom:2px solid #c9d3de;}\n.jp-tw tbody tr:nth-child(even){background:#fafbfc;}\n.jp-tw tbody tr:hover{background:#f1f5fa;}\n.jp-tw tbody td:first-child{font-weight:600;color:#1b2733;}\n@media(max-width:767px){.jp-tw table{font-size:14px;min-width:520px;}.jp-tw th,.jp-tw td{padding:9px 11px;}}\n<\/style>\n<p>Automotive circuit boards are modern<a href=\"\/en\/industry\/automotive\/\">Automotive Electronics<\/a>These are core components of the system and consist of complex structures made up of multiple layers. Each layer performs a specific function, and understanding the purpose and significance of these layers is essential for better designing and understanding automotive circuit boards. In this article, we will focus on the various layers of a 4-layer automotive circuit board.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-6428\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/automotive-electronic-pcb.jpg\" alt=\"Automotive Electronics PCBs\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/automotive-electronic-pcb.jpg 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/automotive-electronic-pcb-300x169.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/automotive-electronic-pcb-1024x576.jpg 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/automotive-electronic-pcb-768x432.jpg 768w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<h2>1. Silkscreen Layers<\/h2>\n<p>The silkscreen layer is a layer on an automotive circuit board, divided into the top silkscreen layer and the bottom silkscreen layer. Typically, you will see white characters and outlines on automotive circuit boards (if the board\u2019s solder mask is white, the silkscreen will be black). These characters and outlines make up the silkscreen layer, and their primary function is to label component locations, component frames, and provide additional notes.<\/p>\n<h2>2. Solder Mask Layers<\/h2>\n<p>Solder mask layers are also divided into top-layer and bottom-layer solder masks. Generally speaking, the green coating on the surface of an automotive circuit board (though it can be other colors, green is the most common) is the solder mask layer, and its primary function is insulation. It is important to note that the solder mask is a negative image, meaning that areas covered by the coating are not green, while areas not covered by the coating are green.<\/p>\n<h2>3. Paste Mask Layers<\/h2>\n<p>The solder mask is divided into a top solder mask and a bottom solder mask, sometimes also referred to as the surface-mount layer or stencil layer. On automotive circuit boards, the layer of tin or gold plating on the pads is typically the solder mask. Its primary function is to facilitate soldering and make the process easier. In the design, the solder mask is a positive mask, meaning that areas with the coating have solder mask, while areas without the coating do not.<\/p>\n<h2>Advanced: How to Tell the Difference Between Positive and Negative Film<\/h2>\n<p>With so many layers, the one that\u2019s easiest to confuse is<strong>Positive and Negative Films<\/strong>. The method for determining this is actually quite simple: in areas with an image, a positive film shows \u201cwhat is drawn is what appears,\u201d while a negative film shows \u201cwhat is drawn is what is not there.\u201d<\/p>\n<ul>\n<li><strong>Positive<\/strong>: What you see is what you get. The solder mask layer (stencil layer) is the positive film\u2014the areas marked on it are where the stencil is cut out and solder paste is applied;<\/li>\n<li><strong>Negative<\/strong>: What you see is what is not there. The solder mask is a negative\u2014the areas that are marked are the openings (exposed copper), while the areas that are not marked are covered with ink; negatives are also commonly used when inner layers are designed as ground planes or power planes;<\/li>\n<li><strong>Screen-Printing Layer and Assembly Layer<\/strong>: All are positive images; output according to the drawn shapes;<\/li>\n<li><strong>Mechanical Layers and Keep-Out Layers<\/strong>: These are constraints and notes; they are not included in the electrical diagram output.<\/li>\n<\/ul>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>\u5c42<\/th>\n<th>Positive \/ Negative Film<\/th>\n<th>Whether to Participate in the Output<\/th>\n<th>Main Functions<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>Screen-printed layer<\/td>\n<td>Main Feature<\/td>\n<td>\u662f<\/td>\n<td>Part Numbers, Component Boxes, and Notes<\/td>\n<\/tr>\n<tr>\n<td>Solder Mask<\/td>\n<td>Negative<\/td>\n<td>\u662f<\/td>\n<td>Insulation Protection, Defining Window Openings<\/td>\n<\/tr>\n<tr>\n<td>Solder Paste Layer (Stencil Layer)<\/td>\n<td>Main Feature<\/td>\n<td>For steel mesh<\/td>\n<td>Defining Solder Paste Placement<\/td>\n<\/tr>\n<tr>\n<td>Electrical Layer<\/td>\n<td>Set by Floor<\/td>\n<td>\u662f<\/td>\n<td>Routing, Copper Laying, and Power\/Ground Layers<\/td>\n<\/tr>\n<tr>\n<td>Mechanical Layer<\/td>\n<td>Description of Properties<\/td>\n<td>Part<\/td>\n<td>Outline, Notches, and Dimension Annotations<\/td>\n<\/tr>\n<tr>\n<td>Assembly Layer<\/td>\n<td>Main Feature<\/td>\n<td>Images Only<\/td>\n<td>Component Placement and Orientation<\/td>\n<\/tr>\n<tr>\n<td>Keep-Out Layer<\/td>\n<td>Constraints<\/td>\n<td>\u5426<\/td>\n<td>Areas Where Wiring and Copper Installation Are Prohibited<\/td>\n<\/tr>\n<tr>\n<td>Drilling Zone<\/td>\n<td>Data<\/td>\n<td>For drilling<\/td>\n<td>Via and Through-Hole Pad Data<\/td>\n<\/tr>\n<tr>\n<td>Substrate<\/td>\n<td>Entity<\/td>\n<td>\u2014\u2014<\/td>\n<td>Interlayer Insulation Medium<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p>Incorporating this table into the team\u2019s design specifications is far more effective than having to refer to documents or provide verbal explanations each time, and it also significantly reduces the back-and-forth between the team and the panel manufacturer.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"1280\" height=\"720\" class=\"alignnone size-large wp-image-6080\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcb.webp\" alt=\"Automotive Electronic Circuit Boards\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcb.webp 1280w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcb-300x169.webp 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcb-1024x576.webp 1024w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcb-768x432.webp 768w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcb-400x225.webp 400w\" sizes=\"auto, (max-width: 1280px) 100vw, 1280px\" \/><\/p>\n<p>For an overview of the automotive electronics industry, please refer to<a href=\"\/en\/industry\/automotive\/\">Automotive Electronics<\/a>The \"Application Scenarios\" section.<\/p>\n<h2>4. Electrical Layers<\/h2>\n<p>The electrical layers consist of the top layer, the middle layers (for multilayer boards), and the bottom layer. These layers provide electrical connectivity and are a core component of the design. Proper routing on the electrical layers ensures appropriate connections between component pins and facilitates operations such as copper plating. For a 4-layer board, the inner layers are typically configured as ground and power layers using a negative pattern.<\/p>\n<h2>5. Mechanical Layers<\/h2>\n<p>Mechanical layers are used to design certain physical mechanical features, such as edges, slots, and holes. Typically, there can be multiple mechanical layers, and their functions can be customized as needed; operations such as dimensioning can also be performed. Different design software programs may offer different mechanical layer options.<\/p>\n<h2>6. Assembly Layers<\/h2>\n<p>The assembly layer consists of an assembly top layer and an assembly bottom layer. It is primarily used during the manufacturing process of automotive circuit board A to indicate the placement and orientation of components. Although this layer does not appear on the actual automotive circuit board, it can be printed out for staff reference.<\/p>\n<h2>Advanced: Three Typical Laminate Configurations for Four-Layer Boards<\/h2>\n<p>The original text mentions that the inner layers of a four-layer board are typically designated as the ground layer and the power layer; this is the most common practice. In actual projects, there are three typical layouts for four-layer boards:<\/p>\n<ul>\n<li><strong>Signal \/ GND \/ POWER \/ Signal<\/strong>: Most versatile. The two middle layers consist of a full ground plane and a power plane, respectively, while the outer layer carries signals; this provides a complete impedance reference and offers the most controllable cost;<\/li>\n<li><strong>Signal \/ GND \/ Signal \/ GND<\/strong>: More EMC-friendly; suitable for products with a high volume of high-speed signals or strict radiation requirements, at the cost of having the power supply routed on the outer layer;<\/li>\n<li><strong>GND \/ Signal \/ Signal \/ GND<\/strong>: Placing the signal between two layers provides the best shielding, but since no components can be placed on the outer layer, this approach is rarely used in practice.<\/li>\n<\/ul>\n<p>There is only one core principle to follow when making a choice:<strong>Ensure that each signal layer is adjacent to a complete reference plane<\/strong>, and try to place the power plane adjacent to the ground plane to minimize the signal loop area.<\/p>\n<div class=\"jp-tw\">\n<table>\n<thead>\n<tr>\n<th>Plan<\/th>\n<th>Advantages<\/th>\n<th>Points to Note<\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr>\n<td>S \/ G \/ P \/ S<\/td>\n<td>Most Versatile and Cost-Effective<\/td>\n<td>Ensure the integrity of the power plane<\/td>\n<\/tr>\n<tr>\n<td>S \/ G \/ S \/ G<\/td>\n<td>EMC performs better<\/td>\n<td>The power supply requires external treatment.<\/td>\n<\/tr>\n<tr>\n<td>G \/ S \/ S \/ G<\/td>\n<td>Best shielding performance<\/td>\n<td>Non-component outer layer<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"700\" height=\"500\" class=\"alignnone size-large wp-image-5806\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive.webp\" alt=\"Automotive Electronics PCBs\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive.webp 700w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-300x214.webp 300w\" sizes=\"auto, (max-width: 700px) 100vw, 700px\" \/><\/p>\n<p>For information on the effects of stacking on impedance and signal integrity, see<a href=\"\/en\/blog\/rf-pcb-stacking\/\">Layer-up Structure of RF PCBs (High-Frequency Microwave RF Boards)<\/a>\u4e0e<a href=\"\/en\/blog\/impedance-and-loss-of-pcb\/\">PCB Impedance and Loss<\/a>\u3002<\/p>\n<h2>7. Keep-Out Layer<\/h2>\n<p>The Keep-Out layer includes the top layer, middle layers, bottom layer, and all other layers. Its primary function is to enforce constraints, such as prohibiting copper plating or the placement of traces and vias in certain areas. In the design process, the Keep-Out layer can be used to mark these areas.<\/p>\n<h2>8. Drill Layer<\/h2>\n<p>The drilling layer contains drilling data such as via holes and through-hole pads, which is critical for multilayer board design.<\/p>\n<h2>9. Substrate<\/h2>\n<p>A substrate is an insulating layer between electrical layers; commonly used materials include FR-4 epoxy-glass fiber, as well as aluminum substrates and flexible boards. It is very important to select a substrate suitable for a specific application.<\/p>\n<h2>Advanced: Additional Requirements for Lamination and Materials in Automotive Electronics<\/h2>\n<p>The main differences between automotive circuit boards and consumer products lie in reliability and environmental requirements, and these differences are directly reflected in the choice of layer-up and materials:<\/p>\n<ul>\n<li><strong>A wider temperature range<\/strong>: The extreme temperature difference between the interior and exterior of the chamber places even higher demands on the material\u2019s Tg, CTE, and heat-aging resistance;<\/li>\n<li><strong>Vibration and Shock<\/strong>: Solder joint fatigue is the primary failure mode, which must be controlled through a combination of support structures, board thickness, and component layout;<\/li>\n<li><strong>Humidity and Corrosion<\/strong>: Often requires conformal coatings, stricter control of ionic contamination, and CAF-resistant substrates;<\/li>\n<li><strong>Lifespan and Traceability<\/strong>: Consistency in long-term supply is required; advance notice must be given for any changes to materials or processes;<\/li>\n<li><strong>Certification Requirements<\/strong>: Automotive-grade products typically require validation through the appropriate reliability test procedures.<\/li>\n<\/ul>\n<p>To put this into practice, you can follow these five steps:<\/p>\n<ol>\n<li><strong>Finalize Materials<\/strong>: Select the substrate based on temperature rating and CAF resistance requirements;<\/li>\n<li><strong>Fixed-layer<\/strong>: Ensure that the reference plane is complete and structurally symmetrical;<\/li>\n<li><strong>Specify Surface Treatment<\/strong>: Select based on the number of welds and storage period;<\/li>\n<li><strong>Perform verification<\/strong>: Warm circulation, vibration, moist heat, CAF, and other procedures are performed as needed;<\/li>\n<li><strong>Keep a record<\/strong>: All material batches, process parameters, and test reports have been filed.<\/li>\n<\/ol>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"500\" height=\"333\" class=\"alignnone size-large wp-image-4746\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcbs.jpg\" alt=\"Automotive Electronics PCBs\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcbs.jpg 500w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcbs-300x200.jpg 300w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/07\/automotive-pcbs-400x266.jpg 400w\" sizes=\"auto, (max-width: 500px) 100vw, 500px\" \/><\/p>\n<p>For system differences between automotive boards and standard boards, see<a href=\"\/en\/blog\/automotive-circuit-board-vs-conventional-circuit-board\/\">Automotive Circuit Boards vs. Conventional Circuit Boards<\/a>; For material selection, see<a href=\"\/en\/capabilities\/pcb-materials\/\">PCB Materials<\/a>\u3002<\/p>\n<h2>Advanced: Five Steps to Check the Level Before Throwing Against the Backboard<\/h2>\n<ol>\n<li><strong>Verify the Purpose of Each Tier<\/strong>: Specify what goes on each layer and which layers are used for light painting;<\/li>\n<li><strong>Verify Solder Mask Openings<\/strong>: Is the negative film logic correct, and do the windows cover all the pads?;<\/li>\n<li><strong>Check the steel mesh layer<\/strong>: Does the solder mask include only the pads that require solder paste?;<\/li>\n<li><strong>Verify the Drilling Strata<\/strong>: Are the number of holes, hole diameter, and whether they are metallized labeled correctly?;<\/li>\n<li><strong>Verify the mechanical layer against the outline<\/strong>: The outline is a single closed contour, and the slots and holes are clearly defined.<\/li>\n<\/ol>\n<p>The following four types of errors are the most common at the stratum level:<\/p>\n<ul>\n<li>\u628a<strong>Using the solder mask as a positive film<\/strong>, resulting in either a full-panel cutout or a full-panel coat;<\/li>\n<li><strong>The stencil layer contains holes that do not require solder.<\/strong>, resulting in excess solder and bridging;<\/li>\n<li><strong>Several outline lines have been drawn on the mechanical layer, and they do not overlap.<\/strong>, the board manufacturer cannot determine which one to use as the standard;<\/li>\n<li><strong>The Keep-Out layer was accidentally exported as an electrical diagram.<\/strong>, causing an open circuit or a short circuit.<\/li>\n<\/ul>\n<p><img loading=\"lazy\" decoding=\"async\" width=\"350\" height=\"224\" class=\"alignnone size-large wp-image-6326\" src=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/Automotive_624x400-350x224.jpg.webp\" alt=\"PCBs for New Energy Vehicles\" srcset=\"https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/Automotive_624x400-350x224.jpg.webp 350w, https:\/\/www.jingpengpcb.com\/wp-content\/uploads\/2023\/08\/Automotive_624x400-350x224.jpg-300x192.webp 300w\" sizes=\"auto, (max-width: 350px) 100vw, 350px\" \/><\/p>\n<p>For classification and acceptance provisions, please refer to<a href=\"\/en\/blog\/34-commonly-used-ipc-standards-for-printed-circuit-boards\/\">34 Common IPC Standards for Printed Circuit Boards<\/a>\u3002<\/p>\n<p>By gaining a thorough understanding of the functions and characteristics of each layer, we can better comprehend the structure and design of automotive circuit boards, thereby supporting the performance and reliability of automotive electronic systems.<\/p>\n<h2>Frequently Asked Questions<\/h2>\n<h3>1. What is an automotive circuit board?<\/h3>\n<p>Automotive circuit boards are board-shaped circuits used to connect and support automotive electronic components; they play a critical role in automotive electronic systems.<\/p>\n<h3>2. Why are different levels of layers needed?<\/h3>\n<p>Different layers serve different functions, including electrical connections, mechanical design, and component labeling, and together they form the complex structure of an automotive circuit board.<\/p>\n<h3>3. How do you choose the right substrate?<\/h3>\n<p>The choice of substrate depends on the design requirements and the specific application; common options include FR-4 epoxy-glass fiber, aluminum substrates, and flexible boards.<\/p>\n<h3>4. What is the purpose of the solder mask?<\/h3>\n<p>The solder mask is primarily used to insulate and protect the pads, ensuring the accuracy and reliability of the soldering process.<\/p>\n<h3>5. What is the main function of the Keep-Out layer?<\/h3>\n<p>Keep-Out layers are used to impose constraints and restrictions to ensure design compliance, such as areas where copper plating or routing is prohibited.<\/p>\n<h3>6. What are the differences in the number of layers between automotive PCBs and consumer PCBs?<\/h3>\n<p>The design logic differs. For consumer-grade PCBs, cost and size are the top priorities, so the number of layers is typically kept to a minimum; for automotive PCBs, however, EMC, thermal management, and long-term reliability must all be met, so an extra layer is usually added to ensure a complete reference plane and provide redundancy, rather than simply minimizing the number of layers.<\/p>\n<h3>7. What are the benefits of making the inner layer a negative?<\/h3>\n<p>Negative film output produces a small amount of data and processes quickly; it is particularly efficient for large-area layers and power layers, and also facilitates the creation of hot-solder pads. The downside is that beginners can easily reverse the orientation, so extra caution is required when making changes.<\/p>\n<h3>8. Are the steel mesh layer and the flux layer the same thing?<\/h3>\n<p>It's essentially the same layer, just with a different name; it's sometimes called the PasteMask layer or the paste layer. It determines where holes are cut in the stencil and where solder paste is applied\u2014it's the positive mask logic.<\/p>\n<h3>9. What are the consequences of incorrectly placing the solder mask openings?<\/h3>\n<p>In mild cases, the pads may be covered by ink, preventing soldering; in severe cases, large areas of the board may be exposed, leading to short circuits and oxidation. Since the solder mask is a negative image, reversing the orientation often produces the exact opposite result; be sure to preview and confirm the layout using CAM software before submitting the board.<\/p>\n<h3>10. How can I confirm that the PCB manufacturer has correctly understood my layer definitions?<\/h3>\n<p>The most reliable way is to<strong>Request that the panel manufacturer send back a CAM preview or engineering confirmation form<\/strong>...and verify the intended uses for each layer one by one. At the same time, include a table of intended uses by layer in the submission notes to eliminate any ambiguities before submitting the board.<\/p>\n<p><strong>Related Recommendations<\/strong>\uff1a<a href=\"\/en\/blog\/automotive-circuit-board-vs-conventional-circuit-board\/\">Automotive Circuit Boards vs. Conventional Circuit Boards<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>\u6c7d\u8f66\u7535\u8def\u677f\u662f\u73b0\u4ee3\u6c7d\u8f66\u7535\u5b50\u7cfb\u7edf\u7684\u6838\u5fc3\u7ec4\u6210\u90e8\u5206\uff0c\u5b83\u4eec\u662f\u7531\u591a\u4e2a\u5c42\u7ec4\u6210\u7684\u590d\u6742\u7ed3\u6784\u3002\u6bcf\u4e00\u5c42\u90fd\u627f\u62c5\u7740\u7279\u5b9a\u7684\u529f\u80fd\uff0c\u4e86\u89e3\u8fd9\u4e9b\u5c42 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":6428,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"What Are the Functions of Each Layer on an Automotive Circuit Board? - Jingpeng Electronics","description":"What are the functions of each layer on an automotive circuit board? Explain the purposes of the silkscreen layer, solder mask layer, flux layer, electrical layer, mechanical layer, and assembly layer, as well as their roles in the design files. Break it down layer by layer, from theory to practical implementation, so that even beginners can understand."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[413,26],"tags":[],"class_list":["post-1608","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pcb-basics","category-blog"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/1608","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=1608"}],"version-history":[{"count":5,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/1608\/revisions"}],"predecessor-version":[{"id":20058,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/1608\/revisions\/20058"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media\/6428"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=1608"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=1608"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=1608"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}