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	<title>品质检测与可靠性 &#8211; 敬鹏电子</title>
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	<title>品质检测与可靠性 &#8211; 敬鹏电子</title>
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		<title>What Causes PCB Warping, and How Can It Be Prevented?</title>
		<link>https://www.jingpengpcb.com/en/blog/pcb-deformation-causes-prevention/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Tue, 20 Oct 2026 07:00:00 +0000</pubDate>
				<category><![CDATA[博客]]></category>
		<category><![CDATA[品质检测与可靠性]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=2445</guid>

					<description><![CDATA[PCB电路板在经过回流焊的过程中，常常会面临着板弯板翘的问题，有时候甚至可能导致元件空焊或立碑，这些问题给电子 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/pcb-deformation-causes-prevention/">Source</a></p>]]></description>
		
		
		
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		<item>
		<title>PCB是什么？分类、优势与生产流程全解析</title>
		<link>https://www.jingpengpcb.com/en/blog/pcb-basics-quiz/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Fri, 16 Oct 2026 03:00:00 +0000</pubDate>
				<category><![CDATA[博客]]></category>
		<category><![CDATA[品质检测与可靠性]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=2062</guid>

					<description><![CDATA[1. PCB 到底由什么构成 把一块 PCB 拆开看，它由四类材料层叠而成： 基材（Substrate）：绝缘 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/pcb-basics-quiz/">Source</a></p>]]></description>
		
		
		
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		<item>
		<title>高分辨率PCB制作有哪些技术要求？导线节距与铜厚参数</title>
		<link>https://www.jingpengpcb.com/en/blog/high-resolution-imaging-tech/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Wed, 14 Oct 2026 01:00:00 +0000</pubDate>
				<category><![CDATA[博客]]></category>
		<category><![CDATA[品质检测与可靠性]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1838</guid>

					<description><![CDATA[随着器件的微型化、多功能化和电子封装技术的飞速进展，印制电路板（PCB）的设计和制造正朝着高密度、高精度、高可 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/high-resolution-imaging-tech/">Source</a></p>]]></description>
		
		
		
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		<item>
		<title>高精度电阻PCB制作方法研究</title>
		<link>https://www.jingpengpcb.com/en/blog/high-precision-resistor-pcb/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Fri, 09 Oct 2026 09:00:00 +0000</pubDate>
				<category><![CDATA[博客]]></category>
		<category><![CDATA[品质检测与可靠性]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=2646</guid>

					<description><![CDATA[1. 背景介绍 随着PCB功能化和高性能化的发展，高频高速PCB、高散热PCB、埋阻埋容PCB等高端精细产品已 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/high-precision-resistor-pcb/">Source</a></p>]]></description>
		
		
		
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		<title>What Are the 9 Key Points to Keep in Mind When Testing Circuit Boards? Live Substrates, Soldering Irons, and IC Principles</title>
		<link>https://www.jingpengpcb.com/en/blog/9-basic-pcb-test-tips/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Mon, 05 Oct 2026 05:00:00 +0000</pubDate>
				<category><![CDATA[博客]]></category>
		<category><![CDATA[品质检测与可靠性]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=2315</guid>

					<description><![CDATA[电路板（PCB）在现代电子设备中扮演着至关重要的角色。为了确保产品的质量和性能，检测PCB板时需要注意一些细节 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/9-basic-pcb-test-tips/">Source</a></p>]]></description>
		
		
		
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		<title>PCB和IC有什么区别？线路、介电层、孔与防焊油墨解析</title>
		<link>https://www.jingpengpcb.com/en/blog/pcb-and-ic-full-analysis/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Sun, 04 Oct 2026 04:00:00 +0000</pubDate>
				<category><![CDATA[博客]]></category>
		<category><![CDATA[品质检测与可靠性]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=2306</guid>

					<description><![CDATA[电子世界是由各种各样的组件和技术构成的，而PCB板（Printed Circuit Board，印刷电路板）和 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/pcb-and-ic-full-analysis/">Source</a></p>]]></description>
		
		
		
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		<title>集成电路用电路识图方法判断芯片质量</title>
		<link>https://www.jingpengpcb.com/en/blog/judge-ic-quality-by-schematic/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Sat, 03 Oct 2026 03:00:00 +0000</pubDate>
				<category><![CDATA[博客]]></category>
		<category><![CDATA[品质检测与可靠性]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1908</guid>

					<description><![CDATA[在电子领域，了解如何分析和识别集成电路应用电路是一项重要的技能。这些电路常常不提供详细的内部结构信息，因此需要 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/judge-ic-quality-by-schematic/">Source</a></p>]]></description>
		
		
		
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		<title>What Impurities Affect the Quality of PCB Via Holes? Workshop Environment and Improvement Measures</title>
		<link>https://www.jingpengpcb.com/en/blog/impurities-affecting-small-holes/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Fri, 02 Oct 2026 01:00:00 +0000</pubDate>
				<category><![CDATA[博客]]></category>
		<category><![CDATA[品质检测与可靠性]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1875</guid>

					<description><![CDATA[摘要：这篇文章将讨论PCB加工中小孔质量受影响的杂物来源以及如何改善这些问题。从日常积累的细小杂物对金属孔的控 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/impurities-affecting-small-holes/">Source</a></p>]]></description>
		
		
		
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		<title>焊膏性能如何影响焊接质量？合金粉、焊剂与添加剂的作用</title>
		<link>https://www.jingpengpcb.com/en/blog/solder-paste-impact-on-quality/</link>
		
		<dc:creator><![CDATA[jingpeng]]></dc:creator>
		<pubDate>Wed, 30 Sep 2026 07:00:00 +0000</pubDate>
				<category><![CDATA[博客]]></category>
		<category><![CDATA[品质检测与可靠性]]></category>
		<guid ispermalink="false">https://www.jingpengpcb.com/?p=1894</guid>

					<description><![CDATA[焊膏是电子制造中至关重要的材料之一，它在SMT（表面贴装技术）中扮演着关键角色。焊膏的性能直接影响着焊接质量。 [&#8230;]
<p><a href="https://www.jingpengpcb.com/en/blog/solder-paste-impact-on-quality/">Source</a></p>]]></description>
		
		
		
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