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<\/p>\nIn modern electronic devices, PCBs (Printed Circuit Boards) play a crucial role. They serve as the structural framework for electronic components, enabling devices to function properly by mounting components and providing electrical connections. In certain situations, particularly in high-performance electronic devices, it is necessary to construct multilayer PCB stacks to meet the requirements of complex circuits and high-speed signal transmission. This article will explain how to build multilayer PCB stacks in PCB design and discuss the importance of these stacks.
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A PCB stack-up, also known as a PCB laminate, refers to the process of stacking two or more layers of a printed circuit board in a specific order. This stacking sequence typically includes internal layers, prepreg, andCopper-Clad Laminate<\/a>(Core) and other layers. Proper PCB stack-up design can reduce electromagnetic radiation and crosstalk and improve signal integrity, which is critical for high-performance electronic devices.<\/p>\n A PCB stackup typically consists of the following layers:<\/p>\n Metal foil, typically made of copper, is the most common metal layer in PCBs. It serves to connect the internal layers of the circuit board.<\/p>\n Prepreg is a glass cloth impregnated with epoxy resin, which is semi-cured. It is used to bond the inner layers to the copper-clad laminate.<\/p>\n Copper-clad laminate consists of a single or multiple layers of prepreg bonded to upper and lower copper foils; it is also referred to as the core. It forms the main structure of a PCB.<\/p>\n A PCB stackup typically includes power planes and ground planes. The power layer is a copper layer connected to the power supply, typically designated as VCC. Its function is to provide a stable power supply to the PCB. On multilayer boards, if a component requires power, it can simply be connected to a via that is in contact with the power layer. The ground plane is a flat copper layer connected to the common ground point on the PCB.<\/p>\n Power Layers and Ground Planes in a PCB Stack-Up<\/p>\n A PCB stackup typically includes power planes and ground planes. The power layer is a copper layer connected to the power supply, typically designated as VCC. Its function is to provide a stable power supply to the PCB. On multilayer boards, if a component requires power, it can simply be connected to a via that is in contact with the power layer. The ground plane is a flat copper layer connected to the common ground point on the PCB.<\/p>\n A stack-up describes the sequential construction of a multilayer board. It provides important information, such as the material thickness and copper weight required to manufacture a PCB. A stack-up is also referred to as a stack. The stack-up also provides details on the trace widths for different controlled-impedance routing (e.g., 50-ohm, 100-ohm differential).<\/p>\n A laminate consists primarily of metal foil, prepreg, and copper-clad laminate (core).<\/p>\n Metal foil: Copper is the most commonly used metal foil in PCB construction.<\/p>\n Prepreg: A type of interwoven glass fabric impregnated with epoxy resin. The resin is semi-cured.<\/p>\n Copper-clad laminate: A copper-clad laminate is made by bonding a single or multiple layers of prepreg to upper and lower copper foils. This is also referred to as the core.<\/p>\n Lamination is the process of bonding prepreg and copper foil to the inner layers of a PCB by subjecting the laminate to extreme temperatures and pressures. The temperature and pressure values are specified in the datasheet for the selected PCB material.<\/p>\n The thickness of a PCB depends primarily on factors such as copper thickness, the materials used, the number of layers, and the operating environment. The standard thickness for a typical PCB is approximately 62 mils (1.57 millimeters). Today, as the weight and number of copper layers continue to increase across various applications, PCBs are becoming increasingly complex. Consequently, PCBs tend to become thicker. In response to customer demand, manufacturers are now producing PCBs in two new standard thicknesses: 93 mils (2.36 mm) and 125 mils (3.17 mm) (equivalent to 150% and 200%, respectively, under the old standard).<\/p>\n In this modern age, electronic devices have become increasingly complex, consisting of more components and circuits. Incorporating complex circuits into a single-layer PCB is a tedious task. You can solve this problem by adding layers to the stack.<\/p>\n Let's take a look at some of the advantages of multilayer boards:<\/p>\n A stackup refers to the materials used to manufacture multilayer printed circuit boards. The conference provides the following information:<\/p>\n The inner layer should undergo chemical and\/or mechanical cleaning to remove contaminants from the copper surface.<\/p>\n The imaging material is applied to the copper surface. It covers the desired copper circuits and exposes the excess copper.<\/p>\n The inner layer is chemically etched to remove excess copper. The photoresist is then stripped to expose the copper circuit.<\/p>\n Perform automatic optical inspection to detect defects (short circuits\/internal layer open circuits) that are invisible to the naked eye.<\/p>\n Before lamination, the exposed copper traces on the inner layers must be treated to improve adhesion. Improved adhesion also enhances the overall structural strength and reliability of the board.<\/p>\n Repeat steps 1 through 6 for all inner layers. For example, these steps will be performed for the 2nd and 3rd layers, and the 4th and 5th layers.<\/p>\n In this step, the laminate is pressed and heated inside a vacuum chamber. The lamination process begins by applying a vacuum to remove all residual air and gases. Afterward, heat and pressure are applied to the laminate to bond the resin molecules in the prepreg.<\/p>\n After the lamination process, the laminated board is loaded onto the exit material tray of the drilling machine. Holes are drilled into the PCB to create through-holes and blind holes. The exit material reduces the formation of burrs. Burrs are copper protrusions formed when the drill bit passes through the board.<\/p>\n In this step, the copper burrs formed during the drilling process are removed. It also removes all fingerprints from the copper surface. Decontamination is the process of removing molten resin during the drilling process. The PCB is immersed in a series of chemical solutions and then in potassium permanganate or concentrated sulfuric acid to remove epoxy resin residue. It can also be purified through plasma treatment.<\/p>\n After deburring and cleaning, the drilled holes should be chemically copper-plated.<\/p>\n High-Density Interconnect (HDI) refers to printed circuit boards with a higher routing density per unit area than traditional printed circuit boards. Generally, HDI PCBs incorporate microvias, blind vias, buried vias, multilayer structures, and considerations for high signal performance.<\/p>\n PCBs are manufactured by laminating epoxy-impregnated glass fiber boards between copper layers. These layers are laminated together under high temperature and pressure. Layer stacking is the process of inserting dielectric materials between copper layers and subsets of the stack (the stack).<\/p>\n Buried vias can be incorporated into HDI boards using a sequential lamination process. The first step is to manufacture the layers connected by buried vias (layers 2, 3, 4, and 4 in a given stackup). Next, the outer layers (layers 1 and 6) are laminated, and microvias are drilled.<\/p>\n Now let's assume the design requires connections between L1 and L3, and between L6 and L4. The best way to implement this design is to use staggered or stacked vias.<\/p>\n Staggered through-holes essentially mean fewer process steps. We do not need to fill the laser-drilled holes with copper because the second laser drill will not overlap the first one. The filling or plating of microvia holes is typically performed in an electroplating tank specifically designed with chemical solutions. The laser-drilled microvia holes are plated from the bottom to the top of the via until the hole is completely filled. Plating laser-drilled microvia holes increases processing time and cost.<\/p>\n HDI stack structures can be classified into categories based on the number of microchannel layers and the number of internal layers between the microchannels. These categories are determined by the formula XNX, where x is the number of microchannel layers and N is the number of internal layers between the microchannels.<\/p>\n The cost of the circuit board needs to be optimized to be as low as possible. To achieve this, the following points should be considered:<\/p>\n Successful PCB design depends largely on the stackup. A well-designed stackup allows designers to optimize their designs for better signal integrity and reduce crosstalk and EMI. In this article, we provide a basic overview of the PCB stackup manufacturing process. If you\u2019d like to learn more about a specific topic, please let us know in the comments section.<\/p>\n In your PCB design, the correct stack-up ensures the board\u2019s performance and reliability. Whether in high-performance computers or mobile devices, multilayer PCB stack-ups are a key component of modern electronic devices. If you have any questions about PCB stack-ups or need more information, please feel free to ask in the comments below. We\u2019ll be happy to assist you.<\/strong><\/p>\n PCB stack-ups are an indispensable part of modern electronic devices. Proper stack-up design can significantly impact a circuit board\u2019s performance, signal integrity, and reliability. By selecting appropriate materials and process steps, designers can optimize PCB performance to meet the growing demands of electronic devices. We hope this article helps you better understand the importance of PCB stack-ups and how to build multilayer PCB stack-ups.<\/p>\n 1. How important is PCB stack-up design to circuit performance?<\/strong><\/p>\n PCB stack-up design is critical to circuit performance. A proper stack-up can reduce electromagnetic interference and improve signal integrity, which is essential for high-performance electronic devices.<\/p>\n 2. Why are multilayer PCBs needed?<\/strong><\/p>\n Multilayer PCBs can accommodate complex circuits and improve the durability and performance of circuit boards. In modern electronic devices, multilayer PCBs are becoming increasingly important due to the growing complexity of circuits.<\/p>\n 3. How do you choose the right materials for a PCB stackup?<\/strong><\/p>\n The selection of PCB stack-up materials should be based on specific application needs and design requirements. Typically, factors such as copper thickness, prepreg type, and environmental conditions must be considered.<\/p>\n 4. What is an HDI PCB?<\/strong><\/p>\n HDI PCB stands for High-Density Interconnect Printed Circuit Board. It features high-density wiring, microvias, blind vias, and buried vias, and is suitable for high-performance electronic devices.<\/p>\n 5. What factors affect the cost of a PCB stackup?<\/strong><\/p>\n The cost of a PCB stackup is influenced by several factors, including the number of layers, via requirements, and material selection. More complex stackups typically result in higher costs.<\/p>\n Further Reading<\/strong>\uff1aHow Can You Create Better Vias in PCB Design?<\/a> \u00b7 Signal Integrity Issues in PCB Design<\/a><\/p>","protected":false},"excerpt":{"rendered":" \u5728\u73b0\u4ee3\u7535\u5b50\u8bbe\u5907\u4e2d\uff0cPCB\uff08Printed Circuit Board\uff0c\u5370\u5237\u7535\u8def\u677f\uff09\u626e\u6f14\u7740\u81f3\u5173\u91cd\u8981\u7684\u89d2\u8272\u3002\u5b83\u4eec\u662f […]<\/p>\n","protected":false},"author":1,"featured_media":8459,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"slim_seo":{"title":"Share and explain how to build a multilayer PCB stackup in PCB design","description":"How should a multilayer PCB stackup be designed? Starting with the layered structure\u2014from copper foil and prepreg to the core material\u2014this article explains the layout of power planes and ground planes and how they improve signal integrity and EMI performance."},"_slim_seo_primary_term_category":0,"_slim_seo_primary_term_post_tag":0,"footnotes":""},"categories":[405,26],"tags":[],"class_list":["post-1461","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-pcb-design","category-blog"],"_links":{"self":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/1461","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/comments?post=1461"}],"version-history":[{"count":3,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/1461\/revisions"}],"predecessor-version":[{"id":17729,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/posts\/1461\/revisions\/17729"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media\/8459"}],"wp:attachment":[{"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/media?parent=1461"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/categories?post=1461"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.jingpengpcb.com\/en\/wp-json\/wp\/v2\/tags?post=1461"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}The Different Layers of a Circuit Board<\/h2>\n
1. Metal Foil<\/h3>\n
2. Prepreg<\/h3>\n
3. Copper-Clad Laminate (Core)<\/h3>\n
Power Layers and Ground Planes in a PCB Stack-Up<\/h2>\n
Advantages of Using Power\/Ground Plane<\/h3>\n
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Power Layers and Ground Planes in a PCB Stack-Up<\/h2>\n
Advantages of Using Power\/Ground Plane<\/h3>\n
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What is a PCB stackup?<\/h2>\n
What are the different layers in a circuit board?<\/h2>\n
What is a PCB coating?<\/h2>\n
What is the standard thickness of a PCB?<\/h2>\n
Why are multilayer PCBs needed?<\/h2>\n
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How do you make a multilayer circuit board?<\/h2>\n
Step 1: Selecting a Kernel<\/h3>\n
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Step 2: Cleaning<\/h3>\n
Step 3: Inner-layer imaging<\/h3>\n
Step 4: Etching and Stripping<\/h3>\n
Step 5: Automated Optical Inspection<\/h3>\n
Step 6: Oxide Treatment<\/h3>\n
Step 7: Laminating<\/h3>\n
Step 8: Laminating<\/h3>\n
Step 9: Drilling Holes<\/h3>\n
Step 10: Deburring and Cleaning<\/h3>\n
Step 11: Drilling and Copper Plating<\/h3>\n
HDI Board Stack-Up<\/h2>\n
Sequential Lamination<\/h2>\n
6-layer microporous laminate<\/h2>\n
HDI Stack Terminology<\/h2>\n
PCB Stack-Up Recommendations<\/h2>\n
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Conclusion<\/h2>\n
Frequently Asked Questions<\/h2>\n